MAXIMUM
solutions
MILL-MAX RECEPTACLES WITH
ORGANIC FIBRE PLUG
™
SOLDER BARRIER
Mill-Max’s knock-out-bottom receptacles are discrete sockets for soldering into printed circuit boards. Six
sizes are now available:
Mill-Max
Incorporates
Range of
Recommended
Receptacle #
Contact #
Pin Acceptance Mounting Hole
10
Ø.012 - .017”
Ø.043 ±.003”
5359
30
Ø.015 - .025”
Ø.057 ±.003”
4015
16
Ø.022 - .034”
Ø.067 ±.003”
4280
34
Ø.032 - .046”
Ø.077 ±.003”
0379
02
Ø.040 - .050”
Ø.083 ±.003”
9873
23
Ø.045 - .065”
Ø.103 ±.003”
5364
#0379
#4015 & #9873
FEATURES:
• Designed for hand, wave or reflow* soldering. The
ORGANIC FIBRE PLUG™
barrier prevents solder,
paste or flux from contaminating the spring contact.
• After soldering, the
OFP™
barrier is knocked out of the receptacle when the device is plugged in.
• The thru-hole receptacle design permits the component lead to pass through and make connection with
another circuit board.
• All Mill-Max receptacles use a precision machined brass housing with a press-fit beryllium copper “multi-
finger” contact (heat-treated BeCu is the best electrical spring contact material).
• All parts are available as discrete receptacles; #4015, #4280, #5364 & #9873 can also be supplied on
carrier tape per EIA-481 for industry standard pick and place machines.
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow sol-
dering process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been
screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components.
Solder will fill the plated-thru-holes and achieve solder joints as reliable as wave soldering. The OFP™ barrier prevents
solder paste from being picked-up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder
mask can be used to adjust the volume of paste required to fill each hole.
(10/03-529, 535)
R
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771-0300
516-922-6000 • Fax: 516-922-9253
e-mail: techserv@mill-max.com or
sales@mill-max.com
www.mill-max.com
Maximum Interconnect Solutions
.048 DIA.
.038 DIA.
.010
.060
.071
.090 DIA.
.072 DIA.
.018
.125
.206
.028 DIA.
.009
.064 DIA.
.009
5359-0-43-XX-10-XX-10-0
With OFP™ solder barrier
Solder mount in .040 min.
mounting hole.
.068 DIA.
.052 DIA.
.020
.089 .100
0379-0-43-XX-34-XX-10-0
With OFP™ solder barrier
Solder mount in .075 min.
mounting hole.
.043 DIA.
.009
Also available on 8mm wide carrier tape,
5,500 parts per 13” reel.
Order as: S740-XX-001-00-150000
4015-0-43-XX-30-XX-10-0
With OFP™ solder barrier
Solder mount in .054 min.
mounting hole.
.078 DIA.
.062 DIA.
.020
.089
.100
.056 DIA.
.051 DIA.
.009
Also available on 8mm wide carrier tape,
5,500 parts per 13” reel.
Order as: S742-XX-001-00-800000
4280-0-43-XX-16-XX-10-0
With OFP™ solder barrier
Solder mount in .064 min.
mounting hole.
.100 DIA.
.078 DIA.
.030
.093
.125
.068 DIA.
.009
Also available on 12mm wide carrier tape,
4,500 parts per 13” reel.
Order as: S798-XX-001-00-730000
9873-0-43-XX-02-XX-10-0
With OFP™ solder barrier
Solder mount in .080 min.
mounting hole.
.120 DIA.
.098 DIA.
.075 DIA.
.067 DIA.
.110
.018 .125
.150
Also available on 12mm wide carrier tape,
2,000 parts per 13” reel.
Order as: S753-XX-001-00-640000
.009
5364-0-43-XX-23-XX-10-0
With OFP™ solder barrier
Solder mount in .100 min.
mounting hole.
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