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5962-9951401NXB

产品描述qpro series configuration proms (XQ) including radiation-hardened series (xqr)
产品类别存储    存储   
文件大小85KB,共11页
制造商XILINX(赛灵思)
官网地址https://www.xilinx.com/
下载文档 详细参数 选型对比 全文预览

5962-9951401NXB概述

qpro series configuration proms (XQ) including radiation-hardened series (xqr)

5962-9951401NXB规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码SOIC
包装说明SOP, SOP20,.4
针数20
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最大时钟频率 (fCLK)15 MHz
I/O 类型COMMON
JESD-30 代码R-PDSO-G20
JESD-609代码e0
长度12.8 mm
内存密度1048576 bit
内存集成电路类型CONFIGURATION MEMORY
内存宽度1
功能数量1
端子数量20
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织1MX1
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP20,.4
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
认证状态Not Qualified
筛选级别MIL-PRF-38535 Class N
座面最大高度2.65 mm
最大待机电流0.00005 A
最大压摆率0.01 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.5 mm
Base Number Matches1

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0
R
QPro Series Configuration PROMs
(XQ) including
Radiation-Hardened Series (XQR)
2
DS062 (v3.1) November 5, 2001
0
Preliminary Product Specification
Features
XQ1701L/XQR1701L
QML Certified
Configuration one-time programmable (OTP) read-only
memory designed to store configuration bitstreams of
Xilinx FPGA devices
Simple interface to the FPGA; requires only one user
I/O pin
Cascadable for storing longer or multiple bitstreams
Programmable reset polarity (active High or active
Low) for compatibility with different FPGA solutions
Supports XQ4000XL/Virtex fast configuration mode
(15.0 MHz)
Available in 44-pin ceramic LCC (M grade) package
Available in 20-pin SOIC package (XQ1701L only)
Programming support by leading programmer
manufacturers.
Design support using the Xilinx Allianc™ and
Foundation™ series software packages.
XQR1701L (only)
Fabricated on Epitaxial Silicon to improve latch
performance (parts are immune to Single Event
Latch-up)
Single Event Bit Upset immune
Total Dose tolerance in excess of 50 krad(Si)
All lots subjected to TID Lot Qualification in accordance
with method 1019 (dose rate ~9.0 rad(Si)/sec)
XQ1701L (only)
Also available under the following Standard Microcircuit
Drawing (SMD): 5962-9951401. For more information
contact hte Defense Supply Center Columbus (DSCC):
http://www.dscc.dla.mil/Programs/Smcr/
Description
The QPro™ series XQ1701L are Xilinx 3.3V high-density
configuration PROMs. The XQR1701L are radiation hard-
ened. These devices are manufactured on Xilinx QML certi-
fied manufacturing lines utilizing epitaxial substrates and
TID lot qualification (per method 1019).
When the FPGA is in Master Serial mode, it generates a
configuration clock that drives the PROM. A short access
time after the rising clock edge, data appears on the PROM
DATA output pin that is connected to the FPGA D
IN
pin. The
FPGA generates the appropriate number of clock pulses to
complete the configuration. Once configured, it disables the
PROM. When the FPGA is in Slave Serial mode, the PROM
and the FPGA must both be clocked by an incoming signal.
Figure 1
shows a simplied block diagram.
Multiple devices can be concatenated by using the CEO
output to drive the CE input of the following device. The
clock inputs and the DATA outputs of all PROMs in this
chain are interconnected. All devices are compatible and
can be cascaded with other members of the family.
For device programming, either the Xilinx Alliance or Foun-
dation series development system compiles the FPGA
design file into a standard Hex format, which is then trans-
ferred to most commercial PROM programmers.
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS062 (v3.1) November 5, 2001
Preliminary Product Specification
www.xilinx.com
1-800-255-7778
1

5962-9951401NXB相似产品对比

5962-9951401NXB 5962-9951401QYA
描述 qpro series configuration proms (XQ) including radiation-hardened series (xqr) qpro series configuration proms (XQ) including radiation-hardened series (xqr)
是否Rohs认证 不符合 不符合
零件包装代码 SOIC LCC
包装说明 SOP, SOP20,.4 QCCJ, LDCC44,.7SQ
针数 20 44
Reach Compliance Code unknown unknown
ECCN代码 3A001.A.2.C 3A001.A.2.C
最大时钟频率 (fCLK) 15 MHz 15 MHz
I/O 类型 COMMON COMMON
JESD-30 代码 R-PDSO-G20 S-GQCC-J44
JESD-609代码 e0 e0
长度 12.8 mm 16.51 mm
内存密度 1048576 bit 1048576 bit
内存集成电路类型 CONFIGURATION MEMORY CONFIGURATION MEMORY
内存宽度 1 1
功能数量 1 1
端子数量 20 44
字数 1048576 words 1048576 words
字数代码 1000000 1000000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 125 °C
最低工作温度 -55 °C -55 °C
组织 1MX1 1MX1
输出特性 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY CERAMIC, GLASS-SEALED
封装代码 SOP QCCJ
封装等效代码 SOP20,.4 LDCC44,.7SQ
封装形状 RECTANGULAR SQUARE
封装形式 SMALL OUTLINE CHIP CARRIER
并行/串行 SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
筛选级别 MIL-PRF-38535 Class N MIL-PRF-38535 Class Q
座面最大高度 2.65 mm 4.826 mm
最大待机电流 0.00005 A 0.00005 A
最大压摆率 0.01 mA 0.01 mA
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD
端子形式 GULL WING J BEND
端子节距 1.27 mm 1.27 mm
端子位置 DUAL QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 7.5 mm 16.51 mm
Base Number Matches 1 1
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