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PLMUEPC-88

产品描述88-pin ufbga adaptor
产品类别模块/解决方案   
文件大小619KB,共36页
制造商Altera (Intel)
标准  
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PLMUEPC-88概述

88-pin ufbga adaptor

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Enhanced Configuration (EPC) Devices
Datasheet
CF52002-3.0
Datasheet
This datasheet describes enhanced configuration (EPC) devices.
Supported Devices
Table 1
lists the supported Altera
EPC devices.
Table 1. Altera EPC Devices
Device
EPC4
EPC8
EPC16
Memory Size
(bits)
4,194,304
8,388,608
16,777,216
On-Chip
Decompression
Support
Yes
Yes
Yes
ISP Support
Yes
Yes
Yes
Cascading
Support
No
No
No
Reprogrammable
Yes
Yes
Yes
Recommended
Operating
Voltage (V)
3.3
3.3
3.3
Features
EPC devices offer the following features:
Single-chip configuration solution for Altera ACEX
1K, APEX
20K (including
APEX 20K, APEX 20KC, and APEX 20KE), APEX II, Arria
GX, Cyclone
,
Cyclone II, FLEX
10K (including FLEX 10KE and FLEX 10KA), Mercury
,
Stratix
II, and Stratix II GX devices
Contains 4-, 8-, and 16-Mb flash memories for configuration data storage
On-chip decompression feature almost doubles the effective configuration
density
Standard flash die and a controller die combined into single stacked chip package
External flash interface supports parallel programming of flash and external
processor access to unused portions of memory
Flash memory block or sector protection capability using the external flash
interface
Supported in EPC4 and EPC16 devices
Page mode support for remote and local reconfiguration with up to eight
configurations for the entire system
Compatible with Stratix series remote system configuration feature
Supports byte-wide configuration mode fast passive parallel (FPP) with an 8-bit
data output per
DCLK
cycle
Supports true
n-bit
concurrent configuration (n = 1, 2, 4, and 8) of Altera FPGAs
101 Innovation Drive
San Jose, CA 95134
www.altera.com
© 2012 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS,
QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark
Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their
respective holders as described at
www.altera.com/common/legal.html.
Altera warrants performance of its semiconductor
products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any
products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use
of any information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are
advised to obtain the latest version of device specifications before relying on any published information and before placing orders
for products or services.
ISO
9001:2008
Registered
January 2012
Altera Corporation
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PLMUEPC-88相似产品对比

PLMUEPC-88 EPC16QI100N EPC4QI100N EPC4QC100N EPC16UI88N
描述 88-pin ufbga adaptor 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 fpga - configuration memory IC - ser. config mem flash 4mb 66 mhz fpga - configuration memory IC - ser. config mem flash 16mb 33 mhz
是否无铅 - 不含铅 不含铅 不含铅 -
是否Rohs认证 - 符合 符合 符合 符合
厂商名称 - Altera (Intel) - Altera (Intel) Altera (Intel)
零件包装代码 - QFP QFP QFP -
包装说明 - PLASTIC, QFP-100 PLASTIC, QFP-100 PLASTIC, QFP-100 -
针数 - 100 100 100 -
Reach Compliance Code - unknow unknown unknown unknow
ECCN代码 - EAR99 EAR99 EAR99 EAR99
最大时钟频率 (fCLK) - 66.7 MHz 66.7 MHz 66.7 MHz 66.7 MHz
JESD-30 代码 - R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PBGA-B88
JESD-609代码 - e3 e3 e3 e1
长度 - 20 mm 20 mm 20 mm -
内存密度 - 16777216 bi 4194304 bit 4194304 bit 16777216 bi
内存集成电路类型 - CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
内存宽度 - 16 16 16 -
湿度敏感等级 - 3 3 3 3
功能数量 - 1 1 1 -
端子数量 - 100 100 100 88
字数 - 1048576 words 262144 words 262144 words -
字数代码 - 1000000 256000 256000 -
工作模式 - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
最高工作温度 - 85 °C 85 °C 70 °C 85 °C
最低工作温度 - -40 °C -40 °C - -40 °C
组织 - 1MX16 256KX16 256KX16 -
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - QFP QFP QFP FBGA
封装等效代码 - QFP100,.7X.9 QFP100,.7X.9 QFP100,.7X.9 BGA88,8X12,32
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - FLATPACK FLATPACK FLATPACK GRID ARRAY, FINE PITCH
并行/串行 - PARALLEL PARALLEL PARALLEL SERIAL
峰值回流温度(摄氏度) - 245 245 245 -
电源 - 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 2.15 mm 3.4 mm 3.4 mm -
最大待机电流 - 0.00015 A 0.00015 A 0.00015 A 0.00015 A
最大压摆率 - 0.09 mA 0.09 mA 0.09 mA 0.09 mA
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V -
最小供电电压 (Vsup) - 3 V 3 V 3 V -
标称供电电压 (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 - YES YES YES YES
技术 - CMOS CMOS CMOS CMOS
温度等级 - INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 - Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 - GULL WING GULL WING GULL WING BALL
端子节距 - 0.65 mm 0.65 mm 0.65 mm 0.8 mm
端子位置 - QUAD QUAD QUAD BOTTOM
处于峰值回流温度下的最长时间 - 40 40 40 -
类型 - NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 - 14 mm 14 mm 14 mm -
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