电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HLS328-49TG

产品描述IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
产品类别连接器    插座   
文件大小195KB,共2页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

HLS328-49TG概述

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

HLS328-49TG规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性STANDARD: UL 94V-0, LOW PROFILE
主体宽度0.4 inch
主体深度0.095 inch
主体长度1.4 inch
联系完成配合GOLD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER ALLOY
触点样式RND PIN-SKT
设备插槽类型IC SOCKET
使用的设备类型DIP28
外壳材料POLYETHYLENE
JESD-609代码e0
制造商序列号HLS
插接触点节距0.1 inch
安装方式STRAIGHT
触点数28
最高工作温度260 °C
最低工作温度-60 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.3 mm
端子节距2.54 mm
端接类型SOLDER
Base Number Matches1

文档预览

下载PDF文档
DIP Sockets
Table of Models
Molded DIP Sockets
Closed Frame and Open Frame
Description:
Closed Frame Socket (RDS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.125
(3.18)
Description:
Open Frame Socket (RLS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.050
(1.27)
*
*
.100/(2.54) for 48 and 60 pos.
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
For more information, refer to the Peel-A-Way
®
DIP Sockets pages (30-31).
RDS replaces DS and HDS.
RLS replaces LS and HLS.
.005
(.13)
Polyimide
Film
Features:
• Multiple finger contact on all
sockets assures maximum
reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• To fit .100/(2.54mm) pitch.
• Easily customized to fit your
application.
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
RDS 3
16 - 01
M
G
Contact Plating
RoHS Compliant:
Body Type
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
RDS - Hi-Temp LCP
Closed Frame Molded
RLS - Hi-Temp LCP
Open Frame Molded
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)*
*Open Frame only
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Number of Pins
Closed Frame 8 - 40
Open Frame 8 - 64
(see table on next page for standard pin counts)
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
j2ee想要转行别的开发行业
做了2年的java web 开发,感觉发展不大,钱更是少。每天一是需求分析,编码,修改bug,用户的需求变个没完,增个没完。 技术上没什么高度。很繁琐,但是不难。想做框架,但机会很少。要在公 ......
给我一个大苹果 嵌入式系统
说说多核DSP C6678 SRIO借口调试记录
设计的板子到了SRIO调试阶段了,在板子上,一片V6和两片6678通过4XSRIO互联,中间没有Switch,总算搞定了相互之间的通信。 首先,感谢Ti论坛提供的SRIO程序范例,但是其硬件平台是E ......
fish001 DSP 与 ARM 处理器
二极管型号图
想看到更多的二极管型号,请登陆公司网站:www.hismtek.com 本帖最后由 hismtek 于 2008-7-19 12:02 编辑 ]...
naren 测试/测量
晒WEBENCH设计的过程+输出5V电压1A电流电源适配器方案
小小的电源适配器在我们的生活起到了不可或缺的作用,不管是手机,还是平板都离不开电源适配器。为了使用更方便,不管是110V电压还是220V电压下都可以使用,电源适配器的输入电压要求是100V到22 ......
游乐场 模拟与混合信号
关于模型标幺化的问题
我有两个问题想不明白,哪位前辈指点一下。1)模型作标幺化时,把时间也作了标幺化,在S域作了计算,现在需要离散化,离散化的采样时间是不是也要使用标幺值,还是直接使用有名值。或者有其他处 ......
kata DSP 与 ARM 处理器
ANSYS Designer and Nexxim 8.0.2 Win(x64)共享 and crack file
ANSYS Designer and Nexxim 8.0.2 Win(x64)共享 and crack file https://download.eeworld.com.cn/detail/2524406483/25158...
2524406483 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2237  918  1253  2276  107  30  19  4  46  14 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved