HB56G232 Series, HB56G132 Series
2,097,152-word
×
32-bit High Density Dynamic RAM Module
1,048,576-word
×
32-bit High Density Dynamic RAM Module
ADE-203-701A (Z)
Rev.1.0
Dec. 27, 1996
Description
The HB56G232 is a 2M
×
32 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM (HM5118160)
sealed in SOJ package. The HB56G132 is a 1M
×
32 dynamic RAM module, mounted 2 pieces of 16-Mbit
DRAM (HM5118160) sealed in SOJ package. An outline of the HB56G232, HB56G132 is 72-pin single
in-line package. Therefore, the HB56G232, HB56G132 make high density mounting possible without
surface mount technology. The HB56G232, HB56G132 provide common data inputs and outputs.
Decoupling capacitors are mounted on the module board.
Features
•
72-pin single in-line package
Outline: 107.95 mm (Length)
×
25.40 mm (Height)
×
9.14/5.28 mm (Thickness)
Lead pitch: 1.27 mm
•
Single 5 V (±5%) supply
•
High speed
Access time: t
RAC
= 60 /70ns (max)
•
Low power dissipation
Active mode: 1.84/1.63 W (max) (HB56G232 Series)
1.79/1.58 W (max) (HB56G132 Series)
Standby mode (TTL): 42 mW (max) (HB56G232 Series)
(TTL): 21 mW (max) (HB56G132 Series)
(CMOS): 3.15 mW (max) (L-version) (HB56G232 Series)
(CMOS): 1.58 mW (max) (L-version) (HB56G132 Series)
•
Fast page mode capability
•
Refresh period
1024 refresh cycles: 16 ms
128 ms (L-version)
HB56G232 Series, HB56G132 Series
Pin Description
Pin name
A0 to A9
Function
Address inputs:
Row address:
Column address:
Refresh address:
DQ0 to DQ31
CAS0
to
CAS3
RAS0
to
RAS3
WE
V
CC
V
SS
PD1 to PD4
NC
Data-in/Data-out
Column address strobe
Row address strobe
Read/Write enable
Power supply
Ground
Presence detect pin
No connection
A0 to A9
A0 to A9
A0 to A9
Presence Detect Pin Arrangement
(HB56G232)
Function
Pin No.
67
68
69
70
Pin name
PD1
PD2
PD3
PD4
60 ns
NC
NC
NC
NC
70 ns
NC
NC
V
SS
NC
Presence Detect Pin Arrangement
(HB56G132)
Function
Pin No.
67
68
69
70
Pin name
PD1
PD2
PD3
PD4
60 ns
V
SS
V
SS
NC
NC
70 ns
V
SS
V
SS
V
SS
NC
4