Oven Controlled Crystal Oscillator
OX-502
OX-502
Features
•
•
•
•
•
•
6-Pin SMD package
Fast warm-up
Frequency Range, 10 MHz to 40 MHz
Standard freq: 10, 12.8, 20, 24.576, 25, 30.72 MHz
High Relability (based on fully intergrated Design)
Low Power
•
•
•
•
•
•
Applications
Base stations 5G & 4 G)
Test equipment
Small Cell
Military communication equipment
Stratum 3
SyncE; 1588
Performance Specifications
Frequency Stabilities
1
10 to 40 MHz
Parameter
vs. operating temperature range
(referenced to +25°C)
slope
Initial tolerance
vs. supply voltage change
vs. load change
vs. aging / day
vs. aging / year
vs. aging / 10 years
Holdover drift
Start up time
Warm-up time
Loop bandwith for wander
generation compliance
3
Min
-20
-10
-20
-2
-0.5
-10
-10
-5
500
-3
Typical
Max
+20
+10
+20
+2
+0.5
+10
+10
+5
+500
3
5
200
3
Units
ppb
ppb
ppb
ppb/°C
ppm
ppb
ppb
ppb
ppb
ppm
ppb
msec
minutes
mHz
Condition
Options
5
-40 to +85°C
-40 to +85°C
-40 to +95°C
@ Temp stab. +-10ppb
at time of shipment, nominal EFC
V
S
±5% static
Load ±5% static
after 30 days of operation
after 30 days of operation
after 30 days of operation
over 24 hours, constant temperature (<±1°C) ;
after 30 days continous opperation
to ±20ppb of final frequency (1 hour reading)
@ +25°C
MTIE compliant with GR‐1244 Fig 5‐5
TDEV compliant with GR‐ 1244 Fig 5‐4 ;
measurement setup: oscillator stabilized 24
hours at Constant Temperature (±1°C, still
air), data collected over 100,000 seconds at 1
second intervals (‐3dB cutoff, 1st order high
pass loop filter)
±2
Page 1 of 7
Performance Specifications
Supply Voltage (Vs)
Parameter
Supply voltage (standard)
Power consumption
Min
3.135
Typical
3.3
1.3
0.4
Max
3.465
1.5
0.5
Units
VDC
Watts
Watts
Condition
during warm-up
steady state @ +25°C
RF Output
Signal [standard]
Load
Signal Level (Vol)
Signal Level (Voh)
Duty Cycle
Ron
Roff
Tuning Range
Tuning Range
Linearity
Tuning Slope
Control Voltage Range
0.0
1.4
-99
-125
-145
-155
-160
±3
2.97
45
26.5
22
Fixed OCXO; No adjust
±8
10%
Positive
2.8
-90
-120
-140
-150
-155
1.0
Handling & Processing Note
VDC
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
g
10 Hz
100 Hz
1 kHz
10 kHz
100kHz
ppb
3.3
55
15
0.4
LVHCMOS
pF
VDC
VDC
%
Ω
Ω
Opti-
on
5
@ 20MHz
V
pF
°C
°C
with Vs=3.3 VDC
with Vs=3.3V and 15pF Load
with Vs=3.3V and 15pF Load
@ (Voh-Vol)/2
Frequency Tuning (EFC)
Additional Parameters
Phase Noise
3
Weight
Processing & Packing
Supply voltage (Vs)
Output Load
Operable Temperature Range
Storage Temperature Range
-40
-40
Absolute Maximum Ratings
3.8
50
+95
+125
Outline Drawing / Enclosure
G367
5,08
OX-502
Height “H”
6.2
cover material
plastic
6,4
land pattern
recommendation
5,08
Pin Connections
1
2
3
I.C (Do not connect) / EFC (option)
N.C
Ground (Case)
RF Output
N.C
Supply Voltage Input
H±0,3
0,1
4
2,5
8,7
6
5
4
1,3
5
6
9,4
0,1
Top View
1
2
3
14,3
0,1
Dimensions in mm
Page 2 of 7
Standard Shipping Method (OX-502)
K
1.75±0.1
Lage im Gurt
Position in tape
Pin1
A
4.0
XXXXX
XXXXX
Abwickelrichtung
Unwinding direction
B
B
Schnitt A - A
R0
.75
A
A
P
0.20
±0.05
Bei W < 32mm nur obere Lochreihe vorhanden
if W < 32mm only upper hole line existent
Schnitt B - B
Maßangaben in mm:
A, B und K Maße von Bauelement abhängig
Fertigungstoleranzen entsprechen der DIN IEC 286-3
Dimension in mm:
A, B und K are dependent uppon component dimensions
production tolerance complying DIN IEC 286-3
All dimensions in millimeters unless otherwise stated
Enclosure Type
OX-502 (6.2 mm)
Tape Width W (mm)
24
Quantity per meter
83.3
Quantity per reel
400
W
B
Dimension P
12
TP: max 250°C (@ solder joint,
customer board level)
TP: max 250°C (@ solder joint, customer board level)
TP: max 250°C (@ solder joint, customer board level)
Tp: max:
10…40 sec
Tp: max:
10…40 sec
Additional Information:
Additional Information:
This SMD oscillator has been designed for pick and place
Additional Information:
reflow soldering
Reflow Profile
T
p
: max: 10…40 sec
This SMD oscillator has been
This SMD oscillator has been
top side
and place
place re-
designed for pick and
designed for
SMD oscillators must be on the
pick
of the PCB during the
flow soldering
reflow soldering
reflow process.
