IC QUAD LINE DRIVER, PBGA64, 0.80 MM PITCH, FBGA-64, Line Driver or Receiver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) |
| 包装说明 | 0.80 MM PITCH, FBGA-64 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | EIA-644; TIA-644 |
| JESD-30 代码 | S-PBGA-B64 |
| JESD-609代码 | e0 |
| 长度 | 8 mm |
| 功能数量 | 4 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA64,8X8,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 座面最大高度 | 1.5 mm |
| 最大压摆率 | 47 mA |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8 mm |
| Base Number Matches | 1 |
| DS90C385SLC | DS90C385SLCX | DS90C385MDC | DS90C385MWC | |
|---|---|---|---|---|
| 描述 | IC QUAD LINE DRIVER, PBGA64, 0.80 MM PITCH, FBGA-64, Line Driver or Receiver | IC QUAD LINE DRIVER, PBGA64, 0.80 MM PITCH, FBGA-64, Line Driver or Receiver | IC QUAD LINE DRIVER, UUC, DIE, Line Driver or Receiver | IC QUAD LINE DRIVER, UUC, WAFER, Line Driver or Receiver |
| 厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| 包装说明 | 0.80 MM PITCH, FBGA-64 | 0.80 MM PITCH, FBGA-64 | DIE | WAFER |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 差分输出 | YES | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 | 4 |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | EIA-644; TIA-644 | EIA-644; TIA-644 | EIA-644; TIA-644 | EIA-644; TIA-644 |
| JESD-30 代码 | S-PBGA-B64 | S-PBGA-B64 | X-XUUC-N | X-XUUC-N |
| 功能数量 | 4 | 4 | 4 | 4 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -10 °C | -10 °C | -10 °C | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | LFBGA | LFBGA | DIE | DIE |
| 封装等效代码 | BGA64,8X8,32 | BGA64,8X8,32 | DIE OR CHIP | DIE OR CHIP |
| 封装形状 | SQUARE | SQUARE | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | UNCASED CHIP | UNCASED CHIP |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 47 mA | 60 mA | 60 mA | 60 mA |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | NO LEAD | NO LEAD |
| 端子位置 | BOTTOM | BOTTOM | UPPER | UPPER |
| Base Number Matches | 1 | 1 | 1 | 1 |
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