Datasheet> 器件分类 > 无线/射频/通信> 电信电路> CX20493-21

文档预览

CX20493-21: 产品描述2.4 kbps DATA, MODEM-SUPPORT CIRCUIT, QCC28; 产品类别无线/射频/通信电信电路; 文件大小540KB，共94页; 制造商CONEXANT; 官网地址http://www.conexant.com/

下载文档详细参数全文预览

CX20493-21概述

2.4 kbps DATA, MODEM-SUPPORT CIRCUIT, QCC28

2.4 kbps 数据, 调制解调器-支持电路, QCC28

CX20493-21规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	CONEXANT
零件包装代码	QFN
包装说明	VQCCN, LCC28,.2SQ,20
针数	28
Reach Compliance Code	compli
数据速率	2.4 Mbps
JESD-30 代码	S-XQCC-N28
JESD-609代码	e0
长度	5 mm
功能数量	1
端子数量	28
最高工作温度	70 °C
最低工作温度
封装主体材料	UNSPECIFIED
封装代码	VQCCN
封装等效代码	LCC28,.2SQ,20
封装形状	SQUARE
封装形式	CHIP CARRIER, VERY THIN PROFILE
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3.3 V
认证状态	Not Qualified
座面最大高度	1 mm
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
电信集成电路类型	MODEM-SUPPORT CIRCUIT
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	5 mm

文档预览

下载PDF文档

全文
预览

CX81801-7x/8x SmartV.XX Modem Data Sheet

Contents

1. Introduction..........................................................................................................................................1-1

1.1

1.2

1.3

Overview ......................................................................................................................................................................... 1-1

Applications .................................................................................................................................................................... 1-2

Features .......................................................................................................................................................................... 1-4

1.3.1

General Modem Features................................................................................................................................ 1-4

1.3.2

SmartDAA Features ........................................................................................................................................ 1-5

1.3.3

Applications.................................................................................................................................................... 1-5

Technical Overview......................................................................................................................................................... 1-6

1.4.1

General Description ........................................................................................................................................ 1-6

1.4.2

MCU Firmware................................................................................................................................................ 1-6

1.4.3

Operating Modes ............................................................................................................................................ 1-6

1.4.3.1

Data/Fax Modes.......................................................................................................................... 1-6

1.4.3.2

V.44 Data Compression.............................................................................................................. 1-7

1.4.3.3

Worldwide Operation.................................................................................................................. 1-7

1.4.3.4

TAM Mode.................................................................................................................................. 1-8

1.4.3.5

Speakerphone Mode (S Models)................................................................................................ 1-9

1.4.4

Reference Designs.......................................................................................................................................... 1-9

Hardware Description ..................................................................................................................................................... 1-9

1.5.1

CX81801 Modem Device ................................................................................................................................ 1-9

1.5.2

Digital Isolation Barrier................................................................................................................................. 1-10

1.5.3

CX20493 SmartDAA Line Side Device.......................................................................................................... 1-10

1.5.4

CX20442 Voice Codec .................................................................................................................................. 1-10

AT Commands .............................................................................................................................................................. 1-10

Serial DTE Interface Operation........................................................................................................................................ 2-1

2.1.1

Automatic Speed/Format Sensing .................................................................................................................. 2-1

Parallel Host Bus Interface Operation............................................................................................................................. 2-2

Establishing Data Modem Connections .......................................................................................................................... 2-2

2.3.1

Dialing ............................................................................................................................................................ 2-2

2.3.2

Telephone Number Directory.......................................................................................................................... 2-2

2.3.3

Modem Handshaking Protocol ....................................................................................................................... 2-2

2.3.4

Call Progress Tone Detection ......................................................................................................................... 2-2

2.3.5

Answer Tone Detection................................................................................................................................... 2-2

2.3.6

Ring Detection................................................................................................................................................ 2-2

2.3.7

Billing Protection ............................................................................................................................................ 2-3

2.3.8

Connection Speeds......................................................................................................................................... 2-3

2.3.9

Automode ....................................................................................................................................................... 2-3

Data Mode ...................................................................................................................................................................... 2-4

1.4

1.5

1.6

2.1

2.2

2.3

2. Technical Specifications .......................................................................................................................2-1

2.4

102199B

Conexant

iii

CX81801-7x/8x SmartV.XX Modem Data Sheet

2.4.1

Speed Buffering (Normal Mode) .................................................................................................................... 2-4

2.4.2

Flow Control ................................................................................................................................................... 2-4

2.4.3

Escape Sequence Detection............................................................................................................................ 2-4

