Freescale Semiconductor, Inc.
Data Sheet: Technical Data
K02P64M100SFA
Rev 2, 8/2014
Kinetis K02 64 KB/128 KB Flash
100 MHz Cortex-M4 Based Microcontroller with FPU
Ideal for low-power applications that require processing
efficiency. Shares the comprehensive enablement and scalability
of the Kinetis family.
This product offers:
• Run power consumption down to 125 µA/MHz
• Static power consumption down to 4.1 µA with full state
retention and 6 µs wakeup. Lowest Static mode down to
150 nA.
• Excellent processing efficiency, 100 MHz ARM
®
Cortex
®
-
M4-based device with floating-point unit in a tiny form factor
MK02FN128Vxx10
MK02FN64Vxx10
64 LQFP (LH)
10 x 10 x 1.4 Pitch 0.5
mm
48 LQFP (LF)
7 x 7 x 1.4 Pitch 0.5
mm
32 QFN (FM)
5 x 5 x 1 Pitch 0.5 mm
Performance
• 100 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• Up to 128 KB of embedded flash and 16 KB of RAM
• Preprogrammed Kinetis flashloader for one-time, in-
system factory programming
Analog modules
• One 16-bit SAR ADC
• One 12-bit DAC
• Two analog comparators (CMP) with 6- bit DAC
• Accurate internal voltage reference (not available in
32-pin QFN package)
Communication interfaces
• One SPI module
• Two UART modules
• One I2C: Support for up to 400 kbit/s operation with
maximum bus loading
System peripherals
• Flexible low-power modes with multiple wake up
sources
• 4-channel DMA controller
• Independent External and Software Watchdog monitor
Timers
• One 6-channel motor control/general purpose/ PWM
Clocks
timer
• Crystal oscillator: 32-40 kHz or 3-32 MHz
• Two 2-channel general-purpose timers with
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz
quadrature decoder functionality (FTM2 does not
with FLL
have external pins on the 32-pin QFN or the 48-pin
• Multi-purpose clock generator
LQFP package)
• Periodic interrupt timers
Security and integrity modules
• 16-bit low-power timer
• Hardware CRC module
• Programmable delay block
• 128-bit unique identification (ID) number per chip
• Flash access control to protect proprietary software
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
Human-machine interface
• Flash write voltage range: 1.71 to 3.6 V
• Up to 46 general-purpose I/O (GPIO)
• Temperature range (ambient): -40 to 105°C
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products. © 2014 Freescale Semiconductor, Inc. All rights
reserved.
Ordering Information
Part Number
Flash (KB)
MK02FN128VLH10
MK02FN128VLF10
1
MK02FN128VFM10
MK02FN64VLH10
MK02FN64VLF10
1
MK02FN64VFM10
128
128
128
64
64
64
Memory
SRAM (KB)
16
16
16
16
16
16
46
35
26
46
35
26
Number of GPIOs
1. This package offering is subject to removal.
Related Resources
Type
Selector Guide
Product Brief
Reference Manual
Data Sheet
Chip Errata
Package drawing
Description
The Freescale Solution Advisor is a web-based tool that features interactive application wizards and
a dynamic product selector.
The Product Brief contains concise overview/summary information to enable quick evaluation of a
device for design suitability.
The Reference Manual contains a comprehensive description of the structure and function
(operation) of a device.
The Data Sheet includes electrical characteristics and signal connections.
The chip mask set Errata provides additional or corrective information for a particular device mask
set.
Package dimensions are provided in package drawings.
Figure 1
shows the functional modules in the chip.
2
Freescale Semiconductor, Inc.
Kinetis K02 64 KB/128 KB Flash, Rev2, 8/2014.
