128Mb: x16, x32 Mobile LPDDR SDRAM
Features
Mobile Low-Power DDR SDRAM
MT46H8M16LF – 2 Meg x 16 x 4 Banks
MT46H4M32LF – 1 Meg x 32 x 4 Banks
Features
• V
DD
/V
DDQ
= 1.70–1.95V
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR) architec-
ture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• 4 internal banks for concurrent operation
• Data masks (DM) for masking write data; one mask
per byte
• Programmable burst lengths (BL): 2, 4, 8, or 16
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• Temperature-compensated self refresh (TCSR)
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Status read register (SRR)
• Selectable output drive strength (DS)
• Clock stop capability
• 64ms refresh
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
-5
-54
-6
-75
Clock Rate
200 MHz
185 MHz
166 MHz
133 MHz
Access Time
5.0ns
5.0ns
5.0ns
6.0ns
Options
• V
DD
/V
DDQ
– 1.8V/1.8V
• Configuration
– 8 Meg x 16 (2 Meg x 16 x 4
banks)
– 4 Meg x 32 (1 Meg x 32 x 4
banks)
• Row size option
– JEDEC-standard option
• Plastic "green" package
– 60-ball VFBGA (8mm x 9mm)
1
– 90-ball VFBGA (8mm x 13mm)
2
• Timing – cycle time
– 5ns @ CL = 3 (200 MHz)
– 5.4ns @ CL = 3 (185 MHz)
– 6ns @ CL = 3 (166 MHz)
– 7.5ns @ CL = 3 (133 MHz)
• Operating temperature range
– Commercial (0˚ to +70˚C)
– Industrial (–40˚C to +85˚C)
• Design revision
Notes:
Marking
H
8M16
4M32
LF
BF
B5
-5
-54
-6
-75
None
IT
:K
1. Only available for x16 configuration.
2. Only available for x32 configuration.
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2007 Micron Technology, Inc. All rights reserved.
128Mb: x16, x32 Mobile LPDDR SDRAM
Features
Table 2: Configuration Addressing
Architecture
Configuration
Refresh count
Row addressing
Column addressing
8 Meg x 16
2 Meg x 16 x 4 banks
4K
4K A[11:0]
512 A[8:0]
4 Meg x 32
1 Meg x 32 x 4 banks
4K
4K A[11:0]
256 A[7:0]
Figure 1: 128Mb Mobile LPDDR Part Numbering
MT 46
Micron Technology
Product Family
46 = Mobile LPDDR
H
8M16
LF BF -6
IT
:K
Design Revision
:K
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Operating Voltage
H = 1.8/1.8V
Cycle Time (CL = 3)
-5 = 5ns
t
CK
Configuration
8 Meg x 16
4 Meg x 32
-54 = 5.4ns
t
CK
-6 = 6ns
t
CK
-75 = 7.5ns
t
CK
Addressing
LF = JEDEC-standard addressing
Package Codes
BF = 8mm x 9mm VFBGA, “green”
B5 = 8mm x 13mm VFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at
www.micron.com/decoder.
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2007 Micron Technology, Inc. All rights reserved.
