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CY7C1357B-133BGC

产品描述9-Mb (256k x 36/512k x 18) flow-through sram with nobl architecture
产品类别存储    存储   
文件大小556KB,共33页
制造商Cypress(赛普拉斯)
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CY7C1357B-133BGC概述

9-Mb (256k x 36/512k x 18) flow-through sram with nobl architecture

CY7C1357B-133BGC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
Is SamacsysN
最长访问时间6.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)133 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B119
JESD-609代码e0
长度22 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度18
功能数量1
端子数量119
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA119,7X17,50
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度2.4 mm
最大待机电流0.03 A
最小待机电流3.14 V
最大压摆率0.25 mA
最大供电电压 (Vsup)3.63 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

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CY7C1355B
CY7C1357B
9-Mb (256K x 36/512K x 18) Flow-Through
SRAM with NoBL™ Architecture
Features
• No Bus Latency™ (NoBL™) architecture eliminates
dead cycles between write and read cycles.
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 3.3V/2.5V I/O power supply
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
— 7.0 ns (for 117-MHz device)
— 7.5 ns (for 100-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Offered in JEDEC-standard 100 TQFP, 119-Ball BGA and
165-Ball fBGA packages
• Three chip enables for simple depth expansion.
• Automatic Power-down feature available using ZZ
mode or CE deselect.
• JTAG boundary scan for BGA and fBGA packages
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1355B/CY7C1357B is a 3.3V, 256K x 36/ 512K x 18
Synchronous Flow-through Burst SRAM designed specifically
to support unlimited true back-to-back Read/Write operations
without
the
insertion
of
wait
states.
The
CY7C1355B/CY7C1357B is equipped with the advanced No
Bus Latency (NoBL) logic required to enable consecutive
Read/Write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput
of data through the SRAM, especially in systems that require
frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
X
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. In order to avoid bus
contention, the output drivers are synchronously three-stated
during the data portion of a write sequence.
Selection Guide
133 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
6.5
250
30
117 MHz
7.0
220
30
100 MHz
7.5
180
30
Unit
ns
mA
mA
Note:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05117 Rev. *B
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised January 27, 2004
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