The CPC1822 is a monolithic photovoltaic string of
solar cells with switching circuitry. When operating
in sunlight or a bright artificial light environment the
optical energy will activate the cell array and generate
a voltage at the output. The solar cells are capable
of generating a floating source voltage and current
sufficient to drive and power CMOS ICs, logic gates
and/or provide “trickle charge” for battery applications.
* Direct sunlight (Approximately 6000 lux)
Features
•
•
•
•
•
•
•
•
4V Output
Triggers with Natural Sunlight
Provides True Wireless Power
No EMI/RFI Generation
Wave Solderable
Replacement of Discrete Components
Solid State Reliability
Small 8-Pin Surface Mount SOIC
Ordering Information
Part #
CPC1822N
CPC1822NTR
Description
8-Pin Clear Molded SOIC Package (100/Tube)
8-Pin Clear Molded SOIC Package (2000/Reel)
Applications
•
•
•
•
•
•
•
•
•
•
Portable Electronics
Solar Battery Chargers
Battery Operated Equipment
Consumer Electronics
Off-Grid Installation
Wireless Sensors and Detection
Flame Detection
Self Powered Sunlight/ Light Detection
Self Powered Products
Remote Installation
Pin Configuration
1
2
3
4
8 V+
7
6
5 V-
Pb
RoHS
2002/95/EC
e
3
www.clare.com
1
DS-CPC1822-R02
CPC1822
Absolute Maximum Ratings
Parameter
Reverse Voltage
Operational Temperature
Storage Temperature
Ratings
10
-40 to +85
-40 to +125
Units
V
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics @ 25°C
Open Circuit Voltage
Short Circuit Current
Conditions
Direct Sun (6000 lux)
High Intensity Lamp
Direct Sun (6000 lux)
Symbol
V
OC
V
OC
I
SC
Min
-
-
-
Typ
4.2
4.5
50
Max
-
-
-
Units
V
V
µA
PERFORMANCE DATA*
Normalized Open Circuit Output
Voltage vs. Light Intensity
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
2
4
6
8
Light Intensity (lux • 1000)
10
Normalized Output Current (μA)
Normalized Output Voltage (V)
4.5
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
0
2
4
6
8
10
Light Intensity (lux • 1000)
Normalized Short Circuit
Output Current vs. Light Intensity
Normalized Open Circuit Output Voltage
vs. Incident Angle of Light
to Photodiode Surface
Normalized Output Current (μA)
Normalized Output Voltage (V)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
Incident Angle (Degrees)
100
Normalized Short Circuit Output Current
vs. Incident Angle of Light to
Photodiode Surface
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
Incident Angle (Degrees)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
2
www.clare.com
R02
CPC1822
Manufacturing Information
Moisture Sensitivity
Clare has characterized the moisture reflow sensitivity
of this package, and has determined that this
component must be handled in accordance with
IPC/JEDEC standard J-STD-033 moisture sensitivity
level (MSL), level 3 classification.
Soldering Reflow Profile
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
Pb
RoHS
2002/95/EC
e
3
MECHANICAL DIMENSIONS
8-Pin SOIC Package
0.19 - 0.25
(0.008 - 0.010)
Recommended PCB Land Pattern
1.55
(0.061)
0.40 - 1.27
(0.016 - 0.050)
5.40
(0.213)
1.27 TYP
(0.05 TYP)
0.60
(0.024)
0.10 - 0.25
(0.004 - 0.010)
1.35 - 1.75
(0.053 - 0.069)
Dimensions
mm
(inches)
1.27
(0.050)
5.80 - 6.20
(0.23 - 0.24)
PIN 1
0.33 - 0.51
(0.013 - 0.020)
4.80 - 5.00
(0.19 - 0.20)
3.80 - 4.00
(0.15 - 0.16)
0.394 - 0.648
(0.016 - 0.026)
Tape and Reel Packaging for 8-Pin SOIC-N Surface Mount Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
B
0
= 5.50
±
0.10
(0.217
±
0.004)
Pin 1
W = 12.00
±
0.30
(0.472
±
0.012)
B
0
= 5.30
±
0.10
(0.209
±
0.004)
Top Cover
Tape
Embossed Carrier
P = 8.00
±
0.10
(0.315
±
0.004)
K
0
= 2.10
±
0.10
(0.083
±
0.004)
User Direction of Feed
A
0
= 6.50
±
0.10
(0.256
±
0.004)
Embossment
Dimensions
mm
(inches)
NOTE:
Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
国际半导体设备材料产业协会（SEMI）昨（10）日公布半导体设备资本支出的年中预测报告（SEMI Capital Equipment Forecast），预估2012年全球半导体设备营收规模将达到423.8亿美元，2013年将成长至467.1亿美元。
受惠平板电脑、智慧型手机与行动装置等消费性电子商品亮丽表现，半导体设备的采购需求仍将持续。SEMI在报告中指出，2011年半...[详细]
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