TEMPORARY SOLDER RESISTS
SPOT-ON, COPPER SPOT-ON
& AQUA SPOT-ON
Multicore Temporary Solder Resists are designed to be used on
printed circuit boards prior to soldering and will withstand
fluxing and wave soldering operations.
l
Peelable and water soluble versions available
l
Withstand high temperatures
l
Long shelf life
l
Thixotropic - holds position
Copper Spot-On
does not need to be completely dry to
withstand soldering temperatures, however it should be completely
translucent before removal is attempted.
Aqua Spot-On
should be applied at a thickness of 0.25-0.4mm
(10-15 thou). As with
Copper Spot-On,
drying times are dependent
upon ambient conditions.
Aqua Spot-On
will cure in one hour at
25°C (77°F) or 30 minutes at 80°C (176°F). If required,
Aqua Spot-
On
may be thinned before application using deionised water. Drying
times and the softness of the mask may be modified to suit ambient
conditions as follows:
(a) Very dry operating environments may benefit by adding small
amounts of glycerine to
Aqua Spot-On.
This will soften the mask
and reduce the required washing time.
(b) Extremely humid operating environments (greater than 90% RH)
will benefit by adding small amounts of isopropanol to
Aqua
Spot-On.
This will reduce the drying time and increase the
hardness of the mask.
Over curing of these products should be avoided to prevent removal
problems caused by blistering of the mask.
APPLICATIONS
Multicore Temporary Solder Resists have been formulated for use in
most commonly found forms of mask application. The three
formulations are suitable for different application and removal
techniques.
Copper Spot-On
is suitable for hand, robotic, pneumatic or
template screening application and is simply removed after soldering
by peeling off. It is particularly suited for use on copper, gold, silver or
pre-soldered surfaces.
Spot-On
is a similar product which can also be applied by brush.
It may be used on copper but some surface degradation and/or drop
in solderability may be experienced. In this case, Copper Spot-On is
recommended.
Aqua Spot-On
is a water soluble product which should be
applied by hand dispensing and removed during the cleaning
operation.
PROPERTIES
Colour
Odour
Recommended
Application
thickness
Typical cure time:
ambient
65°C
80°C
Removal
Spot-On
Opaque white
liquid
Ammoniacal
2.0mm
(80 thou)
Copper Spot-On
Opaque pink
liquid
Mild,
acrylic
0.5-1.0mm
(20-40 thou)
Aqua Spot-On
Opaque blue
liquid
Mild
0.25-0.4mm
(10-15 thou)
1 hr
-
30 min
Water
soluble
RECOMMENDED OPERATING CONDITIONS
The substrate should be free from grease, oil and particulate matter.
Spot-On
should be applied at a liquid coating thickness of
2.0mm (80 thou) to ensure a coherent film for ease of subsequent
removal as it dries to a thinner coating. It will dry in 40 minutes at
80°C (176°F) or 2 hours at ambient temperature.
For best results,
Copper Spot-On
should be applied at a
thickness of 0.5-1.0mm (20-40 thou). Drying times depend upon
ambient humidity but as a guide, under normal conditions,
Copper
Spot-On
is ready for the soldering process in one hour. This may be
accelerated to 30 minutes at 65°C (150°F) or 20 minutes at 80°C
(180°F). The mask will change from an opaque pink to a translucent
red when completely cured.
2 hr
1 hr
-
30 min
40 min
20 min
Peel off (not
Peel off (not
soluble in water soluble in water
or other solvents) or other solvents)
PACKAGING
250ml hand-application squeeze bottles with nozzle.
HEALTH AND SAFETY
WARNING:
The following information is for guidance only and users
must refer to the Material Safety Data Sheets relevant to Multicore
Spot-On, Copper Spot-On and Aqua Spot-On before use.
Multicore Temporary Solder Resists are considered to be of low
hazard in normal use. However, the following sensible precautions
should be taken.
Fumes/Vapours:
Avoid excessive inhalation of vapours which may
give rise to irritation of the throat and respiratory system if allowed to
accumulate. Always use these products in well ventilated areas. If
vapour concentrations are excessive, the use of local exhaust
ventilation is recommended.
Personal Protection and Hygiene:
Suitable protective clothing
should be worn to prevent contact with skin and eyes. If the materials
come into contact with the skin, the affected area should be cleaned
with a proprietary hand cleanser followed by washing with soap and
water. If the materials come into contact with the eyes, they should be
irrigated thoroughly with water for at least 10 minutes and medical
attention sought. Eating, drinking and smoking should not be
permitted in the working area and hands should be washed with soap
and warm water before eating.
Fire Hazards and Precautions:
Multicore Temporary Solder Resists
are non flammable but will burn if exposed to naked flames giving off
acrid smoke, irritating fumes and toxic gases. Smoking must not be
permitted in the working area. Carbon dioxide, alcohol resistant foam
or dry powder extinguishers may be used if the materials catch fire.
Spillage and Waste Disposal:
Spot-On
Copper Spot-On/
Aqua Spot-On
Allow spilt material to solidify, then scrape up.
Soak up spillage with inert absorbent material.
Store waste in closed containers.
Dispose of waste materials in accordance with local or national
regulations
MULTICORE SOLDERS
These data are based on information believed to be reliable and are offered in good faith, but MULTICORE MAKES NO WARRANTIES EITHER EXPRESS OF IMPLIED AS TO THEIR ACCURACY AND ASSUMES NO LIABILITIES ARISING OUT OF THEIR
USE BY OTHERS as conditions and methods of use of the products are beyond MULTICORE’S control. The prospective user should determine the suitability of the product before using it on a commercial scale. MULTICORE warrants only that the product
will conform to its physical descriptions. MULTICORE MAKES NO OTHER WARRANTIES EXPRESS OR IMPLIED AND EXPRESSLY DISCLAIMS ANY IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL
MULTICORE BE RESPONSIBLE FOR SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER THE CLAIM IS IN CONTRACT, NEGLIGENCE OR OTHERWISE.
MSL Ref.: 606 08/00
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