Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | QFP |
包装说明 | LFQFP, |
针数 | 100 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 25 ns |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e3 |
长度 | 14 mm |
内存密度 | 147456 bit |
内存集成电路类型 | DUAL-PORT SRAM |
内存宽度 | 18 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 8KX18 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 14 mm |
Base Number Matches | 1 |
70V35L25PFGI | IDT70V35L25PFGI | 70V35L25PFI | IDT70V35L25PFI | 70V35S25PFI | IDT70V35S25PFI | 70V35S25PFGI | IDT70V35S25PFGI | |
---|---|---|---|---|---|---|---|---|
描述 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX18, 25ns, CMOS, PQFP100, TQFP-100 |
是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | LFQFP, | LFQFP, | LFQFP, | LFQFP, | LFQFP, | LFQFP, | LFQFP, | LFQFP, |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
JESD-609代码 | e3 | e3 | e0 | e0 | e0 | e0 | e3 | e3 |
长度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
内存密度 | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 240 | 240 | 240 | 240 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | MATTE TIN | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 20 | 20 | 20 | 20 | 30 | 30 |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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