SMD
reflow process.
the
oscillators must be on the top side of the PCB during the
SMD oscillators must be on the
reflow process.
SMD oscillators must be on the top side of the PCB during
top side of the PCB during the
reflow process.
Additional Environmental Conditions
Parameter
Temperature Cycling
Vibration, Sine
Mechanical Shock
Solderability
Solvent resistance
ESD
Moisture Sensit.
RoHS compliance
Washable
High temp operating
life(HTOL)
Low temp operating
life(LTOL)
Description
JESD22-A104-D Cond.G - 500cycles -40/+125C;cycle time 30min
MIL-STD-883 Meth 2007 Cond A - 20g 20-2000Hz 4x in each 3 axis 4min sweep time
MIL-STD-202 Meth 213B Cond. F - 1500g 0,5ms 6 shocks in each direction
J-STD-002C Cond. A, Trough hole device; Cond.B, SMD ( correspond to MIL-STD-883 Meth 2003) - 255C (diving Time 5
0,5sec.) Dip&Look with 8h damp pre-treatment: solder wetting >95%
MIL-STD-883 Meth 2003) - 255C (diving Time 5 0,5sec.) Dip&Look with
8h damp pre-treatment: solder wetting >95%
JESD22-A113-B - only if > MSL 1
100% RoHS 6 compliant
non-washable device
MIL-STD-202 Meth108A Cond C - 1000h @ 105C power on
IEC 60068-2-1 Cond. Ae - 1000h @ -40C power on
Page 3 of 7
Ordering Information
OX - 502 1 - E A E - 208 0 - 20M0000000
Product Family
OX: OCXO
Package
SMD version
Height
1: 6..2
Supply Voltage
E: 3.3V
RF Output Code
A: HCMOS
Stability Code
208: ±20ppb
108: ±10ppb
Frequency
Frequency Control
0: No Tuning
1: EFC
Temperature Range
E: -40°C to +85°C
8: -40°C to +95°C
Notes:
1. Contact factory for improved stabilities or additional product options. Not all options and codes are available at all
frequencies.
2. Unless other stated all values are valid after warm-up time and refer to typical conditions for supply voltage, frequency
control voltage, load, temperature (25°C).
3. Phase noise degrades with increasing output frequency.
4. Subject to technical modification.
5. Contact factory for availability.
Contact Information
100 Watts Street
Mt Holly Springs, PA 17065
Tel: 1.717.486.3411
Fax: 1.717.486.5920
USA:
For Additional Information, Please Contact
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may be superseded by updates. It is your reasonability to ensure that your application meets with your specifications. MICROCHIP
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MANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
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Trademarks
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other countries.
Landstrasse
74924 Neckarbischofsheim
Germany
Tel: +49 (0) 7268.801.0
Fax: +49 (0) 7268.801.281
Europe:
Rev. 23 Oct. 2019
Page 4 of 7
typical perforamce data
typical warm up (frequency vs. time)
@ OX-5021-EAE-1080-20M000
typical current consumption during power on
@ OX-5021-EAE-1080-20M000
typical power consumption vs. operating temperauture
@ OX-5021-EAE-1080-20M000
typical frequency vs. temperature stability
@ OX-5021-EAE-1080-20M000
Page 5 of 7
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