CHT3091aQAG
RoHS COMPLIANT
DC-12GHz ATTENUATOR
GaAs Monolithic Microwave IC in SMD leadless package
Description
The CHT3091aQAG is a variable DC-12GHz
attenuator designed for a wide range of
applications, from military to commercial
communication systems.
It is supplied in lead-free SMD package.
Main Features
■
Broadband performances: DC-12GHz
■
15dBm typical input 1dB compression point
(any attenuation)
■
DC bias: -5V<VS<0V ; -5V<VP<0V
■
Package type: 16Leads QFN3x3
dBSij (dB)
0
-5
S11dBmin_Board
S11dBmax_Board
S21dBmin_Pkg
S21dBmin_Board
S21dBmax_Board
S21dBmax_Pkg
-10
-15
-20
-25
2
3
4
5
6
7
8
9
10
Frequency (GHz)
11
12
13
14
PCB Measured performances @ 20°
C
Main Characteristics
Tamb. = 25°
C
Symbol
Fin
Min Att.
Max Att.
Parameter
Input frequency range
Minimum attenuation |S21| (VS=0V;VP=-5V)
Maximum attenuation |S21|(VS=-5V;VP=0V)
20
Min
DC
3
23
Typ
Max
12
4
Unit
GHz
dB
dB
Pin1dB Input 1dB compression point.(any Att)
14
dBm
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Ref. : DSCHT3091aQAG0211 - 30 Jul 2010
1/6
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHT3091aQAG
Main Characteristics
Tamb. = 25°
C
Symbol
Fin
Min Att.
Max Att.
VSWRin
Pin1dB
Parameter
Input frequency range
Minimum attenuation |S21| (VS=0V;VP=-5V)
Maximum attenuation |S21| (VS=-5V;VP=0V)
Input VSWR (any attenuation)
Input 1dB compression point.(any
attenuation)
DC-12GHz Attenuator
Min
DC
Typ
3.0
Max
12
4.0
Unit
GHz
dB
dB
20
23
2.:1
2.:1
VSWRout Output VSWR (any attenuation)
14
15
dBm
These values are representative of onboard measurements as defined in the application
section.
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Absolute Maximum Ratings
Tamb. = 25°
C
Symbol
VP
VS
Pin
Ta
Tstg
(1)
Parameter
VP control voltage
VS control voltage
RF input power
Operating temperature range
Storage temperature range
Values
-6V to +0.6V
-6V to +0.6V
20
-40 to +85
-55 to +155
Unit
V
V
dBm
°
C
°
C
(1)
Operation of this device above anyone of these parameters may cause permanent
damage.
Typical Bias Conditions
For an ambient Temperature of +25°
C
Symbol
Vs
Vp
Pin No.
6
7
VS control voltage
VP control voltage
Parameter
Values
-5 to 0
0 to –5
Unit
V
V
All other pins are not used for this device (but RFin: pin 2 and RFout: pin 11).
Ref. : DSCHT3091aQAG0211 - 30 Jul 2010
2/6
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
DC-12GHz Attenuator
Demonstration Board (PCB)
CHT3091aQAG
R
FIN
RFO T
U
C T3091
H
Typical Results
Tamb = +25°
C
Vp = 0V to -5V & Vs = -5V to 0V
PCB Measured Performance
(T amb. 25°C)
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-12
-13
-14
-15
-16
-17
-18
-19
-20
-21
-22
-23
-24
-25
2
3
S11dBmin_Board
S21dBmin_Board
S11dBmax_Board
S21dBmax_Board
S21dBmin_Pkg
S21dBmax_Pkg
dBS21 & dBS11 (dB)
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Frequency (GHz)
Ref. DSCHT3091aQAG0211 - 30 Jul 2010
3/6
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
CHT3091aQAG
DC-12GHz Attenuator
Application note
The design of the motherboard has a strong impact on the over all performance since the
transition from the motherboard to the package is comparably large. In case of the SMD type
packages of United Monolithic Semiconductors the motherboard should be designed
according to the information given in the following to achieve good performance. Other
configurations are also possible but can lead to different results. If you need advise please
contact United Monolithic Semiconductors for further information.
SMD type packages of UMS should allow design and fabrication of micro- and mm-wave
modules at low cost. Therefore, a suitable motherboard environment has been chosen. All
tests and verifications have been performed on Rogers RO4003. This material exhibits a
permittivity of 3.38 and has been used with a thickness of 200µm [8 mils] and a 1/2oz or less
copper cladding. The corresponding 50Ohm transmission line has a strip width of about
460µm [approx. 18 mils].
The contact areas on the motherboard for the package connections should be designed
according to the footprint given above. The proper via structure under the ground pad is very
important in order to achieve a good RF and lifetime performance. All tests have been done
by using a grid of plenty plated through vias with a diameter of less than 200µm [8 mils] and
a spacing of less than 400µm [16 mils] from the centres of two adjacent vias. The via grid
should cover the whole space under the ground pad and the vias closest to the RF ports
should be located near the edge of the pad to allow a good RF ground connection. Since the
vias are important for heat transfer, a proper via filling should be guaranteed during the
mounting procedure to get a low thermal resistance between package and heat sink. For
power devices the use of heat slugs in the motherboard instead of a grid of via’s is
recommended.
For the mounting process the SMD type package can be handled as a standard surface
mount component. The use of either solder or conductive epoxy is possible. The solder
thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the
package and the motherboard should be within 50µm [2 mils]. Caution should be taken to
obtain a good and reliable contact over the whole pad areas. Voids or other improper
connections, in particular, between the ground pads of motherboard and package will lead to
a deterioration of the RF performance and the heat dissipation. The latter effect can reduce
drastically reliability and lifetime of the product.
Ref. : DSCHT3091aQAG0211 - 30 Jul 2010
4/6
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
DC-12GHz Attenuator
CHT3091aQAG
Recommended footprint for 16L-QFN3x3
The RF ports are not DC blocked. There are no DC capacitors in the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0005.
Ref. DSCHT3091aQAG0211 - 30 Jul 2010
5/6
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
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