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MT46H64M32LFCX-48 IT:B TR: 产品描述IC lpddr sdram 2gbit vfbga; 产品类别存储; 文件大小1MB，共105页; 制造商Micron(美光); 官网地址http://www.micron.com/; 标准

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MT46H64M32LFCX-48 IT:B TR概述

IC lpddr sdram 2gbit vfbga

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2Gb: x16, x32 Mobile LPDDR SDRAM

Features

Mobile Low-Power DDR SDRAM

MT46H128M16LF – 32 Meg x 16 x 4 Banks

MT46H64M32LF – 16 Meg x 32 x 4 Banks

MT46H128M32L2 – 16 Meg x 32 x 4 Banks x 2

MT46H256M32L4 – 32 Meg x 16 x 4 Banks x 4

MT46H256M32R4 - 32 Meg x 16 x 4 Banks x 4

Features

• V

DDQ

= 1.70–1.95V

• Bidirectional data strobe per byte of data (DQS)

• Internal, pipelined double data rate (DDR)

architecture; two data accesses per clock cycle

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

aligned with data for WRITEs

• 4 internal banks for concurrent operation

• Data masks (DM) for masking write data; one mask

per byte

• Programmable burst lengths (BL): 2, 4, 8, or 16

• Concurrent auto precharge option is supported

• Auto refresh and self refresh modes

• 1.8V LVCMOS-compatible inputs

• Temperature-compensated self refresh (TCSR)

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Status read register (SRR)

• Selectable output drive strength (DS)

• Clock stop capability

• 64ms refresh; 32ms for the automotive temperature

range

Table 1: Key Timing Parameters (CL = 3)

Speed Grade

-5

-54

-6

-75

Clock Rate

200 MHz

185 MHz

166 MHz

133 MHz

Access Time

5.0ns

6.0ns

Options

• V

DDQ

– 1.8V/1.8V

• Configuration

– 128 Meg x 16 (32 Meg x 16 x 4

banks)

– 64 Meg x 32 (16 Meg x 32 x 4

banks)

• Addressing

– JEDEC-standard

– Reduced page-size

– 4-die stack reduced page-size

– 2-die stack standard

– 4-die stack standard

• Plastic "green" package

– 60-ball VFBGA (10mm x 10mm)

– 90-ball VFBGA (9mm x 13mm)

• PoP (plastic "green" package)

– 168-ball VFBGA (12mm x 12mm)

– 168-ball WFBGA (12mm x 12mm)

– 240-ball WFBGA (14mm x 14mm)

• Timing – cycle time

– 5ns @ CL = 3 (200 MHz)

– 5.4ns @ CL = 3 (185 MHz)

– 6ns @ CL = 3 (166 MHz)

– 7.5ns @ CL = 3 (133 MHz)

• Power

– Standard I

DD2

DD6

• Operating temperature range

– Commercial (0˚ to +70˚C)

– Wireless (–25˚C to +85˚C)

– Industrial (–40˚C to +85˚C)

– Automotive (–40˚C to +105˚C)

• Design revision

Notes:

Marking

128M16

64M32

-5

-54

-6

-75

None

Contact factory for availability.

Available in the 168-ball JV package only.

Available only for x16 configuration.

Available only for x32 configuration.

PDF: 09005aef8457b3eb

t79m_mobile_lpddr.pdf - Rev. G 1/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

2Gb: x16, x32 Mobile LPDDR SDRAM

Features

Contents

General Description ......................................................................................................................................... 8

Functional Block Diagrams ............................................................................................................................... 9

Ball Assignments ............................................................................................................................................ 11

Ball Descriptions ............................................................................................................................................ 15

Package Block Diagrams ................................................................................................................................. 17

Package Dimensions ....................................................................................................................................... 20

Electrical Specifications .................................................................................................................................. 26

Electrical Specifications – I

Parameters ........................................................................................................ 29

Electrical Specifications – AC Operating Conditions ......................................................................................... 35

Output Drive Characteristics ........................................................................................................................... 40

Functional Description ................................................................................................................................... 43

Commands .................................................................................................................................................... 44

DESELECT ................................................................................................................................................. 45

NO OPERATION ......................................................................................................................................... 45

LOAD MODE REGISTER ............................................................................................................................. 45

ACTIVE ...................................................................................................................................................... 45

READ ......................................................................................................................................................... 46

WRITE ....................................................................................................................................................... 47

PRECHARGE .............................................................................................................................................. 48

BURST TERMINATE ................................................................................................................................... 49

AUTO REFRESH ......................................................................................................................................... 49

SELF REFRESH ........................................................................................................................................... 50

DEEP POWER-DOWN ................................................................................................................................. 50

Truth Tables ................................................................................................................................................... 51

State Diagram ................................................................................................................................................ 56

Initialization .................................................................................................................................................. 57

Standard Mode Register .................................................................................................................................. 60

Burst Length .............................................................................................................................................. 61

Burst Type .................................................................................................................................................. 61

CAS Latency ............................................................................................................................................... 62

Operating Mode ......................................................................................................................................... 63

Extended Mode Register ................................................................................................................................. 64

Temperature-Compensated Self Refresh ...................................................................................................... 64

Partial-Array Self Refresh ............................................................................................................................ 65

Output Drive Strength ................................................................................................................................ 65

Status Read Register ....................................................................................................................................... 66

