HC49/US (AT49) LOW PROFILE SMD MICROPROCESSOR CRYSTAL
ABLS3 Series
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11.4 x 4.7 x 2.7 mm
RoHS/RoHS II Compliant
MSL Level = N/A
Key Electrical Specifications
Parameters
Minimum
3.579545
Frequency Range
24.000001
24.000001
Operation Mode
Operating Temperature
Storage Temperature
Frequency Tolerance @+25°C
Frequency Stability over the Operating
Temperature ( ref. to +25°C)
Equivalent series resistance (R1)
Shunt capacitance (C0)
Load capacitance (CL)
Drive Level
Aging
Insulation Resistance
Typical
-----
-----
-----
Maximum
24.000000
50.000000
70.000000
ºC
ºC
ppm
MHz
Units
Notes
Fundamental AT
(Standard)
Fundamental AT or
BT
(See options)
3
rd
Overtone
(Standard)
See options
See options
See options
(For BT cut,
±100ppm max.at -
10° C to +60° C
only)
Fundamental or 3rd Overtone
0
-----
+70
-55
-----
+125
-50
-----
+50
-50
-----
+50
ppm
-----
-----
-----
-5
See table 1 below
-----
18
100
-----
7
-----
1000
+5
Ω
pF
pF
µW
ppm
@25°C±3°C
First year
@ 100Vdc ± 15V
Standard (See
options if other than
STD)
Drive level dependency (DLD)
500
-----
-----
MΩ
Minimum 7 points tested: from 1µW to 500µW.
Change in frequency (Maximum - Minimum) over DLD range < ±10ppm
Change in ESR (Maximum - Minimum) over DLD range < 25% of Max ESR
value.
Maximum ESR over DLD range < Max ESR value.
5101 Hidden Creek Ln Spicewood TX 78669
Phone: 512-371-6159 | Fax: 512-351-8858
For terms and conditions of sales, please visit:
www.abracon.com
REVISED:
02-15-22
ABRACON IS
ISO9001-2015
CERTIFIED
HC49/US (AT49) LOW PROFILE SMD MICROPROCESSOR CRYSTAL
ABLS3 Series
TABLE 1: ESR
FREQUENCY (MHz)
ESR (Ω)
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11.4 x 4.7 x 2.7 mm
RoHS/RoHS II Compliant
MSL Level = N/A
3.579545 - 4.999 (Fund.)
5.000 - 5.999 (Fund.)
6.000 - 7.999 (Fund.)
8.000 - 8.999 (Fund.)
9.000 - 9.999 (Fund.)
10.000 - 15.999 (Fund.)
16.000 - 50.000 (Fund.)
24.01 - 31.999 (3rd O/T)
32.000 - 70.00 (3rd O/T)
180
120
100
80
60
50
40
100
80
Options and Part Identification (left blank if standard)
ABLS3 -
Frequency in MHz
Please specify the frequency
in MHz. e.g. 14.31818MHz
MHz -
-
-
-
-
Packaging
Blank: Bulk
T: Tape & Reel
Oscillation Mode
F: Fund. AT>24MHz
FB: Fund. BT>24MHz
Operating Temp.
A: -10°C ~ +60°C
B: -20°C ~ +70°C
C: -30°C ~ +70°C
N: -30°C ~ +85°C
D: -40°C ~ +85°C
J*: -40°C ~ +105°C
K*: -40°C ~ +125°C
L*: -55°C ~ +125°C
Freq. Tolerance
H5: ± 5 ppm
1: ± 10 ppm
7: ± 15 ppm
2: ± 20 ppm
3: ± 25 ppm
4: ± 30 ppm
Freq. Stability
U**: ± 10 ppm
G: ± 15 ppm
X: ± 20 ppm
W: ± 25 ppm
Y: ± 30 ppm
H: ± 35 ppm
Q: ± 100 ppm
R: ± 150 ppm
Load Capacitance (pF)
Please specify CL
(Minimum 10pF) in pF or
S for series
Custom ESR if other
than standard
R□
□: Specify a value in Ω
(e.g.: R40)
NOTE: Fundamental BT frequency stability ± 100ppm max. at -10° C to +60° C only.
* Frequency stability ±50ppm, ±100ppm, ±150ppm only.