2.4.4

BREAK Detection ............................................................................................................................................ 2-4

2.4.5

Telephone Line Monitoring............................................................................................................................. 2-4

2.4.6

Fall Forward/Fallback (V.92/V.90/V.34/V.32 bis/V.32) ................................................................................... 2-4

2.4.7

Retrain ............................................................................................................................................................ 2-5

2.4.8

Programmable Inactivity Timer ...................................................................................................................... 2-5

2.4.9

DTE Signal Monitoring (Serial DTE Interface Only) ........................................................................................ 2-5

V.92 Features.................................................................................................................................................................. 2-5

2.5.1

Modem-on-Hold ............................................................................................................................................. 2-5

2.5.2

Quick Connect ................................................................................................................................................ 2-6

2.5.3

PCM Upstream ............................................................................................................................................... 2-6

Error Correction and Data Compression......................................................................................................................... 2-6

2.6.1

V.42 Error Correction ..................................................................................................................................... 2-6

2.6.2

MNP 2-4 Error Correction .............................................................................................................................. 2-6

2.6.3

V.44 Data Compression.................................................................................................................................. 2-6

2.6.4

V.42 bis Data Compression ............................................................................................................................ 2-6

2.6.5

MNP 5 Data Compression .............................................................................................................................. 2-7

Telephony Extensions..................................................................................................................................................... 2-7

2.7.1

Line In Use Detection ..................................................................................................................................... 2-7

2.7.2

Extension Pickup Detection ............................................................................................................................ 2-7

2.7.3

Remote Hangup Detection.............................................................................................................................. 2-8

Fax Class 1 and Fax Class 1.0 Operation ........................................................................................................................ 2-8

Point-of-Sales Support ................................................................................................................................................... 2-8

Voice/Audio Mode .......................................................................................................................................................... 2-8

2.10.1

Online Voice Command Mode ........................................................................................................................ 2-8

2.10.2

Voice Receive Mode ....................................................................................................................................... 2-8

2.10.3

Voice Transmit Mode ..................................................................................................................................... 2-9

2.10.4

Full-Duplex Receive and Transmit Mode ........................................................................................................ 2-9

2.10.5

Audio Mode .................................................................................................................................................... 2-9

2.10.6

Tone Detectors ............................................................................................................................................... 2-9

2.10.7

Speakerphone Mode....................................................................................................................................... 2-9

V.80 Synchronous Access Mode (SAM) - Video Conferencing...................................................................................... 2-9

Full-Duplex Speakerphone (FDSP) Mode (S Models)................................................................................................... 2-10

Caller ID ........................................................................................................................................................................ 2-10

Worldwide Country Support ......................................................................................................................................... 2-10

Diagnostics ................................................................................................................................................................... 2-11

2.15.1

Commanded Tests........................................................................................................................................ 2-11

2.15.2

Power On Reset Tests .................................................................................................................................. 2-11

Low Power Sleep Mode ................................................................................................................................................ 2-12

CX81801 Modem Hardware Pins and Signals ................................................................................................................ 3-1

3.1.1

Common to Parallel and Serial Interface Configurations................................................................................ 3-1

3.1.1.1

LSD Interface (Through DIB)...................................................................................................... 3-1

3.1.1.2

Call Progress Speaker Interface ................................................................................................. 3-1

3.1.1.3

Voice Relay Interface (S Models) ............................................................................................... 3-1

3.1.1.4

Serial EEPROM Interface............................................................................................................ 3-1

3.1.1.5

External Bus Interface ................................................................................................................ 3-2

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

2.15

2.16

3.1

3. Hardware Interface ...............................................................................................................................3-1

Conexant

102199B

CX81801-7x/8x SmartV.XX Modem Data Sheet

3.1.2

Serial Interface Configuration Only................................................................................................................. 3-2

3.1.2.1

Serial DTE Interface and Indicator Outputs (PARIF = Low)........................................................ 3-2

3.1.3

Parallel Interface Configuration Only (PARIF = High)..................................................................................... 3-3

3.1.3.1

Parallel Host Bus Interface ......................................................................................................... 3-3

3.1.4

CX81801 Modem Interface Signals................................................................................................................ 3-3

CX20493 LSD Hardware Pins and Signals ................................................................................................................... 3-22

3.2.1

CX20493 LSD Signal Summary.................................................................................................................... 3-22

3.2.1.1

Smart Modem Interface (Through DIB) ................................................................................... 3-22

3.2.1.2

Telephone Line Interface .......................................................................................................... 3-22

3.2.1.3

Voltage References................................................................................................................... 3-22

