Bus Transceiver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL |
控制类型 | COMMON CONTROL |
计数方向 | BIDIRECTIONAL |
系列 | ACT |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
逻辑集成电路类型 | BUS TRANSCEIVER |
最大I(ol) | 0.024 A |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 9 ns |
传播延迟(tpd) | 9 ns |
认证状态 | Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
翻译 | N/A |
宽度 | 8.89 mm |
Base Number Matches | 1 |
5962-9218701M2A | 5962-9218701MRA | 5962-9218701MSA | |
---|---|---|---|
描述 | Bus Transceiver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CQCC20, CERAMIC, LCC-20 | Bus Transceiver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, CERAMIC, DIP-20 | Bus Transceiver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, CERPACK-20 |
零件包装代码 | QLCC | DIP | DFP |
包装说明 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DFP, FL20,.3 |
针数 | 20 | 20 | 20 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
其他特性 | WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL | WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL | WITH COMMON OUTPUT ENABLE AND DIRECTION CONTROL |
控制类型 | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
系列 | ACT | ACT | ACT |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 |
JESD-609代码 | e0 | e0 | e0 |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A |
位数 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | DFP |
封装等效代码 | LCC20,.35SQ | DIP20,.3 | FL20,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | FLATPACK |
电源 | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 9 ns | 9 ns | 9 ns |
传播延迟(tpd) | 9 ns | 9 ns | 9 ns |
认证状态 | Qualified | Qualified | Qualified |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
座面最大高度 | 1.905 mm | 5.08 mm | 2.286 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL |
翻译 | N/A | N/A | N/A |
宽度 | 8.89 mm | 7.62 mm | 6.731 mm |
Base Number Matches | 1 | 1 | 1 |
长度 | 8.89 mm | 24.51 mm | - |
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