Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> BXM80536GC1500F

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BXM80536GC1500F: 产品描述RISC Microprocessor, 64-Bit, 1500MHz, CMOS, CPGA478; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共84页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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BXM80536GC1500F概述

RISC Microprocessor, 64-Bit, 1500MHz, CMOS, CPGA478

BXM80536GC1500F规格参数

参数名称	属性值
是否Rohs认证	符合
Objectid	2032949064
包装说明	SPGA, PGA478,26X26,50
Reach Compliance Code	unknown
ECCN代码	3A991.A.2
YTEOL	0
位大小	64
JESD-30 代码	S-XPGA-P478
端子数量	478
封装主体材料	CERAMIC
封装代码	SPGA
封装等效代码	PGA478,26X26,50
封装形状	SQUARE
封装形式	GRID ARRAY, SHRINK PITCH
认证状态	Not Qualified
速度	1500 MHz
最大压摆率	21000 mA
标称供电电压	1.3 V
表面贴装	NO
技术	CMOS
端子形式	PIN/PEG
端子节距	1.27 mm
端子位置	PERPENDICULAR
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC

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Intel

Pentium

M Processor on

90 nm Process with 2-MB L2

Cache

Datasheet

January 2006

Document Number: 302189-008

IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

M processor on 90 nm process with 2-MB L2 cache may contain design defects or errors known as errata which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. See www.intel.com/products/processor_number for details.

Intel, Pentium, Celeron, MMX, Intel SpeedStep and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the

United States and other countries.

*Other names and brands may be claimed as the property of others.

Intel

Datasheet

Contents

Introduction....................................................................................................................................

1.1

1.2

2.1

Terminology .......................................................................................................................... 9

References ........................................................................................................................... 9

Clock Control and Low Power States ................................................................................. 11

2.1.1 Normal State .......................................................................................................... 11

2.1.2 AutoHALT Power-Down State ............................................................................... 11

2.1.3 Stop-Grant State .................................................................................................... 12

2.1.4 HALT/Grant Snoop State ....................................................................................... 12

2.1.5 Sleep State ............................................................................................................ 13

2.1.6 Deep Sleep State................................................................................................... 13

2.1.7 Deeper Sleep State ............................................................................................... 14

Enhanced Intel SpeedStep

Technology ........................................................................... 14

Front Side Bus Low Power Enhancements ........................................................................ 15

Processor Power Status Indicator (PSI#) Signal ................................................................ 15

Power and Ground Pins...................................................................................................... 17

3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 17

Voltage Identification .......................................................................................................... 17

Catastrophic Thermal Protection ........................................................................................ 18

Signal Terminations and Unused Pins................................................................................ 19

FSB Frequency Select Signals (BSEL[1:0]) ....................................................................... 19

FSB Signal Groups ............................................................................................................. 19

CMOS Signals .................................................................................................................... 20

Maximum Ratings ............................................................................................................... 21

Processor DC Specifications ..............................................................................................21

Processor Pinout and Pin List............................................................................................. 54

Alphabetical Signals Reference .......................................................................................... 70

Thermal Specifications ....................................................................................................... 80

5.1.1 Thermal Diode ....................................................................................................... 80

5.1.2 Thermal Diode Offset............................................................................................. 81

5.1.3 Intel

Thermal Monitor........................................................................................... 82

Low Power Features....................................................................................................................

2.2

2.3

2.4

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

5.1

Electrical Specifications

............................................................................................................. 17

Package Mechanical Specifications and Pin Information

....................................................... 47

Thermal Specifications and Design Considerations................................................................