128Mb: x16, x32 Mobile LPDDR SDRAM
Features
Contents
General Description ......................................................................................................................................... 8
Functional Block Diagrams ............................................................................................................................... 9
Ball Assignments ............................................................................................................................................ 11
Ball Descriptions ............................................................................................................................................ 13
Package Dimensions ....................................................................................................................................... 15
Electrical Specifications .................................................................................................................................. 17
Electrical Specifications – I
DD
Parameters ........................................................................................................ 20
Electrical Specifications – AC Operating Conditions ......................................................................................... 24
Output Drive Characteristics ........................................................................................................................... 29
Functional Description ................................................................................................................................... 32
Commands .................................................................................................................................................... 33
DESELECT ................................................................................................................................................. 34
NO OPERATION ......................................................................................................................................... 34
LOAD MODE REGISTER ............................................................................................................................. 34
ACTIVE ...................................................................................................................................................... 34
READ ......................................................................................................................................................... 35
WRITE ....................................................................................................................................................... 36
PRECHARGE .............................................................................................................................................. 37
BURST TERMINATE ................................................................................................................................... 38
AUTO REFRESH ......................................................................................................................................... 38
SELF REFRESH ........................................................................................................................................... 39
DEEP POWER-DOWN ................................................................................................................................. 39
Truth Tables ................................................................................................................................................... 40
State Diagram ................................................................................................................................................ 45
Initialization .................................................................................................................................................. 46
Standard Mode Register .................................................................................................................................. 49
Burst Length .............................................................................................................................................. 50
Burst Type .................................................................................................................................................. 50
CAS Latency ............................................................................................................................................... 51
Operating Mode ......................................................................................................................................... 52
Extended Mode Register ................................................................................................................................. 53
Temperature-Compensated Self Refresh ...................................................................................................... 53
Partial-Array Self Refresh ............................................................................................................................ 54
Output Drive Strength ................................................................................................................................ 54
Status Read Register ....................................................................................................................................... 55
Bank/Row Activation ...................................................................................................................................... 57
READ Operation ............................................................................................................................................. 58
WRITE Operation ........................................................................................................................................... 69
PRECHARGE Operation .................................................................................................................................. 81
Auto Precharge ............................................................................................................................................... 81
Concurrent Auto Precharge ......................................................................................................................... 82
AUTO REFRESH Operation ............................................................................................................................. 87
SELF REFRESH Operation ............................................................................................................................... 88
Power-Down .................................................................................................................................................. 89
Deep Power-Down ..................................................................................................................................... 91
Clock Change Frequency ................................................................................................................................ 93
Revision History ............................................................................................................................................. 94
Rev. F, Production – 02/10 ........................................................................................................................... 94
Rev. E, Production – 8/09 ............................................................................................................................ 94
Rev. D, Production – 04/09 .......................................................................................................................... 94
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2007 Micron Technology, Inc. All rights reserved.
128Mb: x16, x32 Mobile LPDDR SDRAM
Features
Rev. C, Production – 10/08 .......................................................................................................................... 94
Rev. B, Preliminary – 05/08 .......................................................................................................................... 94
Rev. A, Advance – 04/08 ............................................................................................................................... 94
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2007 Micron Technology, Inc. All rights reserved.
128Mb: x16, x32 Mobile LPDDR SDRAM
Features
List of Tables
Table 1: Key Timing Parameters (CL = 3) ........................................................................................................... 1
Table 2: Configuration Addressing ................................................................................................................... 2
Table 3: Ball Descriptions .............................................................................................................................. 13
Table 4: Absolute Maximum Ratings .............................................................................................................. 17
Table 5: AC/DC Electrical Characteristics and Operating Conditions ............................................................... 17
Table 6: Capacitance (x16, x32) ...................................................................................................................... 19
Table 7: I
DD
Specifications and Conditions (x16) ............................................................................................. 20
Table 8: I
DD
Specifications and Conditions (x32) ............................................................................................. 21
Table 9: I
DD
6 Specifications and Conditions ................................................................................................... 22
Table 10: Electrical Characteristics and Recommended AC Operating Conditions ............................................ 24
Table 11: Target Output Drive Characteristics (Full Strength) ........................................................................... 29
Table 12: Target Output Drive Characteristics (Three-Quarter Strength) .......................................................... 30
Table 13: Target Output Drive Characteristics (One-Half Strength) .................................................................. 31
Table 14: Truth Table – Commands ................................................................................................................ 33
Table 15: DM Operation Truth Table .............................................................................................................. 34
Table 16: Truth Table – Current State Bank
n
– Command to Bank
n
................................................................ 40
Table 17: Truth Table – Current State Bank
n
– Command to Bank
m
............................................................... 42
Table 18: Truth Table – CKE ........................................................................................................................... 44
Table 19: Burst Definition Table ..................................................................................................................... 50
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2007 Micron Technology, Inc. All rights reserved.