Datasheet> 器件分类 > 连接器> 连接器> SEAF8-10-05.0-S-04-2-K

SEAF8-10-05.0-S-04-2-K: 产品描述Board Stacking Connector, 40 Contact(s), 4 Row(s), Female, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator; 产品类别连接器连接器; 文件大小1MB，共1页; 制造商SAMTEC; 官网地址http://www.samtec.com/; 标准

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SEAF8-10-05.0-S-04-2-K概述

Board Stacking Connector, 40 Contact(s), 4 Row(s), Female, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator

SEAF8-10-05.0-S-04-2-K规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	SAMTEC
Reach Compliance Code	compliant
Factory Lead Time	3 weeks
板上安装选件	PEG
主体宽度	0.228 inch
主体深度	0.179 inch
主体长度	0.545 inch
连接器类型	BOARD STACKING CONNECTOR
联系完成配合	GOLD (30) OVER NICKEL (50)
联系完成终止	Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别	FEMALE
触点材料	COPPER ALLOY
触点模式	RECTANGULAR
触点样式	BELLOWED TYPE
绝缘体颜色	BLACK
绝缘体材料	LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码	e3
插接触点节距	0.032 inch
安装选项1	LOCKING
安装方式	STRAIGHT
安装类型	BOARD
连接器数	ONE
PCB行数	4
装载的行数	4
最高工作温度	125 °C
最低工作温度	-55 °C
PCB接触模式	RECTANGULAR
电镀厚度	30u inch
极化密钥	POLARIZED HOUSING
额定电流（信号）	1.4 A
可靠性	COMMERCIAL
端子节距	0.7874 mm
端接类型	SURFACE MOUNT
触点总数	40
Base Number Matches	1

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F213 (Rev 28AUG13)

SEAF8–30–05.0–S–06–2–K

(0,80 mm) .0315"

SEAF8 SERIES

SEAF8–30–05.0–S–04–2–K

ULTRA HIGH DENSITY OPEN PIN FIELD

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?SEAF8

Insulator Material:

Black LCP

Contact Material:

Copper Alloy

Operating Temp Range:

-55°C to +125°C

Plating:

Au or Sn over

50µ" (1,27 µm) Ni

Working Voltage:

220 VAC

RoHS Compliant:

Yes

Lead-Free Solderable:

Yes

Mates with:

SEAM8

™

Signal Integrity optimized

Edge Rate

™

contact

Up to

300 I/Os

7 mm and 10 mm

Stack Heights

fin

4 and 6 row

Lead-Free

Solder

Charge

Terminations

PATENT PENDING

RECOGNITIONS

For complete scope

of recognitions see

www.samtec.com/quality

SEAM8/SEAF8

Rated @ 3dB Insertion Loss*

7 mm Stack Height

Single-Ended Signaling

14 GHz / 28 Gbps

*Test board losses de-embedded from performance data.

Performance data for other stack heights and complete test data

available at www.samtec.com?SEAF8 or contact sig@samtec.com

SEAF8

NO. PINS

PER ROW

05.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

–K

= Polyimide

ﬁlm Pick &

Place Pad

–S

–10, – 20, – 30, –40, –50

(Standard sizes)

= 30µ"

(0,76 µm)

Gold on

contact area,

Matte Tin on

solder tail

– 04

=Four Rows

–2

= Lead-Free

Tin Alloy

95.5% Sn/3.8%

Ag/0.7%Cu

Solder Charge

– 06

=Six Rows

ALSO AVAILABLE

(MOQ Required)

• Other pin counts

Contact Samtec.

MATED HEIGHT*

SEAF8

LEAD

STYLE

SEAM8 LEAD STYLE

No. of positions x

(0,80) .0315 + (5,84) .230

(0,75)

.029

NO. OF

ROWS

–04

(4,30)

.169

(6,30)

.248

–S02.0

(7,00) .276

–S05.0

(10,00) .394

–05.0

–06

*Processing conditions will affect

mated height.

(1,27)

.050

(1,10) (1,32)

(1,32)

.043 x .052

.052 DIA

No. of positions x

(0,80) .0315 + (2,56) .101

(4,70)

.185

(2,87)

.113

(0,80)

.0315

Note:

Patent Pending

Note:

Tape & Reel packaging

is standard.

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

WWW.SAMTEC.COM

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