Datasheet

Figures

2-1 Clock Control States................................................................................................................... 11

3-1 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#A)............................ 31

3-2 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#A) ................... 32

3-3 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#B)............................ 33

3-4 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#B) ................... 34

3-5 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#C) ........................... 35

3-6 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#C) ................... 36

3-7 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#D) ........................... 37

3-8 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#D) ................... 38

3-9 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#E)............................ 39

3-10 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#E) ................... 40

3-11 Active VCC and ICC Load Line .................................................................................................. 43

3-12 Deep Sleep VCC and ICC Load Line ......................................................................................... 44

4-1 Micro-FCPGA Package Top and Bottom Isometric Views ......................................................... 47

4-2 Micro-FCPGA Package - Top and Side Views ........................................................................... 48

4-3 Micro-FCPGA Package - Bottom View ....................................................................................... 49

4-4 Micro-FCBGA Package Top and Bottom Isometric Views ......................................................... 51

4-5 Micro-FCBGA Package Top and Side Views ............................................................................. 52

4-6 Micro-FCBGA Package Bottom View ......................................................................................... 54

4-7 The Coordinates of the Processor Pins as Viewed from the Top of the Package ...................... 55

Datasheet

Tables

1-1 References ................................................................................................................................... 9

3-1 Voltage Identification Definition .................................................................................................. 18

3-2 FSB Pin Groups.......................................................................................................................... 20

3-3 Processor DC Absolute Maximum Ratings................................................................................. 21

3-4 Voltage and Current Specifications - Standard Voltage Processors .......................................... 22

3-5 Voltage and Current Specifications - Low Voltage Processors .................................................. 24

3-6 Voltage and Current Specifications - Ultra Low Voltage Processors.......................................... 26

3-7 Voltage and Current Specifications (Continued)......................................................................... 28

3-8 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#A ........................ 31

3-9 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#A ............... 32

3-10 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#B ........................ 33

3-11 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#B ............... 34

3-12 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#C ........................ 35

3-13 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#C ............... 36

3-14 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#D ........................ 37

3-15 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#D ............... 38

3-16 Voltage Tolerances for the Intel

Pentium

M Processor (Active State) VID#E ........................ 39

3-17 Voltage Tolerances for the Intel

Pentium

M Processor (Deep Sleep State) VID#E ............... 40

3-18 Voltage Tolerances for the Intel

Pentium

M Processor LV (Active State) .............................. 41

3-19 Voltage Tolerances for the Intel

Pentium

M Processor LV (Deep Sleep State) ..................... 42

3-20 Voltage Tolerances for the Intel

Pentium

M Processor ULV (Active State)............................ 42

3-21 Voltage Tolerances for the Intel

Pentium

M Processor ULV (Deep Sleep State)................... 43

3-22 FSB Differential BCLK Specifications ......................................................................................... 44

3-23 AGTL+ Signal Group DC Specifications ..................................................................................... 45

3-24 CMOS Signal Group DC Specifications...................................................................................... 45

3-25 Open Drain Signal Group DC Specifications .............................................................................. 46

4-1 Micro-FCPGA Package Dimensions........................................................................................... 50

4-2 Micro-FCBGA Package Dimensions........................................................................................... 53

4-3 Pin Listing by Pin Name.............................................................................................................. 57

4-4 Pin Listing by Pin Number .......................................................................................................... 63

4-5 Signal Description....................................................................................................................... 70

5-1 Power Specifications for the Intel

Pentium M Processor .......................................................... 78

5-2 Thermal Diode Interface ............................................................................................................. 81

5-3 Thermal Diode Specification....................................................................................................... 81

Datasheet

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我国锂电池实现新突破，能量密度提高2—3倍！

据新华社、天津大学官网等报道，近日，我国科研人员突破现有传统锂离子电池在能量密度和应用性能上的瓶颈，研制出了能量密度超过600瓦时/公斤的软包电芯和480瓦时/公斤的模组电池，其性能指标比现有锂离子电池的能量密度和续航能力直接提高了2—3倍！具体看来，天津大学的胡文彬教授、韩晓鹏教授团队在超高能量密度二次电池材料与器件领域取得突破性进展。他们借助人工智能与分子筛选，大幅缩短电解液研发周期，...[详细]

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