电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT72V19160L10PFI

产品描述FIFO, 64KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80
产品类别存储    存储   
文件大小231KB,共26页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72V19160L10PFI概述

FIFO, 64KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80

IDT72V19160L10PFI规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码QFP
包装说明TQFP-80
针数80
Reach Compliance Code_compli
ECCN代码EAR99
最长访问时间6.5 ns
最大时钟频率 (fCLK)100 MHz
周期时间10 ns
JESD-30 代码S-PQFP-G80
JESD-609代码e0
长度14 mm
内存密度1048576 bi
内存集成电路类型OTHER FIFO
内存宽度16
湿度敏感等级3
功能数量1
端子数量80
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织64KX16
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP80,.64SQ
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.015 A
最大压摆率0.04 mA
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
3.3V MULTIMEDIA FIFO
16 BIT V-III, 32 BIT Vx-III FAMILY
UP TO 1 Mb DENSITY
IDT72V15160
IDT72V16160
IDT72V17160
IDT72V18160
IDT72V19160
IDT72V14320
IDT72V15320
IDT72V16320
IDT72V17320
IDT72V18320
IDT72V19320
FEATURES:
Choose among the following memory organizations: Commercial
V-III
Vx-III
IDT72V15160 - 4,096 x 16
IDT72V16160 - 8,192 x 16
IDT72V17160 - 16,384 x 16
IDT72V18160 - 32,768 x 16
IDT72V19160 - 65,536 x 16
IDT72V14320 - 1,024 x 32
IDT72V15320 - 2,048 x 32
IDT72V16320 - 4,096 x 32
IDT72V17320 - 8,192 x 32
IDT72V18320 - 16,384 x 32
IDT72V19320 - 32,768 x 32
Up to 100 MHz Operation of the Clocks
5V input tolerant
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags through serial input
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function (PBGA Only)
Available in a 80-pin (V-III) Thin Quad Flat Pack, 128-pin(Vx-III)
Thin Quad Flat Pack (TQFP) or a 144-pin (Vx-III) Plastic Ball Grid
Array (PBGA) (with additional features)
Industrial temperature range (–40°C to +85°C)
°
°
High-performance submicron CMOS technology
FUNCTIONAL BLOCK DIAGRAM
*
Available on the Vx-III PBGA package only.
MRS
WCLK
WEN
PRS
RCLK
REN
OE
D0 - Dn
Data In
x16, x32
FIFO ARRAY
Q0 - Qn
Data Out
x16, x32
WRITE
CONTROL
RESET LOGIC
READ
CONTROL
*
*
**
*
TCK
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
LD
SEN
SI
PFM
FLAG LOGIC
FSEL1
EF
FSEL0
HF
PAE
FF
PAF
6163 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
DSC-6163/2

IDT72V19160L10PFI相似产品对比

IDT72V19160L10PFI IDT72V15160L10PFI IDT72V18160L10PFI IDT72V16160L10PFI IDT72V17320L10PFI IDT72V19320L10BBI IDT72V16320L10BBI IDT72V16320L10PFI
描述 FIFO, 64KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80 FIFO, 4KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80 FIFO, 32KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80 FIFO, 8KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80 FIFO, 8KX32, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 32KX32, 6.5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO, 4KX32, 6.5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO, 4KX32, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFP QFP QFP QFP QFP BGA BGA QFP
包装说明 TQFP-80 TQFP-80 TQFP-80 TQFP-80 TQFP-128 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 TQFP-128
针数 80 80 80 80 128 144 144 128
Reach Compliance Code _compli _compli _compli not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns
最大时钟频率 (fCLK) 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
周期时间 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns 10 ns
JESD-30 代码 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 R-PQFP-G128 S-PBGA-B144 S-PBGA-B144 R-PQFP-G128
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 14 mm 14 mm 14 mm 14 mm 20 mm 13 mm 13 mm 20 mm
内存密度 1048576 bi 65536 bi 524288 bi 131072 bit 262144 bit 1048576 bit 131072 bit 131072 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 16 16 16 16 32 32 32 32
湿度敏感等级 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1
端子数量 80 80 80 80 128 144 144 128
字数 65536 words 4096 words 32768 words 8192 words 8192 words 32768 words 4096 words 4096 words
字数代码 64000 4000 32000 8000 8000 32000 4000 4000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 64KX16 4KX16 32KX16 8KX16 8KX32 32KX32 4KX32 4KX32
可输出 YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP LFQFP BGA BGA LFQFP
封装等效代码 QFP80,.64SQ QFP80,.64SQ QFP80,.64SQ QFP80,.64SQ QFP128,.63X.87,20 BGA144,12X12,40 BGA144,12X12,40 QFP128,.63X.87,20
封装形状 SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 240 240 240 225 225 240
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.97 mm 1.97 mm 1.6 mm
最大待机电流 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A
最大压摆率 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING BALL BALL GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm 1 mm 1 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD BOTTOM BOTTOM QUAD
处于峰值回流温度下的最长时间 20 20 20 20 20 30 30 20
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 13 mm 13 mm 14 mm

推荐资源

热门文章更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1404  2699  2892  1595  640  29  55  59  33  13 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved