IC DUAL LINE RECEIVER, CDIP14, CERAMIC, DIP-14, Line Driver or Receiver
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
包装说明 | CERAMIC, DIP-14 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
差分输出 | NO |
驱动器位数 | 1 |
输入特性 | DIFFERENTIAL |
接口集成电路类型 | LINE RECEIVER |
接口标准 | GENERAL PURPOSE |
JESD-30 代码 | R-GDIP-T14 |
JESD-609代码 | e0 |
长度 | 19.43 mm |
标称负供电电压 | -5 V |
功能数量 | 2 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最大输出低电流 | 0.016 A |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-5 V |
认证状态 | Not Qualified |
最大接收延迟 | 25 ns |
接收器位数 | 1 |
筛选级别 | MIL-STD-883 Class B |
座面最大高度 | 5.08 mm |
最大压摆率 | 30 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
电源电压1-最大 | -5.5 V |
电源电压1-分钟 | -4.5 V |
电源电压1-Nom | -5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
DS55108J/883B | DS55108J/883 | DS75108N/B+ | DS75208J/A+ | DS75208N/A+ | DS75208N/B+ | |
---|---|---|---|---|---|---|
描述 | IC DUAL LINE RECEIVER, CDIP14, CERAMIC, DIP-14, Line Driver or Receiver | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,PLASTIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,PLASTIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-GDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
标称负供电电压 | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最大输出低电流 | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
最大接收延迟 | 25 ns | 25 ns | 25 ns | 35 ns | 35 ns | 35 ns |
最大压摆率 | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | TTL | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
Is Samacsys | - | - | N | N | N | N |
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