Pb in glass exemption 7 (c)-I per RoHS II 2011/65/EU Annex
12.5 x 4.95 x 5.1mm
Moisture Sensitivity Level – MSL – N/A
(The ABSM3A Series is a Hermetically Sealed device and not moisture sensitive)
APPLICATIONS:
• Home electronics
• Computers, modems, and communications
• Clock applications
• Microprocessors
STANDARD SPECIFICATIONS:
Parameters
Frequen
c
y Ran
g
e
Operation Mode
Operating Temperature
Stora
g
e Te
mp
erature
Frequen
c
y Toleran
c
e
Frequency Stability over the
Operating
Temperature ( ref. to +25°C ± 3
o
C)
Minimum
Typical
Maximum
Units
M
H
z
Standard
Standard
Standard
Option “FB”
See
options
See o
p
tions
See
options
3.579545MHz ~
3.999MHz
4.000 MHZ ~
4.999MHz
5.000MHz ~
6.999MHz
7.000MHz ~
14.999MHz
15.000MHz ~
48.000MHZ (Fund.)
40.000MHz ~
60.000MHz (3
rd
OT)
Notes
3.579545
60
3.579545MHz ~ 30.00MHz: Fundamental, AT
30.01MHz ~ 39.99MHz: Fundamental, BT
40.00MHz ~ 60.00MHz: 3
rd
OT
40.00MHz ~ 48.00MHz: Fundamental, BT
-10
+60
-
40
+85
-
50
+50
-100
+100
150
120
ºC
ºC
ppm
ppm
Equivalent series resistance (R1)
90
50
40
80
Ω
S
h
unt
c
a
p
a
c
itan
c
e (C0)
Load
c
a
p
a
c
ita n
c
e (CL)
Drive Level
Aging (per
year) @25°C ± 3
o
C
Insulation Resistan
c
e
7 .0
18
100
-5
500
1000
+5
p
F
p
F
µW
ppm
M
Ω
See o
p
tions
@100Vd
c
±15V
ABRACON IS
ISO 9001:2008
ISO 9001 / QS 9000
CERTIFIED
2 Faraday, Suit#B, Irvine, California 92618
Revised: 10.09.14
tel 949-546-8000
|
fax 949-546-8001
Visit
www.abracon.com
for Terms & Conditions of Sale
Surface Mount Microprocessor Crystal
ABSM3A
RoHS / RoHS II Compliant
Pb in glass exemption 7 (c)-I per RoHS II 2011/65/EU Annex
12.5 x 4.95 x 5.1mm
OPTIONS & PART IDENTIFICATION:
(Left blank if standard)
ABSM3
Height max.
(mm)
Blank: 5.1
2: 4.5
3: 3.8
Frequency in MHz
e.g. 14.31818MHz
26.000MHz
Load Capacitance (pF)
Please specify CL in pF or
S for series (10pF min) if
not standard
A-
MHz -
-
-
-
-
-
-
Packaging
Blank: Bulk
T: 1kpcs/reel
Mode
Blank: Standard
FB: Fund BT for
40MHz≤F≤48MHz
Operating Temp.
Blank: -10°C to +60°C
E: 0°C to +70°C
B: -20°C to +70°C
C: -30°C to +70°C
N: -30°C to +85°C
D: -40°C to +85°C
Freq. Tolerance
Blank: ± 50 ppm
1: ± 10 ppm
7: ± 15 ppm
2: ± 20 ppm
3: ± 25 ppm
4: ± 30 ppm
Freq. Stability
Blank:± 100 ppm
U: ± 10 ppm(*)
G: ± 15 ppm(**)
X: ± 20 ppm
W: ± 25 ppm
Y: ± 30 ppm
H: ± 35 ppm
Z: ± 50 ppm
Custom ESR if other than
standard
R□
□: Specify
a value in
Ω
if
not standard (e.g.: R40)
(*) -10°C to 60°C only.
(**) Temp. option E, B, C, N and -10 to +60°C only
Note: Fundamental BT frequency stability ± 100
ppm max. at -10°C to 60°C only
ABRACON IS
ISO 9001:2008
ISO 9001 / QS 9000
CERTIFIED
2 Faraday, Suit#B, Irvine, California 92618
Revised: 10.09.14
tel 949-546-8000
|
fax 949-546-8001
Visit
www.abracon.com
for Terms & Conditions of Sale
Surface Mount Microprocessor Crystal
ABSM3A
OUTLINE DIMENSION:
RoHS / RoHS II Compliant
Pb in glass exemption 7 (c)-I per RoHS II 2011/65/EU Annex
12.5 x 4.95 x 5.1mm
H (see table)
P/N
ABSM3A
ABSM32A
ABSM33A
Dimensions: mm
Height max.
(mm)
5.1
4.5
3.8
REFLOW PROFILE:
ABRACON IS
ISO 9001:2008
ISO 9001 / QS 9000
CERTIFIED
2 Faraday, Suit#B, Irvine, California 92618
Revised: 10.09.14
tel 949-546-8000
|
fax 949-546-8001
Visit
www.abracon.com
for Terms & Conditions of Sale
Surface Mount Microprocessor Crystal
ABSM3A
TAPE & REEL:
T=Tape and Reel (1000pcs/reel)
RoHS / RoHS II Compliant
Pb in glass exemption 7 (c)-I per RoHS II 2011/65/EU Annex
12.5 x 4.95 x 5.1mm
Dimensions: mm
ATTENTION:
Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applica-
tions. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requiring high reliability where
component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and
authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
国际半导体设备材料产业协会（SEMI）昨（10）日公布半导体设备资本支出的年中预测报告（SEMI Capital Equipment Forecast），预估2012年全球半导体设备营收规模将达到423.8亿美元，2013年将成长至467.1亿美元。
受惠平板电脑、智慧型手机与行动装置等消费性电子商品亮丽表现，半导体设备的采购需求仍将持续。SEMI在报告中指出，2011年半...[详细]
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