DATASHEET
ZERO DELAY, LOW SKEW BUFFER
Description
The MK2304-2 is a low jitter, low skew, high performance
Phase Lock Loop (PLL) based zero delay buffer for high
speed applications. Based on IDT’s proprietary low jitter
PLL techniques, the device provides four low skew outputs
at speeds up to 133 MHz at 3.3 V. The MK2304-2 includes
a bank of two outputs running at 1/2X. In the zero delay
mode, the rising edge of the input clock is aligned with the
rising edges of all 4 outputs. Compared to competitive
CMOS devices, the MK2304-2 has the lowest jitter.
The MK2304-2 PLL enters a power-down state when there
are no rising edges on the REF input. In this mode, all
outputs are tri-stated and the PLL is turned off, resulting in
leass than 25 µA of current draw.
IDT manufactures the largest variety of clock generators
and buffers and is the largest clock supplier in the world.
MK2304-2
Features
•
•
•
•
•
•
•
Packaged in 8 pin SOIC
Zero input-output delay
Two 1X outputs plus two 1/2X outputs
Output to output skew is less than 200 ps
Output clocks up from 10 MHz to 133 MHz at 3.3 V
Ability to generate 2X the input
Full CMOS outputs with 8 mA output drive capability at
TTL levels at 3.3 V
clock generators
•
Spread Smart
TM
technology works with spread spectrum
•
•
•
•
•
Advanced, low power, sub micron CMOS process
Operating voltage of 3.3 V
Available in industial temperature operation
Pb (lead) free package
Low Standby Current
Block Diagram
VDD
1
FBIN
CLKIN
PLL
CLKA1
CLKA2
BANK
A
CLKB1
/2
CLKB2
BANK
B
1
GND
IDT™
ZERO DELAY, LOW SKEW BUFFER
1
MK2304-2
REV G 051310
MK2304-2
ZERO DELAY, LOW SKEW BUFFER
ZDB
Pin Assignment
Feedback Configuration Table
Feedback From
Bank A
Bank B
CLKA1:A2
CLKIN
2XCLKIN
CLKB1:B2
CLKIN/2
CLKIN
REF
CLKA1
CLKA2
GND
1
2
3
4
8
7
6
5
FBK
VDD
CLKB2
CLKB1
8 Pi n ( 150 mi l ) SOI C
Pin Descriptions
Pin
Number
1
2
3
4
5
6
7
8
Pin
Name
REF
CLKA1
CLKA2
GND
CLKB1
CLKB1
VDD
FBK
Pin
Type
Input
Output
Output
Power
Output
Output
Power
Input
Pin Description
Clock input. Connect to input clock source, 5 V tolerant input.
Clock A1 output.
Clock A2 output.
Connect to ground.
Clock B1 output.
Clock B2 output.
3.3V Power Supply.
PLL feedback input
External Components
The Mk2304-2 requires a minimum number of external components for proper operation. Decoupling capacitors of
0.1µF should be connected between VDD and GND, as close to the part as possible. A 33Ω series terminating
resistor should be used on each clock output to reduce reflections.
IDT™
ZERO DELAY, LOW SKEW BUFFER
2
MK2304-2
REV G 051310
MK2304-2
ZERO DELAY, LOW SKEW BUFFER
ZDB
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the MK2304-2. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs, except CLKIN
CLKIN
Ambient Operating Temperature (commercial)
Ambient Operating Temperature (industrial)
Storage Temperature
Junction Temperature
Soldering Temperature
7V
Rating
-0.5 V to VDD+0.5 V
-0.5 V to +5.5 V
0 to +70
°
C
-40 to +85
°
C
-65 to +150
°
C
125
°
C
260
°
C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature (commercial)
Ambient Operating Temperature (industrial)
Power Supply Voltage (measured in respect to GND)
Min.
0
-40
+3.0
Typ.
Max.