3.2.1.4

General Purpose Input/Output.................................................................................................. 3-23

3.2.1.5

No Connects ............................................................................................................................. 3-23

3.2.2

CX20493 LSD Pin Assignments and Signal Definitions ............................................................................... 3-23

CX20442 VC Hardware Pins and Signals (S Models)................................................................................................... 3-28

3.3.1

CX20442 VC Signal Summary...................................................................................................................... 3-28

3.3.1.1

Speakerphone Interface............................................................................................................ 3-28

3.3.1.2

Telephone Handset/Headset Interface...................................................................................... 3-28

3.3.1.3

CX81801 Modem Interface....................................................................................................... 3-28

3.3.1.4

Host Interface........................................................................................................................... 3-28

3.3.2

CX20442 VC Pin Assignments and Signal Definitions ................................................................................. 3-29

Electrical and Environmental Specifications ................................................................................................................. 3-35

3.4.1

Operating Conditions, Absolute Maximum Ratings, and Power Requirements ........................................... 3-35

3.4.2

Interface and Timing Waveforms ................................................................................................................. 3-37

3.4.2.1

External Memory Bus Timing ................................................................................................... 3-37

3.4.2.2

Parallel Host Bus Timing .......................................................................................................... 3-39

3.4.2.3

Serial DTE Interface.................................................................................................................. 3-41

Crystal Specifications ................................................................................................................................................... 3-42

3.2

3.3

3.4

3.5

4. Package Dimensions ............................................................................................................................4-1

5. Parallel Host Interface ..........................................................................................................................5-1

5.1

5.2

Overview ......................................................................................................................................................................... 5-1

Register Signal Definitions ............................................................................................................................................. 5-3

5.2.1

IER - Interrupt Enable Register (Addr = 1, DLAB = 0) .................................................................................... 5-3

5.2.2

FCR - FIFO Control Register (Addr = 2, Write Only) ....................................................................................... 5-4

5.2.3

IIR - Interrupt Identifier Register (Addr = 2) .................................................................................................. 5-5

5.2.4

LCR - Line Control Register (Addr = 3) .......................................................................................................... 5-6

5.2.5

MCR - Modem Control Register (Addr = 4).................................................................................................... 5-7

5.2.6

LSR - Line Status Register (Addr = 5)............................................................................................................ 5-7

5.2.7

MSR - Modem Status Register (Addr = 6) ..................................................................................................... 5-9

5.2.8

RBR - RX Buffer (Receiver Buffer Register) (Addr = 0, DLAB = 0) ................................................................ 5-9

5.2.9

THR - TX Buffer (Transmitter Holding Register) (Addr = 0, DLAB = 0).......................................................... 5-9

5.2.10

Divisor Registers (Addr = 0 and 1, DLAB = 1).............................................................................................. 5-10

Receiver FIFO Interrupt Operation ................................................................................................................................ 5-10

5.3.1

Receiver Data Available Interrupt ................................................................................................................. 5-10

5.3.2

Receiver Character Timeout Interrupts......................................................................................................... 5-11

Transmitter FIFO Interrupt Operation ........................................................................................................................... 5-11

5.4.1

Transmitter Empty Interrupt......................................................................................................................... 5-11

5.3

5.4

102199B

Conexant

推荐资源

求助: 我现在急需一个“基于FPGA的数字钟设计”的毕业论文，实现的功能有时、分、秒的显示，准确计时，定时闹钟和时间复位，有文献综述和设计方案也可以。感激万分！...; 铃声响了 FPGA/CPLD

电路板设计中PCB铜箔厚度、走线宽度、电流的关系: 在PCB设计加工中，常用OZ（盎司）作为铜皮厚度的单位，1OZ铜厚的定义为1平方英寸面积内铜箔的重量为1盎，对应的物理厚度为35um。不同厚度不同宽度的铜箔的载流量见下表：铜皮厚度70um ......; zyldpcb PCB设计

用自己导出的SDK开发应用程序时出现问题: 我把自己导出的SDk安装后，在EVC中开发应用程序，新建工程后，到最后一步——单击finish后，程序就死了。请教高手，该如何解决？谢谢！...; kings185100 嵌入式系统

苹果又获48项新专利，iBike最为新颖: 苹果的专利技术总是会让人充满好奇，最近美国专利及商标局又公布了苹果已经获得的48项最新的专利，挑一些特别出色的，我们一睹为快。这些专利涵盖感应式充电和整合iPod的自行车设备等等，其 ......; wstt 创意市集