Bank/Row Activation ...................................................................................................................................... 68

READ Operation ............................................................................................................................................. 69

WRITE Operation ........................................................................................................................................... 80

PRECHARGE Operation .................................................................................................................................. 92

Auto Precharge ............................................................................................................................................... 92

Concurrent Auto Precharge ......................................................................................................................... 93

AUTO REFRESH Operation ............................................................................................................................. 98

SELF REFRESH Operation ............................................................................................................................... 99

Power-Down ................................................................................................................................................. 100

Deep Power-Down .................................................................................................................................... 102

Clock Change Frequency ............................................................................................................................... 104

Revision History ............................................................................................................................................ 105

Rev. G – 1/14 ............................................................................................................................................. 105

Rev. F – 11/12 ............................................................................................................................................ 105

PDF: 09005aef8457b3eb

t79m_mobile_lpddr.pdf - Rev. G 1/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x16, x32 Mobile LPDDR SDRAM

Features

List of Figures

Figure 1: 2Gb Mobile LPDDR Part Numbering .................................................................................................. 2

Figure 2: Functional Block Diagram (x16) ......................................................................................................... 9

Figure 3: Functional Block Diagram (x32) ....................................................................................................... 10

Figure 4: 60-Ball VFBGA – Top View, x16 only .................................................................................................. 11

Figure 5: 90-Ball VFBGA – Top View, x32 only .................................................................................................. 12

Figure 6: 168-Ball FBGA – 12mm x 12mm (Top View), x32 only ........................................................................ 13

Figure 7: 240-Ball FBGA – 14mm x 14mm (Top View), x32 only ........................................................................ 14

Figure 8: Single Rank, Single Channel (1 Die) Package Block Diagram .............................................................. 17

Figure 9: Dual Rank, Single Channel (2 Die) Package Block Diagram ................................................................ 18

Figure 10: Dual Rank, Single Channel (4 Die) Package Block Diagram .............................................................. 19

Figure 11: 60-Ball FBGA (10mm x 10mm), Package Code: B7 ........................................................................... 20

Figure 12: 90-Ball FBGA (9mm x 13mm), Package Code: CX ............................................................................. 21

Figure 13: 168-Ball FBGA (12mm x 12mm), Package Code: JV .......................................................................... 22

Figure 14: 168-Ball FBGA (12mm x 12mm), Package Code: KQ ......................................................................... 23

Figure 15: 168-Ball FBGA (12mm x 12mm), Package Code: MA ........................................................................ 24

Figure 16: 240-Ball FBGA (14mm x 14mm), Package Code: MC ........................................................................ 25

Figure 17: Typical Self Refresh Current vs. Temperature .................................................................................. 34

Figure 18: ACTIVE Command ........................................................................................................................ 46

Figure 19: READ Command ........................................................................................................................... 47

Figure 20: WRITE Command ......................................................................................................................... 48

Figure 21: PRECHARGE Command ................................................................................................................ 49

Figure 22: DEEP POWER-DOWN Command ................................................................................................... 50

Figure 23: Simplified State Diagram ............................................................................................................... 56

Figure 24: Initialize and Load Mode Registers ................................................................................................. 58

Figure 25: Alternate Initialization with CKE LOW ............................................................................................ 59

Figure 26: Standard Mode Register Definition ................................................................................................. 60

Figure 27: CAS Latency .................................................................................................................................. 63

Figure 28: Extended Mode Register ................................................................................................................ 64

Figure 29: Status Read Register Timing ........................................................................................................... 66

Figure 30: Status Register Definition .............................................................................................................. 67

Figure 31: READ Burst ................................................................................................................................... 70

Figure 32: Consecutive READ Bursts .............................................................................................................. 71

Figure 33: Nonconsecutive READ Bursts ........................................................................................................ 72

Figure 34: Random Read Accesses .................................................................................................................. 73

Figure 35: Terminating a READ Burst ............................................................................................................. 74

Figure 36: READ-to-WRITE ............................................................................................................................ 75

Figure 37: READ-to-PRECHARGE .................................................................................................................. 76

Figure 38: Data Output Timing –

DQSQ,

QH, and Data Valid Window (x16) .................................................... 77

Figure 39: Data Output Timing –

DQSQ,

QH, and Data Valid Window (x32) .................................................... 78

Figure 40: Data Output Timing –

AC and

DQSCK .......................................................................................... 79

Figure 41: Data Input Timing ......................................................................................................................... 81

Figure 42: Write – DM Operation .................................................................................................................... 82

Figure 43: WRITE Burst ................................................................................................................................. 83

Figure 44: Consecutive WRITE-to-WRITE ....................................................................................................... 84

Figure 45: Nonconsecutive WRITE-to-WRITE ................................................................................................. 84

Figure 46: Random WRITE Cycles .................................................................................................................. 85

Figure 47: WRITE-to-READ – Uninterrupting ................................................................................................. 86

Figure 48: WRITE-to-READ – Interrupting ...................................................................................................... 87

Figure 49: WRITE-to-READ – Odd Number of Data, Interrupting ..................................................................... 88

Figure 50: WRITE-to-PRECHARGE – Uninterrupting ....................................................................................... 89

PDF: 09005aef8457b3eb

t79m_mobile_lpddr.pdf - Rev. G 1/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT46H64M32LFCX-48 IT:B TR

MT46H64M32LFCX-48 IT:B TR概述

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