EE PLD, 20ns, CMOS, CDIP24, 0.250 X 1.250 INCH, SKINNY, CERAMIC, DIP-24
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
其他特性 | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
最大时钟频率 | 33.3 MHz |
JESD-30 代码 | R-GDIP-T24 |
长度 | 31.9405 mm |
专用输入次数 | 11 |
I/O 线路数量 | 10 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
可编程逻辑类型 | EE PLD |
传播延迟 | 20 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
5962-8984102LA | 5962-89841023A | 5962-8984101LA | 5962-8984104KA | 5962-89841053A | 5962-8984105LA | 5962-89841043A | 5962-89841013A | |
---|---|---|---|---|---|---|---|---|
描述 | EE PLD, 20ns, CMOS, CDIP24, 0.250 X 1.250 INCH, SKINNY, CERAMIC, DIP-24 | EE PLD, 20 ns, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 | EE PLD, 30ns, CMOS, CDIP24, 0.250 X 1.250 INCH, SKINNY, CERAMIC, DIP-24 | EE PLD, 25 ns, CDFP24, 0.375 X 0.625 INCH, CERPAK-24 | EE PLD, 15ns, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 | EE PLD, 15ns, CMOS, CDIP24, 0.250 X 1.250 INCH, SKINNY, CERAMIC, DIP-24 | EE PLD, 25 ns, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 | EE PLD, 30 ns, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 |
零件包装代码 | DIP | QLCC | DIP | DFP | QLCC | DIP | QLCC | QLCC |
包装说明 | DIP, | QCCN, | DIP, | DFP, | QCCN, | DIP, | QCCN, | QCCN, |
针数 | 24 | 28 | 24 | 24 | 28 | 24 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
最大时钟频率 | 33.3 MHz | 33.3 MHz | 25 MHz | 26.3 MHz | 50 MHz | 50 MHz | 26.3 MHz | 25 MHz |
JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 |
长度 | 31.9405 mm | 11.43 mm | 31.9405 mm | 15.367 mm | 11.43 mm | 31.9405 mm | 11.43 mm | 11.43 mm |
专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
端子数量 | 24 | 28 | 24 | 24 | 28 | 24 | 28 | 28 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | QCCN | DIP | DFP | QCCN | DIP | QCCN | QCCN |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 20 ns | 20 ns | 30 ns | 25 ns | 15 ns | 15 ns | 25 ns | 30 ns |
认证状态 | Not Qualified | MILITARY | Not Qualified | MILITARY | Not Qualified | Not Qualified | MILITARY | MILITARY |
座面最大高度 | 5.08 mm | 2.54 mm | 5.08 mm | 2.286 mm | 2.54 mm | 5.08 mm | 2.54 mm | 2.54 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD |
宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 10.29 mm | 11.43 mm | 7.62 mm | 11.43 mm | 11.43 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
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