（转载）集成运放资料[图]: 一：零点漂移零点漂移可描述为：输入电压为零，输出电压偏离零值的变化。它又被简称为：零漂零点漂移是怎样形成的：运算放大器均是采用直接耦合的方式，我们知道直接耦合式放大电路的各级的Q点 ......; 程序天使模拟电子

开源专家袁萌：国产COS操作系统是“杂种”，不是中国软件梦: http://www.csdn.net/article/2014-02-18/2818446 ...; wangfuchong 聊聊、笑笑、闹闹

英飞凌首超意法瑞萨工业份额排名第一

　　据市场调研公司Semicast最近发表的研究报告，英飞凌（Infineon）首次在工业市场排名第一，超过了意法半导体（ST）和瑞萨（Renesas）科技。　　据这项反映2007年市场状况的研究报告，英飞凌的市场份额从上一年的6.4%上升到7.5%。意法半导体的份额则从7.8%降至7.0%。瑞萨科技的市场份额从5.4%提高到6.5%。德州仪器（TI）的市场从5.7%上升到6.3%，但它的排...[详细]
DSP与模拟技术加速医疗电子发展

　　TI认为医疗器械在未来几年内的最大变化就是无线连接技术。它包括含远程病人监控在内的不同应用，其中远程病人监控功能将帮助医务人员无需让病人走进医院即可搜集监测其相关信息。无线连接技术与可植入设备的结合将使功能正常的大脑绕过脊椎断开部位直接连接并支配功能正常的四肢。　　应用无线连接技术可对药物释放系统进行监测、控制和优化。总之，无线连接技术将使医疗器械与决策者之间做到信息共享。可植入设备是另...[详细]
用三位转速计测量超低频率

　　图中所示的电路是一个三位转速计，用来测量重复时间间隔为0.235至15秒内的低频信号。转速计的转速为每分钟4至255转，它应用在那些医疗设备，这些医疗设备中，用来测量心跳率、呼吸率、电解磨削、脑电图、低转速电机转速或机械装置转速之类的低频信号。　　PIC16F872微处理控制处理转速计的数据。PIC感应输入频率(fin)的周期，计算出每秒产生的相应的脉冲数，并相应的更新LED显示器。输入信...[详细]
台湾媒体称马英九暗示开放12吋晶圆厂“登陆”

　　马英九10日抛出扩大开放晶圆厂登陆想法。他表示，美国半导体大厂英特尔公司，去年宣布成立大陆12吋晶圆90纳米制程的生产工厂，如果美国可以容许英特尔到大陆去，“我相信我们进一步开放应该是合理、也是必要的政策”。　　据台湾《联合报》报道，马英九昨天在接见美商应用材料公司全球总裁史宾林特，马英九说，台湾半导体晶圆代工产业是世界龙头，IC设计所占比例名列前茅，封装测试也是全球第一，因此应用材料公...[详细]
召回植入医疗器械厂家要为患者出费用

　　《医疗器械召回管理办法》征求意见稿发布——记者从药监局了解到，关于《医疗器械召回管理办法》的征求意见稿已完成，其召回将根据安全隐患程度分为三级。　　同时，对于植入性医疗器械，生产企业要承担应召回或者更换该医疗器械而产生的费用。国家药监局表示，对征求意见稿中的内容有意见的企业、个人，可以在3月31日前将意见反馈至该局政策法规司法规处。 ...[详细]
基于DSP的智能控制器高可靠性分析与设计(图)

　　硬件电路原理如图1所示，在具体设计中，每个部分都应考虑抗干扰问题，以最大限度地减小干扰对整个系统性能的影响，确保系统具有足够高的可靠性。　　　　图1 智能控制器硬件电路原理框图　　①DSP部分　　本控制器以TI公司的TMS320F2812（以下简称F2812）为核心，它是一款专用于控制的高性能、多功能、高性价比的32位定点DSP芯片。F2812部分的电路设计重点考虑如下问...[详细]
诺基亚单芯片手机销售总量已突破千万部

　　7月18日报道，诺基亚首席执行官Olli-Pekka Kallasvuo向芬兰《赫尔辛基日报》(Helsingin Sanomat)表示：诺基亚的单芯片手机已经高量产，面对发展中市场，单晶手机的销量不错，大概有数以千万部。他表示，诺基亚已经有多款单晶手机面市，我们最核心的因素是成本优势，在这方面诺基亚具有很强的竞争力。　　今年5月，芯片厂商Infineon(英飞凌)曾表示诺基亚生产的单芯...[详细]
安森美半导体以全股票交易收购Catalyst半导体

