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PIC32MZ1024ECE064-E/MR

产品描述MICROCONTROLLER
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小12MB,共658页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载文档 详细参数 全文预览

PIC32MZ1024ECE064-E/MR概述

MICROCONTROLLER

PIC32MZ1024ECE064-E/MR规格参数

参数名称属性值
Objectid1358856942
包装说明QFN-64
Reach Compliance Codecompliant
Country Of OriginThailand
ECCN代码3A991.A.2
YTEOL8.38
具有ADCYES
地址总线宽度
位大小32
边界扫描YES
CPU系列PIC32
最大时钟频率64 MHz
DAC 通道NO
DMA 通道YES
外部数据总线宽度
JESD-30 代码S-PQCC-N64
长度9 mm
I/O 线路数量46
端子数量64
片上程序ROM宽度8
最高工作温度125 °C
最低工作温度-40 °C
PWM 通道YES
封装主体材料PLASTIC/EPOXY
封装代码HVQCCN
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
ROM(单词)1048576
ROM可编程性FLASH
筛选级别AEC-Q100; TS 16949
座面最大高度1 mm
速度180 MHz
最大供电电压3.6 V
最小供电电压2.3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
宽度9 mm
uPs/uCs/外围集成电路类型MICROCONTROLLER, RISC

文档预览

下载PDF文档
PIC32MZ Embedded
Connectivity (EC) Family
32-bit MCUs (up to 2 MB Live-Update Flash and 512 KB SRAM) with
Audio and Graphics Interfaces, HS USB, Ethernet, and Advanced Analog
Operating Conditions
• 2.3V to 3.6V, -40ºC to +85ºC, DC to 200 MHz
• 2.3V to 3.6V, -40ºC to +105ºC, DC to 180 MHz
• 2.3V to 3.6V, -40ºC to +125ºC (Planned)
Advanced Analog Features
10-bit ADC resolution and up to 48 analog inputs
Flexible and independent ADC trigger sources
Two comparators with 32 programmable voltage references
Temperature sensor with ±2ºC accuracy
Core: 200 MHz (up to 330 DMIPS) microAptiv™
16 KB I-Cache, 4 KB D-Cache
MMU for optimum embedded OS execution
microMIPS™ mode for up to 35% smaller code size
DSP-enhanced core:
- Four 64-bit accumulators
- Single-cycle MAC, saturating and fractional math
• Code-efficient (C and Assembly) architecture
Communication Interfaces
• Two CAN modules (with dedicated DMA channels):
- 2.0B Active with DeviceNet™ addressing support
• Six UART modules (25 Mbps):
- Supports LIN 1.2 and IrDA
®
protocols
• Six 4-wire SPI modules
• SQI configurable as an additional SPI module (50 MHz)
• Five I
2
C modules (up to 1 Mbaud) with SMBus support
• Parallel Master Port (PMP)
• Peripheral Pin Select (PPS) to enable function remap
Clock Management
0.9% internal oscillator
Programmable PLLs and oscillator clock sources
Fail-Safe Clock Monitor (FSCM)
Independent Watchdog Timers (WDT) and Deadman
Timer (DMT)
• Fast wake-up and start-up
Timers/Output Compare/Input Capture
Nine 16-bit or up to four 32-bit timers/counters
Nine Output Compare (OC) modules
Nine Input Capture (IC) modules
PPS to enable function remap
Real-Time Clock and Calendar (RTCC) module
Power Management
• Low-power modes (Sleep and Idle)
• Integrated Power-on Reset and Brown-out Reset
Input/Output
• 5V-tolerant pins with up to 32 mA source/sink
• Selectable open drain, pull-ups, and pull-downs
• External interrupts on all I/O pins
Memory Interfaces
• 50 MHz External Bus Interface (EBI)
• 50 MHz Serial Quad Interface (SQI)
Audio and Graphics Interfaces
Graphics interfaces: EBI or PMP
Audio data communication: I
2
S, LJ, and RJ
Audio control interfaces: SPI and I
2
C™
Audio master clock: Fractional clock frequencies with USB
synchronization
Qualification and Class B Support
AEC-Q100 REVG (Grade 2 -40ºC to +105ºC) Planned
AEC-Q100 REVG (Grade 1 -40ºC to +125ºC) Planned
Class B Safety Library, IEC 60730
Back-up internal oscillator
Debugger Development Support
In-circuit and in-application programming
4-wire MIPS
®
Enhanced JTAG interface
Unlimited software and 12 complex breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Non-intrusive hardware-based instruction trace
High-Speed (HS) Communication Interfaces
(with Dedicated DMA)
• USB 2.0-compliant Hi-Speed On-The-Go (OTG) controller
• 10/100 Mbps Ethernet MAC with MII and RMII interface
Security Features
• Crypto Engine with a RNG for data encryption/decryption
and authentication (AES, 3DES, SHA, MD5, and HMAC)
• Advanced memory protection:
- Peripheral and memory region access control
Software and Tools Support
C/C++ compiler with native DSP/fractional support
MPLAB
®
Harmony Integrated Software Framework
TCP/IP, USB, Graphics, and mTouch™ middleware
MFi, Android™, and Bluetooth
®
audio frameworks
FreeRTOS™, OPENRTOS
®
, µC/OS™, and other popular
RTOS kernels
Direct Memory Access (DMA)
• Eight channels with automatic data size detection
• Programmable Cyclic Redundancy Check (CRC)
Packages
Type
Pin Count
I/O Pins (up to)
Contact/Lead Pitch
Dimensions
QFN
64
53
0.50 mm
9x9x0.9 mm
64
53
0.50 mm
10x10x1 mm
TQFP
100
78
0.40 mm
12x12x1 mm
0.50 mm
14x14x1 mm
144
120
0.40 mm
16x16x1 mm
VTLA
124
98
0.50 mm
9x9x0.9 mm
LQFP
144
120
0.50 mm
20x20x1.40 mm
2013-2014 Microchip Technology Inc.
Preliminary
DS60001191C-page 1
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