Easy Profile
®
256
No-Clean Solderpaste
Product Description
Easy Profile
®
256 is a no-clean, air or nitrogen
reflowable, solder paste specifically designed for
maximum robustness in reflow profiling and stencil
printing. EP256 has the widest possible reflow
processing window. EP256 is also capable of
stencil printing downtimes of up to 90 minutes with
an effective first print down to 20 mils. EP256 is a
solderpaste formula that maintains its activity and
printing characteristics for up to 8 hours without
any shear thinning.
• Stable wetting behavior over a wide range of
profiles
• Capable of 90 minute break times in printing
• High print speeds to 200+ mm/sec (8+ in/sec)
• Compatible with enclosed print head systems
• Excellent printing characteristics to 0.4mm
(16 mil) pitch with Type 3 powder
• High activity on all substrates, including OSPs
• Capable of off-pad printing with no solderballs
after reflow
• Stencil life: 8+ hours (process dependent)
• Scrap is reduced due to less paste dry out
• Stable tack over 8+ hours
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78
Physical Properties
(Data given for Sn63Pb37 90% metal, -325+500 mesh)
Viscosity (typical):
1400 poise
Malcom Viscometer @ 10rpm and 25°C
Initial Tackiness (typical):
40 grams
Tested to Kester Method 1W-QC-3-04
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Reliability Properties
Copper Mirror Corrosion:
Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.3
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides:
None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Standard Applications
90% Metal - Stencil Printing
90% Metal - Enclosed Head Printing
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank
Day 1
Day 4
Day 7
EP256
1.0
×10
10
Ω
1.3
×10
10
Ω
1.3
×10
10
Ω
9.8
×
10
8
Ω
1.6
×
10
9
Ω
1.1
×
10
9
Ω
EP256
Application Notes
Availability:
Easy Profile
®
256 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh
is recommended, but different powder particle size distributions are available for standard and fine pitch
applications. For specific packaging information, see Kester's Solder Paste Chart for available sizes. The
appropriate combination depends on process variables and the specific application.
Printing Parameters:
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80 to 90 durometer polyurethane or stainless steel
Capable to a maximum speed of 200 mm/sec (8 in/sec)
Stainless Steel, Molybdenum, Nickel Plated, Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% R.H.
Kester Reflow Profile
Alloy: Sn63Pb37 or Sn62Pb36Ag02
240
220
200
180
Recommended Reflow Profile:
The recommended reflow profile for EP256 made with
either the Sn63Pb37 or Sn62Pb36Ag02 is shown here.
This profile is simply a guideline. Since EP256 is a
highly active solder paste, it can solder effectively over
a wide range of profiles. Your optimal profile may be
different from the one shown based on your oven,
board and mix of defects. Please contact Kester if you
need additional profiling advice.
Peak Temp.
210 - 225 C
Temperature (C)
160
140
120
100
80
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
330
<1.8 C/Sec
Soaking Zone
(120 sec. max.)
30-60 sec. typical
Reflow Zone
45-75 sec. typical
Time to Peak Temperature
3.5-5.0 min. typical
5.5 min max
Cleaning:
Time (sec.)
EP256 is a no-clean formula. The residues don't need to be removed for typical applications. Although
EP256 is designed for no-clean applications, its residues can be easily removed using automated cleaning
equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support
for details.
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. EP256 should be stabilized at room temperature prior to
printing. EP256 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly when held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters:
800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA
Phone:
(+1) 630-616-4000 •
Email:
customerservice@kester.com •
Website:
www.kester.com
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
customerservice@kester.com.sg
European Headquarters
Ganghoferstrasse 45
D-82216 Gernlinden
Germany
(+49) 8142-47850
customerservice@kester-eu.com
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
jpsales@kester.com.sg
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 21Sep09
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