　　安森美半导体(ON Semiconductor)和Catalyst半导体宣布，已签订安森美半导体收购Catalyst半导体的正式合并协议，交易将全部以股票支付，Catalyst股东每持有1股普通股将获得0.706股安森美半导体普通股。此项交易的股票价值约为1.15亿美元，企业价值约为0.85亿美元。　　安森美半导体总裁兼首席执行官(CEO)傑克信(Keith Jackson)说：“收购C...[详细]
中央固定集控式方向盘可减少驾驶员受伤指数

中国驾驶员不系安全带是普遍存在的事实，在这种情况下发生正面撞击，会对驾驶人员造成致命伤害。一种“非对称式”的安全气囊可以显著减少这种情况下的伤害：在利用“非对称式”安全气囊进行的中型轿车斜碰撞试验中，驾驶员的受伤指数减少了60%。这种特殊的气囊目前只安装在东风雪铁龙凯旋等拥有“中央固定集控式方向盘”的轿车上。中央固定集控式方向盘的特点是驾驶员在转向时仅仅是在转动方向盘的轮辐以及转向...[详细]
红外线人体测温仪电路的设计

　　由于医学发展的需要，在很多情况下，一般的温度计已经满足不了快速而又准确的测温要求，例如车站和机场等的人口密度较大的地方进行人体温度测量。　　虽然现在国外这种测温的技术都比较成熟，但是国内这方面的技术还处于发展阶段。　　因此，为了适应医学发展的需要，有效地进行特殊环境下的温度测量，从而有力地控制和预防诸如非典之类的特殊疾病的传播，急需设计一种测温速度快，准确率高的测温仪。针对一般的工业用的红...[详细]
超高频RFID标签的数字电路设计

　　摘要：在研究读写器和射频标签通信过程的基础上，结合EPC C1G2协议以及ISO／IEC18000．6协议，采用VHDL语言设计出一种应用于超高频段的射频标签数字电路。对电路的系统结构和模块具体实现方法进行了描述。基于0．18μm CMOS工艺标准单元库，采用EDA工具对电路进行了前端综合和后端物理实现。给出的仿真结果表明该电路符合协议要求，综合后的电路规模约为11000门，功耗约为3...[详细]
英特尔以技术之名让产品蕴涵百分百技术

15%的收入用于研发，100%的技术转化为产品。尽管利润下降，股票示弱，英特尔却不回头，因为历史已经验证，英特尔惟有技术立命。　　近年，尽管英特尔的销售额在不断上升，但销售收入却下降了20%，利润只有鼎盛时期的三分之一，股价有一定程度的降幅。但是，这个始终高举技术旗号的IT大佬，每年花在研发上的投入仍然达到40亿美元以上，占收入的15%，总共花了100多亿美元扩建了四家先进的工...[详细]
移动领域燃起战火 Intel与ARM大战一触即发

随着智能手机业试图开发功能更加强大的计算机，以及PC业也努力制造越来越小型的计算机，业界将会面临心挑战。从Intel的举动就可明显察觉Intel对于业界发展方向的态度， Intel推出了为称作移动因特网设备（Mobile Internet Device, MID）的一款新型概念计算机而设计的Silverthorne处理器。未来将上演一场架构战：一方是主宰移动手机的ARM指令集，另...[详细]
大唐电信注资20亿元或将盘活中芯国际

　　业内传出消息，大唐电信科技产业集团(以下简称“大唐”)有望以20亿元左右取得中芯国际20%左右的股份。　　中芯国际战略引资一事即将尘埃落定，若不出意外，大唐电信将成为最终的主角。　　而之前曾传出中芯国际与国内外多家投资方接触，且与大唐电信科技产业集团(以下简称“大唐”)的谈判也已经进行了一段时间，业内传出消息，大唐电信科技产业集团(以下简称“大唐”)有望以20亿元左右取得中芯国际20...[详细]
英国截肢男子装仿生手后学开飞机（图）

　　7月28日英国伯克郡53岁男子雷·爱德华兹去年5月成为受惠于国家医疗服务系统的首位安装仿生手的截肢病人。现在,他正在学习独自一人驾驶飞机,即将成为英国首位拥有飞行执照的截肢病人。　　1980年,时年27岁的爱德华兹被确诊患有恶性淋巴瘤。与此同时,他的脾脏也被切除。1987年,爱德华兹工作时不小心划伤了手。数周后,他因伤口感染、四肢开始腐烂被送进医院。为挽救生命,医生给爱德华兹做了截...[详细]

器件捷径: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多