+70
+85
+3.6
Units
°
C
°
C
V
DC Electrical Characteristics
VDD=3.3 V ±10%
, Amb temp -40° C to 85° C
Parameter
Operating Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Operating Supply Current
100 MHz, CLKIN
Stand by Supply Current
0 MHz, CLKIN
Short Circuit Current
Input Capacitance
Power-up Time
Symbol
VDD
V
IH
V
IL
V
OH
V
OL
IDD
IDD
I
OS
C
IN
Conditions
Min.
3.0
2
Typ.
Max.
3.6
0.8
Units
V
V
V
V
V
mA
I
OH
= -8 mA
I
OL
= 8 mA
No Load
No Load
Each output
FBIN
2.4
0.4
45
12
TBD
7
50
25
uA
mA
pF
ms
IDT™
ZERO DELAY, LOW SKEW BUFFER
3
MK2304-2
REV G 051310
MK2304-2
ZERO DELAY, LOW SKEW BUFFER
ZDB
AC Electrical Characteristics
VDD = 3.3V ±10%
, Ambient Temperature -40° C to 85° C
Parameter
Output Frequency
Output Frequency
Output Rise Time
Output Rise Time
Output Fall Time
Output Fall Time
Output Clock Duty Cycle
Output Clock Duty Cycle
Device-to-Device skew, equally
loaded
Output-to-Output skew, equally
loaded, On same bank
Skew from Output Bank A to
Output Bank B
Delay CLKIN Rising Edge to
FBIN Rising Edge
Cycle-to-Cycle Jitter
t
OR
t
OR
t
OF
t
OF
Symbol
Conditions
FBIN to CLKA1,
30 pF Load
FBIN to CLKA1,
15 pf Load
0.8 to 2.0 V, C
L
=30 pF
0.8 to 2.0 V, C
L
=15 pF
0.8 to 2.0 V, C
L
=30 pF
0.8 to 2.0 V, C
L
=15 pF
At 1.4 V, C
L
=30 pf
At 1.4 V, C
L
=15 pf
Rising edges at VDD/2
Rising edges at VDD/2
All outputs equally
loaded
Measured at VDD/2
30 pF loads
66.67 MHz outputs
15 pF loads
66.67 MHz outputs
Min.
10
10
Typ.
Max. Units
100
133
2.2
1.5
2.2
1.5
MHz
MHz
ns
ns
ns
ns
%
%
ps
ps
ps
ps
ps
ps
ms
40
45
50
50
60
65
500
200
400
±250
400
375
1
PLL Lock Time
t
LOCK
Stable power supply,
valid clocks on CLKIN,
FBIN
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
120
115
105
58
Max. Units
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to Case
IDT™
ZERO DELAY, LOW SKEW BUFFER
4
MK2304-2
REV G 051310
MK2304-2
ZERO DELAY, LOW SKEW BUFFER
ZDB
Package Outline and Package Dimensions
(8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
8
Millimeters
Symbol
Min
Max
Inches*
Min
Max
E
INDEX
AREA
H
1 2
D
A
A1
B
C
D
E
e
H
h
L
α
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BASIC
5.80
6.20
0.25
0.50
0.40
1.27
0
°
8
°
.0532
.0688
.0040
.0098
.013
.020
.0075
.0098
.1890
.1968
.1497
.1574
0.050 BASIC
.2284
.2440
.010
.020
.016
.050
0
°
8
°
*For reference only. Controlling dimensions are in mm.
A
A1
h x 45
C
-C-
e
B
SEATING
PLANE
L
.10 (.004)
C
Ordering Information
Part / Order Number
MK2304S-2LF
MK2304S-2LFTR
MK2304S-2ILF
MK2304S-2ILFTR
Marking
2304S02L
2304S02L
2304S2IL
2304S2IL
Shipping Packaging
Tubes
Tape and Reel
Tubes
Tape and Reel
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
Temperature
0 to 70° C
0 to 70° C
-40° C to 85° C
-40° C to 85° C
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™
ZERO DELAY, LOW SKEW BUFFER
5
MK2304-2
REV G 051310
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
