4 Megabit (256 K x 16-bit) cmos eprom
| Am27C4096-95DE | Am27C4096-95DIB | Am27C4096-95DC | Am27C4096-95DCB | Am27C4096-95DEB | Am27C4096-95DI | |
|---|---|---|---|---|---|---|
| 描述 | 4 Megabit (256 K x 16-bit) cmos eprom | 4 Megabit (256 K x 16-bit) cmos eprom | 4 Megabit (256 K x 16-bit) cmos eprom | 4 Megabit (256 K x 16-bit) cmos eprom | 4 Megabit (256 K x 16-bit) cmos eprom | 4 Megabit (256 K x 16-bit) cmos eprom |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 零件包装代码 | - | DIP | DIP | DIP | - | DIP |
| 包装说明 | - | WDIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | - | WDIP, DIP40,.6 |
| 针数 | - | 40 | 40 | 40 | - | 40 |
| Reach Compliance Code | - | unknown | unknown | unknown | - | unknown |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 最长访问时间 | - | 90 ns | 90 ns | 90 ns | - | 90 ns |
| I/O 类型 | - | COMMON | COMMON | COMMON | - | COMMON |
| JESD-30 代码 | - | R-GDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | - | R-GDIP-T40 |
| JESD-609代码 | - | e0 | e0 | e0 | - | e0 |
| 内存密度 | - | 4194304 bit | 4194304 bit | 4194304 bit | - | 4194304 bit |
| 内存集成电路类型 | - | UVPROM | UVPROM | UVPROM | - | UVPROM |
| 内存宽度 | - | 16 | 16 | 16 | - | 16 |
| 功能数量 | - | 1 | 1 | 1 | - | 1 |
| 端子数量 | - | 40 | 40 | 40 | - | 40 |
| 字数 | - | 262144 words | 262144 words | 262144 words | - | 262144 words |
| 字数代码 | - | 256000 | 256000 | 256000 | - | 256000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 最高工作温度 | - | 85 °C | 70 °C | 70 °C | - | 85 °C |
| 组织 | - | 256KX16 | 256KX16 | 256KX16 | - | 256KX16 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED |
| 封装代码 | - | WDIP | DIP | DIP | - | WDIP |
| 封装等效代码 | - | DIP40,.6 | DIP40,.6 | DIP40,.6 | - | DIP40,.6 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | IN-LINE, WINDOW | IN-LINE | IN-LINE | - | IN-LINE, WINDOW |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 最大待机电流 | - | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A |
| 最大压摆率 | - | 0.05 mA | 0.05 mA | 0.05 mA | - | 0.05 mA |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.25 V | 5.25 V | - | 5.25 V |
| 最小供电电压 (Vsup) | - | 4.75 V | 4.75 V | 4.75 V | - | 4.75 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | - | NO | NO | NO | - | NO |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | - | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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