100K SERIES, 5 2-INPUT XOR/XNOR GATE, CDIP24, CERDIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP24,.4 |
| Reach Compliance Code | unknown |
| 系列 | 100K |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | XOR/XNOR GATE |
| 功能数量 | 5 |
| 输入次数 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | -4.5 V |
| 最大电源电流（ICC） | 75 mA |
| Prop。Delay @ Nom-Sup | 2.4 ns |
| 传播延迟（tpd） | 2.8 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.72 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| 5962-9459001MXA | 5962-9459001VYA | 5962-9459001VXA | 5962-9459001MYA | 100307DMQB | 3VH44/9CND12(095) | |
|---|---|---|---|---|---|---|
| 描述 | 100K SERIES, 5 2-INPUT XOR/XNOR GATE, CDIP24, CERDIP-24 | 100K SERIES, 5 2-INPUT XOR/XNOR GATE, CQFP24, CERQUAD-24 | 100K SERIES, 5 2-INPUT XOR/XNOR GATE, CDIP24, CERDIP-24 | 100K SERIES, 5 2-INPUT XOR/XNOR GATE, CQFP24, CERQUAD-24 | 100K SERIES, 5 2-INPUT XOR/XNOR GATE, CDIP24, CERDIP-24 | EDGE CONNECTOR,PCB MNT,RECEPT,88 CONTACTS,0.125 PITCH,WRAP POST TERMINAL |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -65 °C |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 3.175 mm |
| 包装说明 | DIP, DIP24,.4 | QFF, QFL24,.4SQ | DIP, DIP24,.4 | QFF, QFL24,.4SQ | DIP, DIP24,.4 | - |
| 系列 | 100K | 100K | 100K | 100K | 100K | - |
| JESD-30 代码 | R-GDIP-T24 | S-GQFP-F24 | R-GDIP-T24 | S-GQFP-F24 | R-GDIP-T24 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
| 逻辑集成电路类型 | XOR/XNOR GATE | XOR/XNOR GATE | XOR/XNOR GATE | XOR/XNOR GATE | XOR/XNOR GATE | - |
| 功能数量 | 5 | 5 | 5 | 5 | 5 | - |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DIP | QFF | DIP | QFF | DIP | - |
| 封装等效代码 | DIP24,.4 | QFL24,.4SQ | DIP24,.4 | QFL24,.4SQ | DIP24,.4 | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | - |
| 电源 | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | - |
| 最大电源电流（ICC） | 75 mA | 75 mA | 75 mA | 75 mA | 75 mA | - |
| Prop。Delay @ Nom-Sup | 2.4 ns | - | 2.4 ns | 2.4 ns | 2.4 ns | - |
| 传播延迟（tpd） | 2.8 ns | 2.8 ns | 2.8 ns | 2.8 ns | 2.8 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 施密特触发器 | NO | NO | NO | NO | NO | - |
| 筛选级别 | MIL-STD-883 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-STD-883 | MIL-STD-883 Class B | - |
| 座面最大高度 | 5.72 mm | 2.159 mm | 5.72 mm | 2.159 mm | 5.72 mm | - |
| 表面贴装 | NO | YES | NO | YES | NO | - |
| 技术 | ECL | ECL | ECL | ECL | ECL | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | - |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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