Flash PLD, 19ns, CMOS, CQFP160, CAVITY-UP, CERAMIC, QFP-160
| 参数名称 | 属性值 |
| 零件包装代码 | QFP |
| 包装说明 | QFP, |
| 针数 | 160 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | FOR SHIPPING METHOD CONTACT SALES |
| 最大时钟频率 | 62.5 MHz |
| JESD-30 代码 | S-CQFP-G160 |
| 专用输入次数 | 1 |
| I/O 线路数量 | 128 |
| 端子数量 | 160 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1 DEDICATED INPUTS, 128 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 可编程逻辑类型 | FLASH PLD |
| 传播延迟 | 19 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 5962-9759902QZX | 5962-9759901QZX | 5962-9759901QXC | 5962-9759902QXX | 5962-9759901QXX | |
|---|---|---|---|---|---|
| 描述 | Flash PLD, 19ns, CMOS, CQFP160, CAVITY-UP, CERAMIC, QFP-160 | Flash PLD, 24ns, CMOS, CQFP160, CAVITY-UP, CERAMIC, QFP-160 | Flash PLD, 24ns, 128-Cell, CMOS, CPGA160, PGA-160 | Flash PLD, 19ns, CMOS, CPGA160, PGA-160 | Flash PLD, 24ns, CMOS, CPGA160, PGA-160 |
| 零件包装代码 | QFP | QFP | PGA | PGA | PGA |
| 包装说明 | QFP, | QFP, | PGA, PGA160M,15X15 | PGA, | PGA, |
| 针数 | 160 | 160 | 160 | 160 | 160 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大时钟频率 | 62.5 MHz | 50 MHz | 50 MHz | 62.5 MHz | 50 MHz |
| JESD-30 代码 | S-CQFP-G160 | S-CQFP-G160 | S-CPGA-P160 | S-CPGA-P160 | S-CPGA-P160 |
| 专用输入次数 | 1 | 1 | 1 | 1 | 1 |
| I/O 线路数量 | 128 | 128 | 128 | 128 | 128 |
| 端子数量 | 160 | 160 | 160 | 160 | 160 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 1 DEDICATED INPUTS, 128 I/O | 1 DEDICATED INPUTS, 128 I/O | 1 DEDICATED INPUTS, 128 I/O | 1 DEDICATED INPUTS, 128 I/O | 1 DEDICATED INPUTS, 128 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFP | QFP | PGA | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 传播延迟 | 19 ns | 24 ns | 24 ns | 19 ns | 24 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子位置 | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 其他特性 | FOR SHIPPING METHOD CONTACT SALES | FOR SHIPPING METHOD CONTACT SALES | YES | - | - |
| 厂商名称 | - | Cypress(赛普拉斯) | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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