SPICE MODELS: RS3A RS3B RS3D RS3G RS3J RS3K RS3M RS3AB RS3BB RS3DB RS3GB RS3JB RS3KB RS3MB
RS3A/B - RS3M/B
3.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
Features
·
·
·
·
·
·
Glass Passivated Die Construction
Fast Recovery Time for High Efficiency
Low Forward Voltage Drop and High Current
Capability
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Plastic Material: UL Flammability
Classification Rating 94V-0
B
Dim
A
SMB
Min
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
SMC
Min
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
A
C
B
C
D
Mechanical Data
·
·
·
·
·
·
Case: Molded Plastic
Terminals: Solder Plated Terminal -
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Marking: Type Number
SMB Weight: 0.09 grams (approx.)
SMC Weight: 0.20 grams (approx.)
J
D
E
G
H
H
G
E
J
All Dimensions in mm
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Suffix Designates SMC Package
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
@ T
T
= 75°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
(JEDEC Method)
Forward Voltage
Peak Reverse Current
at Rated DC Blocking Voltage
Maximum Recovery Time (Note 3)
Typical Junction Capacitance (Note 2)
Typical Thermal Resistance Junction to Terminal (Note 1)
Operating and Storage Temperature Range
@ I
F
= 3.0A
@ T
A
= 25°C
@ TA = 125°C
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
RM
t
rr
C
j
R
qJT
T
j,
T
STG
RS3
A/AB
50
35
@ T
A
= 25°C unless otherwise specified
RS3
B/BB
100
70
RS3
D/DB
200
140
RS3
G/GB
400
280
3.0
100
1.3
5.0
250
RS3
J/JB
600
420
RS3
K/KB
800
560
RS3
M/MB
1000
700
Unit
V
V
A
A
V
mA
150
50
25
-65 to +150
250
500
ns
pF
K/W
°C
Notes:
1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Reverse recovery test conditions: I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
DS15005 Rev. E-2
1 of 2
www.diodes.com
RS3A/B - RS3M/B
ã
Diodes Incorporated
2.5
I
F,
INSTANTANEOUS FORWARD CURRENT (A)
3.0
10
I
(AV)
, AVERAGE FORWARD CURRENT (A)
2.0
1.0
1.5
1.0
0.1
0.5
T
j
= 25°C
0
25
50
75
100
125
150
175
0.01
0
0.4
0.8
1.2
1.6
T
T
, TERMINAL TEMPERATURE (°C)
Fig. 1 Forward Current Derating Curve
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
Single Half-Sine-Wave
(JEDEC Method)
1000
T
j
= 125°C
100
100
80
60
10
40
1.0
T
j
= 25°C
20
0
1
10
100
0.1
0
20
40
60
80
100
120
140
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Forward Surge Current Derating Curve
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 4 Typical Reverse Characteristics
t
rr
+0.5A
Device
Under
Test
(-)
Pulse
Generator
(Note 2)
0A
(+)
50V DC
Approx
-0.25A
(-)
Oscilloscope
(Note 1)
(+)
-1.0A
Set time base for 50/100 ns/cm
Fig. 5 Reverse Recovery Time Characteristic and Test Circuit
DS15005 Rev. E-2
2 of 2
www.diodes.com
RS3A/B - RS3M/B
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