ARM
®
Cortex™-M4
Core
Debug
interfaces
Interrupt
controller
DSP
System
DMA (4 ch)
Memories and Memory Interfaces
Program
flash
(Up to 128 KB)
RAM
(16 KB)
Clocks
Frequency-
locked loop
Low/high
frequency
oscillators
FPU
Low-leakage
wakeup
Internal
and external
watchdogs
Internal
reference
clocks
and Integrity
CRC
Security
Analog
16-bit
SAR ADC x1
Comparator
with 6-bit DAC
x2
12-bit DAC
x1
High
performance
voltage ref
Timers
Timers
x1 (6ch)
x2 (2ch)
Programmable
Communication Interfaces
I
C
x1
SPI
x1
2
Human-Machine
Interface (HMI)
Up to
46 GPIOs
UART
x2
Flash access
control
delay block
Periodic
interrupt
timers
16-bit
low-power
timer
Figure 1. Functional block diagram
/projects/Microcontrollers/devices/Senna/topics/block-diagram/variants-DO-NOT-EDIT/
senna_kv30_128l_functional
Kinetis K02 64 KB/128 KB Flash, Rev2, 8/2014.
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings................................................................................................5
1.1 Thermal handling ratings........................................................... 5
1.2 Moisture handling ratings.......................................................... 5
1.3 ESD handling ratings................................................................. 5
1.4 Voltage and current operating ratings........................................5
2 General............................................................................................... 6
2.1 AC electrical characteristics...................................................... 6
2.2 Nonswitching electrical specifications...................................... 6
2.2.1 Voltage and current operating requirements................ 6
2.2.2 LVD and POR operating requirements........................ 7
2.2.3 Voltage and current operating behaviors......................8
2.2.4 Power mode transition operating behaviors................. 9
2.2.5 Power consumption operating behaviors..................... 10
2.2.6 EMC radiated emissions operating behaviors.............. 15
2.2.7 Designing with radiated emissions in mind................. 16
2.2.8 Capacitance attributes...................................................16
2.3 Switching specifications............................................................ 16
2.3.1 Device clock specifications.......................................... 16
2.3.2 General switching specifications..................................17
2.4 Thermal specifications...............................................................17
2.4.1 Thermal operating requirements.................................. 17
2.4.2 Thermal attributes.........................................................18
3 Peripheral operating requirements and behaviors.............................. 19
3.1 Core modules............................................................................. 19
3.1.1 SWD electricals ...........................................................19
3.1.2 JTAG electricals........................................................... 21
3.2 System modules......................................................................... 23
3.3 Clock modules........................................................................... 23
3.3.1 MCG specifications......................................................23
3.3.2 IRC48M specifications.................................................25
3.3.3 Oscillator electrical specifications................................25
3.4 Memories and memory interfaces..............................................28
3.4.1 Flash electrical specifications.......................................28
3.5 Security and integrity modules.................................................. 29
3.6 Analog........................................................................................29
3.6.1 ADC electrical specifications.......................................29
3.6.2 CMP and 6-bit DAC electrical specifications.............. 34
3.6.3 12-bit DAC electrical characteristics........................... 36
3.6.4 Voltage reference electrical specifications...................39
3.7 Timers........................................................................................ 40
3.8 Communication interfaces......................................................... 40
3.8.1 DSPI switching specifications (limited voltage range) 41
3.8.2 DSPI switching specifications (full voltage range)......42
3.8.3 Inter-Integrated Circuit Interface (I2C) timing............ 44
3.8.4 UART switching specifications....................................45
4 Dimensions.........................................................................................45
4.1 Obtaining package dimensions.................................................. 46
5 Pinout................................................................................................. 46
5.1 K02F Signal Multiplexing and Pin Assignments...................... 46
5.2 K02F Pinouts............................................................................. 49
6 Ordering parts.....................................................................................51
6.1 Determining valid orderable parts............................................. 51
7 Part identification............................................................................... 52
7.1 Description.................................................................................52
7.2 Format........................................................................................52
7.3 Fields..........................................................................................52
7.4 Example..................................................................................... 53
8 Revision History.................................................................................53
4
Freescale Semiconductor, Inc.
Kinetis K02 64 KB/128 KB Flash, Rev2, 8/2014.
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K02 64 KB/128 KB Flash, Rev2, 8/2014.
5
Freescale Semiconductor, Inc.
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