The RZ family of high-density, board-to-board or flex circuit
stacking applications is unique, offering users a reliable
one-piece contact system. Its solder-less interconnect is
compressed or “sandwiched” under pressure between parallel
printed wiring boards or between a printed wiring board and
other electronic components such as an IC or multichip module.
•
0.050” staggered grid array
•
Up to 400 contacts per square inch
•
BeCu contacts for reliable mating
•
Standard heights from 0.100” to 0.350”
•
Custom configurations available to meet your
specific design needs.
www.airborn.com
1
RZ-CVR-A
(512 ) 863-5585
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DIMENSIONS
Vertical Compression (Z-axis),
Open-Pin Field
CONTACT CUSTOMER SERVICE
A high-density, open-field, vertically-compressed
connector utilizing a patented z-axis contact
system configured for between-board (board-to-
board) compression applications.
Contact spacing: 0.050” (1.27 mm)
ORDER FORM
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Sample Part Number Format: RZ250-320-115-1000
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RZ
SERIES
Vertical
(Z-Axis)
Compression
Multi-Rows
0.050” Spacing
Open-Field
HEIGHT
100 – 0½100”
150 – 0.150”
200 – 0½200”
250 – 0.250”
300 – 0.300”
350 – 0.350”
COLUMNS
10 – 10 Columns
15 – 15 Columns
20 – 20 Columns
25 – 25 Columns
ROWS
2 – 2 Rows
3 – 3 Rows
4 – 4 Rows
5 – 5 Rows
6 – 6 Rows
7 – 7 Rows
PLATING
5
–
50 µ” Au
3 – 30 µ” Au
TYPE
00 – No Polarization
VARIATION
Blank – None
XXX – Consult Factory
CONTACT
11 – Double Compression
HARDWARE
10 –
ؽ090”
Thru-Hole
20 –
Ø
.050” Guide Pin
PLEASE CONSULT THE AIRBORN WEBSITE FOR THE LATEST REVISION OF THIS DOCUMENT PRIOR TO BEGINNING ANY DESIGN WORK.
MATED HEIGHT
Mated height is defined as the space between the hardware clamping surfaces (top hardware
surface to bottom hardware surface½) See Table 1½
MATERIALS and FINISHES
Contact: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ BeCu C17200 per ASTM B194 (brush alloy 190)
Contact Finish: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½Gold per ASTM B488 over nickel per SAE AMS-QQ-N-290
Molded Insulator: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ Glass-filled polyphenylene sulfide (PPS) per MIL-M-24519
Hardware: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ Stainless steel per ASTM A582/582M, passivated per SAE AMS-2700
NOTE: AirBorn can manufacture special configurations to your exact specifications.
PERFORMANCE
SI DATA – Differential 100 Ohm
1
2
3
4
Diff. Insertion Loss
Diff. Return Loss
NEXT
FEXT
3.0 GHz @ -3 dB
1.0 GHz @ -20 dB
2.0 GHz @ -50 dB
2.0 GHz @ -48 dB
Contact Compression: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 0½010 inches per side (nominal) for 0½100” and
0.150” connector heights; 0.015” per side (nominal)
for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Compression Force: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½25-40 grams per contact having a 0.010” deflection
35-50 grams per contact having a 0.015” deflection
Contact Wipe: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ≈0.007” for 0.100” and 0.150” connector heights
≈0.014” for 0.200”, 0.250”, 0.300” and 0.350” connector heights
Current Rating: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 0.5 amperes
Contact Resistance: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 0.025 ohms typical (contact height-dependent)
Operating Temperature: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ -65° C to +125° C
Insulation Resistance: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 5,000 megaohms minimum @ 100 VDC
Durability: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 50 connector mating cycles
Dielectric Withstanding: ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ 250 VDC @ sea level, 100 VDC @ altitude
NOTE: Performance values are estimates at this time. Actual values will be determined when
final product testing is complete.
www.airborn.com
(512 ) 863-5585
RZ-PNB-1D
2
CALL 512-863-5585
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CONTACT CUSTOMER SERVICE
RZ DRAWINGS
Guide Pin Hardware Option
PWB Layout
Note: All dimensions are in inches.
PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square foot
Plate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)
www.airborn.com
3
RZ-DIM-1B
(512 ) 863-5585
CALL 512-863-5585
x6464
CONTACT CUSTOMER SERVICE
RZ DRAWINGS
Thru-Hole Hardware Option
PWB Layout
Note: All dimensions are in inches.
PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square foot
Plate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)
www.airborn.com
(512 ) 863-5585
RZ-DIM-2B
4
CALL 512-863-5585
x6464
CONTACT CUSTOMER SERVICE
RZ DRAWINGS
Board Footprint
PWB-PLATED PAD RECOMMENDATIONS:
Board to be made in accordance with ANSI/EIA-616
Laminate material per MIL-P-13949, Type GF
Copper foil thickness: 1 oz per square foot
Plate all surface features with 50 µ”, minimum, electrolytic hard gold over 50-150 µ” nickel.
(Optionally, plate all surface features with 50 µ”, minimum, electrolytic hard gold over 5-10 µ” of electrolytic soft gold over 100 µ”, minimum, nickel.)
射频识别(Radio Frequency Identification，RFID)技术是一种利用无线射频通信实现的非接触式自动识别技术，与目前广泛采用的条形码技术相比，RFID具有容量大、识别距离远、穿透能力强、抗污性强等特点。RFID技术已经发展得比较成熟并获得了大规模商用，但超高频RFID技术相对滞后。本文分析了射频芯片nRF9E5的功能特性，并将其用于RFID系统中，设计了一套有源超高频(...[详细]
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