** -10 to +60C only.
Contact ABRACON for tighter frequency stability.
5101 Hidden Creek Ln Spicewood TX 78669
Phone: 512-371-6159 | Fax: 512-351-8858
For terms and conditions of sales, please visit:
www.abracon.com
REVISED:
02-15-22
ABRACON IS
ISO9001-2015
CERTIFIED
HC49/US (AT49) LOW PROFILE SMD MICROPROCESSOR CRYSTAL
ABLS3 Series
Mechanical Dimensions
Request Samples
Check Inventory
11.4 x 4.7 x 2.7 mm
RoHS/RoHS II Compliant
MSL Level = N/A
Dimensions: inches (mm)
Sealing Method = Resistance Weld Sealing
5101 Hidden Creek Ln Spicewood TX 78669
Phone: 512-371-6159 | Fax: 512-351-8858
For terms and conditions of sales, please visit:
www.abracon.com
REVISED:
02-15-22
ABRACON IS
ISO9001-2015
CERTIFIED
HC49/US (AT49) LOW PROFILE SMD MICROPROCESSOR CRYSTAL
ABLS3 Series
Request Samples
Check Inventory
11.4 x 4.7 x 2.7 mm
RoHS/RoHS II Compliant
MSL Level = N/A
Packing
T =tape and reel (1000pcs/reel)
Dimensions: mm
5101 Hidden Creek Ln Spicewood TX 78669
Phone: 512-371-6159 | Fax: 512-351-8858
For terms and conditions of sales, please visit:
www.abracon.com
REVISED:
02-15-22
ABRACON IS
ISO9001-2015
CERTIFIED
HC49/US (AT49) LOW PROFILE SMD MICROPROCESSOR CRYSTAL
ABLS3 Series
Reflow Profile [JEDEC J-STD-020]
Request Samples
Check Inventory
11.4 x 4.7 x 2.7 mm
RoHS/RoHS II Compliant
MSL Level = N/A
Table 1
SnPb Eutectic Process
Classification Temperatures (T
c
)
Package
Thickness
<2.5 mm
>2.5 mm
Volume mm
3
<350
235 °C
220 °C
Volume mm
3
>350
220 °C
220 °C
Table 2
Pb-Free Process
Classification Temperatures (T
c
)
Package
Thickness
<1.6 mm
1.6 mm - 2.5 mm
>2.5 mm
Volume mm
3
<350
260 °C
260 °C
250 °C
Volume mm
3
350-2000
260 °C
250 °C
245 °C
Volume mm
3
>2000
260 °C
245 °C
245 °C
Profile Feature
Preheat / soak
Temperature minimum (T
smin
)
Temperature maximum (T
smax
)
Time (T
smin
to T
smax
) (t
s
)
Average ramp-up rate (T
smax
to T
P
)
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
Peak package body temperature (T
P
)*
Time (t
p
)**
within 5°C of the specified classification temperature (T
C
)
Ramp-down rate (T
p
to T
smax
)
Time 25°C to peak temperature
Reflow cycles
*Tolerance
for peak profile temperature (T
P
) is defined as a supplier minimum and a user maximum.
Sn-Pb Eutectic
Assembly
100°C
150°C
60 - 120 sec.
3°C/sec. max
183°C
60 - 150 sec.
see Table 1
20 sec.
6°C/sec. max
6 min. max
2 max
Pb-Free
Assembly
150°C
200°C
60 - 120 sec.
3°C/sec. max
217°C
60 - 150 sec.
see Table 2
30 sec.
6°C/sec. max
8 min. max
2 max
**Tolerance
for time at peak profile temperature (t
p
) is defined as supplier minimum and a user maximum.
ATTENTION:
Abracon LLC’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applications. Abracon’s products
are not specifically designed for Military, Aviation, Aerospace, Life-dependent Medical applications or any application requiring high reliability where component failure could result in loss of life
and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and authorization from Abracon LLC is required. Please contact
Abracon LLC for more information.
5101 Hidden Creek Ln Spicewood TX 78669
Phone: 512-371-6159 | Fax: 512-351-8858
For terms and conditions of sales, please visit:
www.abracon.com
REVISED:
02-15-22
ABRACON IS
ISO9001-2015
CERTIFIED
嵌入式系统
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