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IDT72V36100L6BB

产品描述FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144
产品类别存储    存储   
文件大小466KB,共48页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72V36100L6BB概述

FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144

IDT72V36100L6BB规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA144,12X12,40
针数144
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间4 ns
其他特性RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
最大时钟频率 (fCLK)166 MHz
周期时间6 ns
JESD-30 代码S-PBGA-B144
JESD-609代码e0
长度13 mm
内存密度2359296 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量144
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA144,12X12,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源3.3 V
认证状态Not Qualified
座面最大高度1.97 mm
最大待机电流0.015 A
最大压摆率0.04 mA
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度13 mm
Base Number Matches1

文档预览

下载PDF文档
3.3 VOLT HIGH-DENSITY SUPERSYNC II™
36-BIT FIFO
65,536 x 36
131,072 x 36
IDT72V36100
IDT72V36110
FEATURES:
Choose among the following memory organizations:
IDT72V36100
65,536 x 36
IDT72V36110
131,072 x 36
Higher density, 2Meg and 4Meg SuperSync II FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (PBGA Only)
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Big-Endian/Little-Endian user selectable byte representation
5V input tolerant
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (PBGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 128-pin Thin Quad Flat Pack (TQFP) or a 144-pin Plastic
Ball Grid Array (PBGA) (with additional features)
Pin compatible to the SuperSync II (IDT72V3640/72V3650/72V3660/
72V3670/72V3680/72V3690) family
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
FUNCTIONAL BLOCK DIAGRAM
*Available on the PBGA package only.
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
LD SEN
*
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
65,536 x 36
131,072 x 36
WRITE POINTER
FLAG
LOGIC
READ POINTER
BE
IP
BM
IW
OW
MRS
PRS
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
*
*
**
*
TCK
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
OE
Q
0
-Q
n
(x36, x18 or x9)
REN
*
6117 drw01
IDT and the IDT logo are a registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
SEPTEMBER 2003
DSC-6117/10

IDT72V36100L6BB相似产品对比

IDT72V36100L6BB IDT72V36100L7-5BB IDT72V36100L15PFI IDT72V36100L15PF IDT72V36100L7-5PF IDT72V36100L10PF IDT72V36100L6PF IDT72V36110L15PFI IDT72V36110L10PF
描述 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO, 64KX36, 5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO, 64KX36, 10ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 64KX36, 10ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 64KX36, 5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 64KX36, 6.5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 64KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 128KX36, 10ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 128KX36, 6.5ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 BGA BGA QFP QFP QFP QFP QFP QFP QFP
包装说明 BGA, BGA144,12X12,40 BGA, BGA144,12X12,40 PLASTIC, TQFP-128 PLASTIC, TQFP-128 PLASTIC, TQFP-128 PLASTIC, TQFP-128 PLASTIC, TQFP-128 PLASTIC, TQFP-128 PLASTIC, TQFP-128
针数 144 144 128 128 128 128 128 128 128
Reach Compliance Code not_compliant _compli _compli _compli not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 4 ns 5 ns 10 ns 10 ns 5 ns 6.5 ns 4 ns 10 ns 6.5 ns
其他特性 RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
最大时钟频率 (fCLK) 166 MHz 133.3 MHz 66.7 MHz 66.7 MHz 133.3 MHz 100 MHz 166 MHz 66.7 MHz 100 MHz
周期时间 6 ns 7.5 ns 15 ns 15 ns 7.5 ns 10 ns 6 ns 15 ns 10 ns
JESD-30 代码 S-PBGA-B144 S-PBGA-B144 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 13 mm 13 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
内存密度 2359296 bit 2359296 bi 2359296 bi 2359296 bi 2359296 bit 2359296 bit 2359296 bit 4718592 bit 4718592 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 36 36 36 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
端子数量 144 144 128 128 128 128 128 128 128
字数 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 131072 words 131072 words
字数代码 64000 64000 64000 64000 64000 64000 64000 128000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C
组织 64KX36 64KX36 64KX36 64KX36 64KX36 64KX36 64KX36 128KX36 128KX36
可输出 YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装等效代码 BGA144,12X12,40 BGA144,12X12,40 QFP128,.63X.87,20 QFP128,.63X.87,20 QFP128,.63X.87,20 QFP128,.63X.87,20 QFP128,.63X.87,20 QFP128,.63X.87,20 QFP128,.63X.87,20
封装形状 SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 240 240 240 240 240 240 240
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.97 mm 1.97 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A
最大压摆率 0.04 mA 0.04 mA 0.04 mA 0.06 mA 0.04 mA 0.06 mA 0.04 mA 0.04 mA 0.06 mA
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 BALL BALL GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 1 mm 1 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 20 20 20 20 20 20
宽度 13 mm 13 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1 1 1 1 - -

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