HPND-0002
Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits
Data Sheet
Description
These PIN/NIP diode chips are specifically designed for
hybrid applications requiring thermosonic or thermo-
compression bonding techniques. The top metallization
is a layer of gold for a tarnish free surface that allows ei-
ther thermosonic or thermocompression bonding tech-
niques. The bottom metallization is also gold, suitable
for epoxy or eutectic die attach method.
Features
•
Thermocompression/Thermosonically Bondable
•
Ideal for Hybrid Integrated Circuits
•
Gold Metallization
•
Silicon Nitride Passivation
•
Uniform Electrical Characteristics
•
Batch Matched Versions Available
•
Planar Construction
Applications
These small signal, general purpose PIN/NIP diode chips
are optimized for various analog and digital applications
such as switches, digital phase shifters, pulse and ampli-
tude modulators, limiters, leveling, and attenuating.
Maximum Ratings
Junction Operating and Storage Temperature Range:
-65°C to +150°C
T
A
= 25°C
PD Power Dissipation: 250 mW
(Measured in an infinite heat sink derated linearly to
zero at 150°C.)
Operation in excess of any one of these conditions may
result in permanent damage to this device.
HPND-0002 Chip Dimensions
D
X
X
Y
DIMENSIONS
D
(0.03) (1)
X
(0.05) (2)
Y
(0.03) (1)
TOP CONTACT
BOTTOM
CONTACT
FOR EPOXY OR
EUTECTIC DIE
ATTACH PART NO.
HPND-0002
0.20
(8)
0.38
(15)
0.20
(8)
CATHODE
ANODE
DIMENSIONS IN MILLIMETERS
(1/1000 INCH).
Electrical Specifications at T
A
= 25°C
Chip for
Epoxy or
Eutectic
Die Attach
HPND-
0002
Test
Conditions
Nearest
Equivalent
Surface Mount
Part No.
HSMP-
3810
Nearest
Equivalent
Axial Lead
Part No.
5082-
3081
Typical Parameters
Minimum
Breakdown
Voltage
V
BR
(V)
100
V
R
= V
BR
Measure
I
R
≤
10
µA
Maximum
Capacitance
C
j
(pF)
0.20
V
R
= 50 V
f = 1.0 MHz
Series
Resistance
R
S
(
Ω)
3.5
I
F
= 100 mA
f = 100MHz
Typical
Carrier
Lifetime
τ
(ns)
1500
I
F
= 50 mA
I
R
= 250 mA
Typical Reverse
Recovery
Time
τ
rr
(ns)
300
I
F
= 20 mA
V
R
= 10 V
90% Recovery
Assembly and Handling
Procedures for PIN Chips:
3. Die Attach
a. Eutectic
Eutectic die attach can be accomplished by “scrub-
bing” the die with/without a preform on the header
to combine with the silicon in the die. Temperature is
approximately 400°C, with heating times of 5-10 sec-
onds. (Note–times and temperature utilized may vary
depending on the type, composition, and heat capacity
of the header or substrate used.) This method is recom-
mended for HPND-0002.
1. Storage
Devices should be stored in a dry nitrogen purged des-
sicator or equivalent.
2. Cleaning
If required, surface contamination may be removed
with electronic grade solvents. Typical solvents, such
as freon (T.F. or T.M.C.), acetone, deionized water, and
methanol, or their locally approved equivalents, can
be used singularly or in combinations. Typical cleaning
times per solvent are one to three minutes. DI water
and methanol should be used (in that order) in the final
cleans. Final drying can be accomplished by placing the
cleaned dice on clean filter paper and drying with an in-
frared lamp for 5-10 minutes. Acids such as hydrofluoric
(HF), nitric (HNO
3
), and hydrochloric (HCl) should not be
used.
The effects of cleaning methods/ solutions should be
verified on small samples prior to submitting the en-
tire lot. Following cleaning, dice should be either used
in assembly (typically within a few hours) or stored in
clean containers in a reducing atmosphere or a vacuum
chamber.
b. Epoxy
For epoxy die-attach, conductive silver-filled epoxies are
recommended. This method can be used for all Avago
Technologies’ PIN chips.
4. Wire Bonding
Either ultrasonic, thermosonic or thermocompression
bonding techniques can be employed. Suggested wire
is pure gold, 0.7 to 1.5 mil diameter.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5965-9143E
AV01-0640EN - November 28, 2006
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