Si3068
FCC+ E
MBEDDED
D
IRECT
A
CCESS
A
RRANGEMENT
Features
80 dB dynamic range TX/RX
paths to support up to V.92
modem speeds
Compliant with 49 PTTs,
including FCC, JATE, China, and
Korea
Integrated analog front end
(AFE) and 2- to 4-wire hybrid
Integrated ring detector
Pulse dialing support
Patented >6000 V isolation
technology
Proprietary isolation capacitor
interface to integrated DAA module
Line voltage monitor
Loop current monitor
Caller ID support
Lead-free and RoHS-compliant
8-pin ESOIC package
Ordering Information
See page 36.
Pin Assignments
Si3068
Applications
V.92 modems
Digital televisions
PDAs
Set-top boxes
Fax machines
ePOS terminals
Internet appliances
Multi-function
printers
Si3068
C1B
C2B
VREG
CID
1
2
3
4
9
Description
The Si3068 is an integrated direct access arrangement (DAA) for use with
an integrated DAA system-side module. It includes a V.92 quality codec, dc
termination, ac termination, and an integrated hybrid, eliminating the need
for an analog front end (AFE), isolation transformer, relays, optoisolator,
and a 2- to 4-wire hybrid. It interfaces directly to the integrated system-side
module and features Silicon Laboratories’ patented isolation technology.
The Si3068 dramatically reduces the board space, component count, and
cost required to implement a DAA compliant with the regulatory
requirements of 49 different PTTs including FCC, JATE, China, and Korea.
IGND
8
7
6
5
RX
DCT
QB
QE
US Patent # 5,870,046
US Patent # 6,061,009
Other Patents Pending
Functional Block Diagram
Si3068
RX
Silicon
Laboratories
Embedded
System-side
DAA Module
C1B
Hybrid and
dc
Termination
Isolation
Interface
DCT
TIP
BOM
RING
VREG
IGND
C2B
Ring Detect
Off-Hook
CID
QB
QE
Rev. 1.0 9/05
Copyright © 2005 by Silicon Laboratories
Si3068
Si3068
T
A B L E
Section
OF
C
O N T E N TS
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4. Telephone Line Interface Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1. Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
4.2. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4. Loop Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5. Line Voltage Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.6. Off-Hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.7. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.8. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.9. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.10. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.11. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.12. DTMF Dialing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.13. Pulse Dialing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.14. Receive Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.15. On-Hook Line Monitor Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.16. Caller ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.17. Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.18. Sample Rate Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.19. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.20. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.21. Revision Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7. Package Outline: 8-Pin Exposed Pad SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Rev. 1.0
3
Si3068
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
*
Ambient Temperature
Symbol
T
A
Test Condition
F-Grade
Min
0
Typ
25
Max
70
Unit
°C
*Note:
All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated.
Table 2. DAA Loop Characteristics
(V
D
= 3.0 to 3.6 V, T
A
= 0 to 70 °C, see Figure 1)
Parameter
DC Termination Voltage
DC Termination Voltage
On-Hook Leakage Current
Operating Loop Current
DC Ring Current
Ring Detect Voltage
*
Ring Frequency
Ringer Equivalence Number
Symbol
V
TR
V
TR
I
LK
I
LP
Test Condition
I
L
= 20 mA
I
L
= 120 mA
V
TR
= –100 V
Min
—
9
—
15
Typ
—
—
—
—
1.5
15
—
—
Max
7.5
—
12
120
3
35
68
0.2
Unit
V
V
µA
mA
µA
V
rms
Hz
dc current flowing through
ring detection circuitry
V
RD
F
R
REN
—
10
15
—
*Note:
The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected
above the maximum.
TIP
+
600
Ω
Si3068
V
TR
10
µF
–
I
L
RING
Figure 1. Test Circuit for Loop Characteristics
4
Rev. 1.0
Si3068
Table 3. DAA AC Characteristics
(T
A
= 0 to 70 °C, Fs = 8 kHz)
Parameter
Sample Rate
Receive Frequency Response
Transmit Full Scale Level
1
Receive Full Scale Level
1,2
Dynamic Range
3,4,5
Dynamic Range
3,4,5
Transmit Total Harmonic Distortion
5,6
Receive Total Harmonic Distortion
5,6
Dynamic Range (caller ID mode)
7
Caller ID Full Scale Level
Symbol
Fs
Test Condition
Low –3 dBFS Corner
Min Typ Max
7.2
—
—
—
—
—
—
—
—
—
—
5
0.98
0.98
80
80
75
–78
50
6
16
—
—
—
—
—
—
—
—
—
Unit
kHz
Hz
V
PEAK
V
PEAK
dB
dB
dB
dB
dB
V
PP
V
FS
V
FS
DR
DR
THD
THD
DR
CID
V
CID
–1 dBm
–1 dBm
I
L
= 100 mA
I
L
= 20 mA
I
L
= 20 mA
I
L
= 20 mA
V
IN
= 1 kHz, –13 dBm
Notes:
1.
Measured at TIP and RING with 600
Ω.
termination at 1 kHz, as shown in Figure 1.
2.
Receive full scale level produces –0.9 dBFS.
3.
DR = 20 x log (rms V
FS
/rms
V
IN
)+ 20 x log (rms
V
IN
/rms noise, excluding harmonics). V
FS
is the –1 dBm full-scale
level.
4.
Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths.
5.
V
IN
= 1 kHz, –3 dBFS
6.
THD = 20 x log (rms distortion / rms signal).
7.
DR
CID
= 20 x log (rms V
CID
/rms V
IN
)+ 20 x log (rms V
IN
/rms noise). V
CID
is the 6 V full-scale level.
Rev. 1.0
5
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