16-BIT, 50MHz, OTHER DSP, CQFP132, TIE BAR, CERAMIC, QFP-132
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP |
| 包装说明 | TIE BAR, CERAMIC, QFP-132 |
| 针数 | 132 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 16 |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-CQFP-F132 |
| 低功率模式 | YES |
| 外部中断装置数量 | 5 |
| 端子数量 | 132 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 最大压摆率 | 225 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| 5962-9455803QYX | 5962-9455803QXX | 5962-9455804QYX | 5962-9455804QXX | |
|---|---|---|---|---|
| 描述 | 16-BIT, 50MHz, OTHER DSP, CQFP132, TIE BAR, CERAMIC, QFP-132 | 16-BIT, 50MHz, OTHER DSP, CPGA141, CERAMIC, PGA-141 | 16-BIT, 66.66MHz, OTHER DSP, CQFP132, TIE BAR, CERAMIC, QFP-132 | 16-BIT, 66.66MHz, OTHER DSP, CPGA141, CERAMIC, PGA-141 |
| 零件包装代码 | QFP | PGA | QFP | PGA |
| 包装说明 | TIE BAR, CERAMIC, QFP-132 | PGA, | QFF, | PGA, |
| 针数 | 132 | 141 | 132 | 141 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 地址总线宽度 | 16 | 16 | 16 | 16 |
| 桶式移位器 | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES |
| 最大时钟频率 | 50 MHz | 50 MHz | 66.66 MHz | 66.66 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-CQFP-F132 | S-CPGA-P141 | S-CQFP-F132 | S-CPGA-P141 |
| 低功率模式 | YES | YES | YES | YES |
| 外部中断装置数量 | 5 | 5 | 5 | 5 |
| 端子数量 | 132 | 141 | 132 | 141 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF | PGA | QFF | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE |
| 认证状态 | Qualified | Qualified | Qualified | Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q |
| 最大压摆率 | 225 mA | 225 mA | 225 mA | 225 mA |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | PIN/PEG | FLAT | PIN/PEG |
| 端子位置 | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 |
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