Analog to Digital Converters - ADC DUAL 12B 105MSPS Para ADC
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 |
针数 | 64 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最大模拟输入电压 | 2 V |
最小模拟输入电压 | -2 V |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N64 |
JESD-609代码 | e4 |
长度 | 9 mm |
最大线性误差 (EL) | 0.0488% |
湿度敏感等级 | 3 |
模拟输入通道数量 | 2 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8/3.3,3.3 V |
认证状态 | Not Qualified |
采样速率 | 105 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 1 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 9 mm |
ADS62P24IRGCRG4 | ADS62P22IRGCRG4 | ADS62P22IRGCTG4 | ADS62P23IRGCRG4 | ADS62P23IRGCTG4 | ADS62P24IRGCTG4 | |
---|---|---|---|---|---|---|
描述 | Analog to Digital Converters - ADC DUAL 12B 105MSPS Para ADC | Analog to Digital Converters - ADC DUAL 12B 65MSPS Para ADC | Analog to Digital Converters - ADC DUAL 12B 65MSPS Para ADC | Analog to Digital Converters - ADC DUAL 12B 80MSPS Para ADC | Analog to Digital Converters - ADC DUAL 12B 80MSPS Para ADC | Analog to Digital Converters - ADC DUAL 12B 105MSPS Para ADC |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | 9 X 9 MM, GREEN, PLASTIC, VQFN-64 | 9 X 9 MM, GREEN, PLASTIC, VQFN-64 | 9 X 9 MM, GREEN, PLASTIC, VQFN-64 | 9 X 9 MM, GREEN, PLASTIC, VQFN-64 |
针数 | 64 | 64 | 64 | 64 | 64 | 64 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 2 V | - | 2 V | 2 V | 2 V | 2 V |
最小模拟输入电压 | -2 V | - | -2 V | -2 V | -2 V | -2 V |
转换器类型 | ADC, PROPRIETARY METHOD | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N64 | - | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 |
JESD-609代码 | e4 | - | e4 | e4 | e4 | e4 |
长度 | 9 mm | - | 9 mm | 9 mm | 9 mm | 9 mm |
最大线性误差 (EL) | 0.0488% | - | 0.0488% | 0.0488% | 0.0488% | 0.0488% |
湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 |
模拟输入通道数量 | 2 | - | 2 | 2 | 2 | 2 |
位数 | 12 | - | 12 | 12 | 12 | 12 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 64 | - | 64 | 64 | 64 | 64 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
输出位码 | BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY | - | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC64,.35SQ,20 | - | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 |
电源 | 1.8/3.3,3.3 V | - | 1.8/3.3,3.3 V | 1.8/3.3,3.3 V | 1.8/3.3,3.3 V | 1.8/3.3,3.3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 105 MHz | - | 65 MHz | 80 MHz | 80 MHz | 105 MHz |
采样并保持/跟踪并保持 | SAMPLE | - | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 9 mm | - | 9 mm | 9 mm | 9 mm | 9 mm |
Is Samacsys | - | - | N | N | N | N |
Base Number Matches | - | - | 1 | 1 | 1 | 1 |
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