CPC1114N
I
NTEGRATED
C
IRCUITS
D
IVISION
Parameter
Blocking Voltage
Load Current
Max On-Resistance
LED Current to Operate
Rating
60
400
2
2
Units
V
P
mA
rms
/ mA
DC
60V Normally-Closed Single-Pole
4-Pin SOP OptoMOS
®
Relay
Description
The CPC1114N is a single-pole, normally-closed
(1-Form-B) solid state relay in a 4-pin SOP package
that employs optically coupled MOSFET technology to
provide 1500V
rms
of input/output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED.
IXYS Integrated Circuits' state of the art double-
molded vertical construction packaging makes the
CPC1114N one of the world’s smallest relays. It
offers board space savings of at least 20% over the
competitor’s larger 4-pin SOP relay.
mA
Features
•
•
•
•
•
•
•
•
1500V
rms
Input/Output Isolation
Small 4-Pin SOP Package
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Immune to radiated EM fields
Tape & Reel Version Available
Flammability Rating UL 94 V-0
Approvals
Applications
•
Security
•
Passive Infrared Detectors (PIR)
•
Data Signalling
•
Sensor Circuitry
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Aerospace
•
Industrial Controls
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN/IEC 60950-1 Certified Component:
Certificate available on our website
Ordering Information
Part #
CPC1114N
CPC1114NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
1
4
Load
– Control
2
3
Load
Switching Characteristics
of Normally-Closed Devices
Form-B
I
F
I
LOAD
10%
t
off
90%
t
on
DS-CPC1114N-R03
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I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Disipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
2
CPC1114N
Ratings
60
5
50
1
70
400
1500
8
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
kV
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 1.33 mW / ºC
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate (Output Open)
3
Input Control Current to Deactivate (Output Closed)
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
Conditions
Symbol
Min
Typ
Max
Units
I
F
=0mA
I
F
=0mA, t<10ms
I
F
=0mA, I
L
=400mA
I
F
=2mA, V
L
=60V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
-
-
-
-
-
-
-
-
-
0.1
0.9
-
-
-
-
1.2
-
0.46
2.1
24
114
0.58
0.56
1.2
-
1
400
1000
2
1
2
5
-
-
2
-
1.5
10
-
mA
rms
/ mA
DC
mA
µA
I
F
=5mA, V
L
=10V
I
F
=2mA, V
L
=50V, f=1MHz
I
F
=2mA, V
L
=1V, f=1MHz
-
I
L
=120mA
I
F
=5mA
V
R
=5V
V
IO
=0V, f=1MHz
ms
pF
I
F
I
F
V
F
I
R
C
IO
mA
mA
V
µA
pF
Load current derates linearly from 400mA @ 25
o
C to 200mA @85
o
C.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60
o
C) a minimum LED drive current of 4mA is recommended.
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IVISION
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
Typical I
F
for Switch Operation
(N=50, I
L
=400mA)
CPC1114N
35
30
Device Count (N)
25
20
15
10
5
0
20
Typical On-Resistance Distribution
(N=50, I
F
=0mA, I
L
=400mA)
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.215
1.220
1.225
1.230
LED Forward Voltage (V)
1.235
15
10
5
0
0.42
0.50
0.58 0.66 0.74
LED Current (mA)
0.82
0.90
1.21
1.24
1.27 1.30 1.33 1.36
On-Resistance ( )
1.39
25
20
15
10
5
0
0.43
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=1000mA)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=1000mA)
30
25
Device Count (N)
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, I
F
=2mA)
Device Count (N)
0.44
0.45 0.46 0.47 0.48
Turn-On Time (ms)
0.49
Device Count (N)
1.2
1.6
2.0
2.4
2.8
Turn-Off Time (ms)
3.2
3.6
66
68
70
72
74
Blocking Voltage (V
P
)
76
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=10mA
I
F
=5mA
I
F
=2mA
LED Current (mA)
I
F
=50mA
I
F
=20mA
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
-40
Typical I
F
for Switch Operation
(I
L
=200mA)
Load Current (mA)
-20
0
20
40
60
Temperature (ºC)
80
100
500
400
300
200
100
0
-100
-200
-300
-400
-500
-0.6
Typical Load Current
vs. Load Voltage
(I
F
=0mA)
-0.4
-0.2
0.0
0.2
Load Voltage (V)
0.4
0.6
Typical Turn-On Time
vs. LED Forward Current
468
Turn-On Time (ms)
Turn-Off Time ( s)
466
464
462
460
458
0
10
20
30
LED Current (mA)
40
50
10
8
6
4
2
0
0
Typical Turn-Off Time
vs. LED Forward Current
1.50
1.45
On-Resistance ( )
1.40
1.35
1.30
1.25
1.20
1.15
1.10
1.05
10
20
30
LED Current (mA)
40
50
-40
-20
Typical On-Resistance
vs. Temperature
(I
F
=0mA, I
L
=200mA)
0
20
40
60
Temperature (ºC)
80
100
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
R03
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I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA*
Typical Turn-On Time
vs. Temperature
(I
L
=200mA)
Turn-Off Time (ms)
CPC1114N
0.7
Turn-On Time (ms)
0.6
0.5
0.4
0.3
0.2
0.1
-40
-20
10
8
6
4
2
0
I
F
=2mA
I
F
=5mA
I
F
=10mA
Typical Turn-Off Time
vs. Temperature
(I
L
=200mA)
Load Current (mA)
Maximum Load Current
vs. Temperature
450
400
350
300
250
200
150
I
F
=2mA
I
F
=5mA
I
F
=10mA
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
320
300
Leakage (nA)
280
260
240
220
200
180
-40
Typical Leakage Current
vs. Temperature
(I
F
=4mA, V
L
=60V)
Blocking Voltage (V
P
)
80
78
76
74
72
70
Typical Blocking Voltage
vs. Temperature
(I
F
=4mA)
Output Capacitance (pF)
250
200
150
100
50
0
Output Capacitance
vs. Load Voltage
(I
F
=2mA)
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
10
20
30
Load Voltage (V)
40
50
Energy Rating Curve
1100
1000
Load Current (mA)
900
800
700
600
500
400
300
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
4
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IRCUITS
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IVISION
Manufacturing Information
Moisture Sensitivity
CPC1114N
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1114N
Moisture Sensitivity Level (MSL) Classification
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of
J-STD-020
must be observed.
Device
CPC1114N
Classification Temperature (T
c
)
260ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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