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IDT72V19160L10PFGI

产品描述FIFO, 64KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80
产品类别存储    存储   
文件大小238KB,共26页
制造商IDT (Integrated Device Technology)
标准
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IDT72V19160L10PFGI概述

FIFO, 64KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80

IDT72V19160L10PFGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码QFP
包装说明TQFP-80
针数80
Reach Compliance Codecompli
ECCN代码EAR99
最长访问时间6.5 ns
周期时间10 ns
JESD-30 代码S-PQFP-G80
JESD-609代码e3
长度14 mm
内存密度1048576 bi
内存宽度16
湿度敏感等级3
功能数量1
端子数量80
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织64KX16
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

文档预览

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3.3V MULTIMEDIA FIFO
16 BIT V-III, 32 BIT Vx-III FAMILY
UP TO 1 Mb DENSITY
IDT72V15160
IDT72V16160
IDT72V17160
IDT72V18160
IDT72V19160
IDT72V14320
IDT72V15320
IDT72V16320
IDT72V17320
IDT72V18320
IDT72V19320
FEATURES:
Choose among the following memory organizations: Commercial
V-III
Vx-III
IDT72V15160 - 4,096 x 16
IDT72V16160 - 8,192 x 16
IDT72V17160 - 16,384 x 16
IDT72V18160 - 32,768 x 16
IDT72V19160 - 65,536 x 16
IDT72V14320 - 1,024 x 32
IDT72V15320 - 2,048 x 32
IDT72V16320 - 4,096 x 32
IDT72V17320 - 8,192 x 32
IDT72V18320 - 16,384 x 32
IDT72V19320 - 32,768 x 32
Up to 100 MHz Operation of the Clocks
5V input tolerant
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags through serial input
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function (PBGA Only)
Available in a 80-pin (V-III) Thin Quad Flat Pack, 128-pin(Vx-III)
Thin Quad Flat Pack (TQFP) or a 144-pin (Vx-III) Plastic Ball Grid
Array (PBGA) (with additional features)
Industrial temperature range (–40°C to +85°C)
°
°
High-performance submicron CMOS technology
FUNCTIONAL BLOCK DIAGRAM
*
Available on the Vx-III PBGA package only.
MRS
WCLK
WEN
PRS
RCLK
REN
OE
D0 - Dn
Data In
x16, x32
FIFO ARRAY
Q0 - Qn
Data Out
x16, x32
WRITE
CONTROL
RESET LOGIC
READ
CONTROL
*
*
**
*
TCK
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
LD
SEN
SI
PFM
FLAG LOGIC
FSEL1
EF
FSEL0
HF
PAE
FF
PAF
6163 drw01
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
DSC-6163/3

 
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