Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Harris |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
标称负供电电压 (Vsup) | -15 V |
信道数量 | 4 |
功能数量 | 1 |
端子数量 | 16 |
通态电阻匹配规范 | 4.5 Ω |
最大通态电阻 (Ron) | 900 Ω |
最高工作温度 | 75 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | +-15 V |
认证状态 | Not Qualified |
最大信号电流 | 0.02 A |
最大供电电流 (Isup) | 2 mA |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
最长断开时间 | 650 ns |
最长接通时间 | 750 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
HI3-0539-5 | HI1-0539-2 | HI1-0539-4 | HI1-0539-8 | HI1-0539-5 | HI4P0539-5 | |
---|---|---|---|---|---|---|
描述 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PQCC20 |
厂商名称 | Harris | Harris | Harris | Harris | Harris | Harris |
包装说明 | DIP, DIP16,.3 | , | , | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | unknown | unknown | unknown | unknow | unknow | unknow |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-PDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | S-PQCC-J20 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
信道数量 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 20 |
通态电阻匹配规范 | 4.5 Ω | 4.5 Ω | 4.5 Ω | 4.5 Ω | 4.5 Ω | 4.5 Ω |
最大通态电阻 (Ron) | 900 Ω | 900 Ω | 900 Ω | 900 Ω | 900 Ω | 900 Ω |
最高工作温度 | 75 °C | 125 °C | 85 °C | 125 °C | 75 °C | 75 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | NO | NO | YES |
最长断开时间 | 650 ns | 650 ns | 650 ns | 650 ns | 650 ns | 650 ns |
最长接通时间 | 750 ns | 750 ns | 750 ns | 750 ns | 750 ns | 750 ns |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | MILITARY | OTHER | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
JESD-609代码 | e0 | - | - | e0 | e0 | e0 |
封装代码 | DIP | - | - | DIP | DIP | QCCJ |
封装等效代码 | DIP16,.3 | - | - | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ |
电源 | +-15 V | - | - | +-15 V | +-15 V | +-15 V |
最大信号电流 | 0.02 A | - | - | 0.02 A | 0.02 A | 0.02 A |
最大供电电流 (Isup) | 2 mA | - | - | 2 mA | 2 mA | 2 mA |
切换 | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 1.27 mm |
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