low-voltage, low ron, dual spst analog switch
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Vishay(威世) |
| 零件包装代码 | SOT-23 |
| 包装说明 | LSSOP, TSSOP8,.1 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 2.9 mm |
| 正常位置 | NO/NC |
| 信道数量 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 标称断态隔离度 | 61 dB |
| 通态电阻匹配规范 | 0.3 Ω |
| 最大通态电阻 (Ron) | 6 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSSOP8,.1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 最长断开时间 | 35 ns |
| 最长接通时间 | 40 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 1.65 mm |
| DG2039DS | DG2037 | DG2037_08 | DG2037DQ | DG2037DS | DG2038DQ | DG2038DS | DG2039DQ | |
|---|---|---|---|---|---|---|---|---|
| 描述 | low-voltage, low ron, dual spst analog switch | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8 | low-voltage, low ron, dual spst analog switch | low-voltage, low ron, dual spst analog switch | low-voltage, low ron, dual spst analog switch | low-voltage, low ron, dual spst analog switch | low-voltage, low ron, dual spst analog switch |
| 是否无铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Vishay(威世) | - | - | Vishay(威世) | - | Vishay(威世) | Vishay(威世) | Vishay(威世) |
| 零件包装代码 | SOT-23 | - | - | MSOP | SOT-23 | MSOP | SOT-23 | MSOP |
| 包装说明 | LSSOP, TSSOP8,.1 | - | - | TSSOP, TSSOP8,.19 | LSSOP, TSSOP8,.1 | TSSOP, TSSOP8,.19 | LSSOP, TSSOP8,.1 | TSSOP, TSSOP8,.19 |
| 针数 | 8 | - | - | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | - | - | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPST | - | - | - | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G8 | - | - | - | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e0 | - | - | - | e0 | e0 | e0 | e0 |
| 长度 | 2.9 mm | - | - | - | 2.9 mm | 3 mm | 2.9 mm | 3 mm |
| 正常位置 | NO/NC | - | - | - | NO | NC | NC | NO/NC |
| 信道数量 | 1 | - | - | - | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | - | - | - | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | - | - | - | 8 | 8 | 8 | 8 |
| 标称断态隔离度 | 61 dB | - | - | - | 61 dB | 61 dB | 61 dB | 61 dB |
| 通态电阻匹配规范 | 0.3 Ω | - | - | - | 0.3 Ω | 0.3 Ω | 0.3 Ω | 0.3 Ω |
| 最大通态电阻 (Ron) | 6 Ω | - | - | - | 6 Ω | 6 Ω | 6 Ω | 6 Ω |
| 最高工作温度 | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | - | - | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | - | - | - | LSSOP | TSSOP | LSSOP | TSSOP |
| 封装等效代码 | TSSOP8,.1 | - | - | - | TSSOP8,.1 | TSSOP8,.19 | TSSOP8,.1 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR | - | - | - | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | - | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | - | - | - | 240 | 240 | 240 | 240 |
| 电源 | 3/5 V | - | - | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.45 mm | - | - | - | 1.45 mm | 1.1 mm | 1.45 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | - | - | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 3 V | - | - | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | - | - | YES | YES | YES | YES |
| 最长断开时间 | 35 ns | - | - | - | 35 ns | 35 ns | 35 ns | 35 ns |
| 最长接通时间 | 40 ns | - | - | - | 40 ns | 40 ns | 40 ns | 40 ns |
| 切换 | BREAK-BEFORE-MAKE | - | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | - | - | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | - | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | - | - | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | - | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | - | - | 30 | 30 | 30 | 30 |
| 宽度 | 1.65 mm | - | - | - | 1.65 mm | 3 mm | 1.65 mm | 3 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
