FC
Vishay Thin Film
High Frequency (up to 20 GHz) Surface Mount
Chip Resistors
FEATURES
•
Lead (Pb)-free or Sn/Pb terminations available
•
Small standard size 0402 case size
•
Edge trimmed block resistors
SURFACE MOUNT
CHIPS
•
Alumina substrate High Purity (99.6 %)
•
Ohmic range (10
Ω
to 1000
Ω)
•
Small internal reactance (< 10 mΩ)
•
Low TCR (down to ± 25 ppm/°C)
•
Epoxy bondable termination available
FC series chip resistors are designed with low internal
reactance. They function as almost pure resistors on a very
high range of frequencies. The specialized laser edge
trimming allows for precision tolerances to 0.1 %.
APPLICATIONS
•
Low noise amplifiers
•
Attenuation
•
Line termination
STANDARD ELECTRICAL SPECIFICATIONS
SPECIFICATIONS
Material
Resistance Range
TCR
Tolerance
Component Ratings
Case Size
0402
0505
0603
0805
1005
1206
Stability
Operating Temperature Range
Passivated nichrome
10
Ω
to 1000
Ω
25 (standard) (≥ 50
Ω)
to ± 100 ppm/°C
± 0.1 %, ± 0.5 %, ± 1.0 % and ± 5.0 %
Power Rating
50 mW
125 mW
125 mW
200 mW
250 mW
330 mW
500 ppm
- 55 °C to + 125 °C
Working Voltage
30 V
37 V
50 V
50 V
75 V
75 V
Max. at + 70 °C
Max. at + 70 °C
Max. at + 70 °C
Max. at + 70 °C
Max. at + 70 °C
Max. at + 70 °C
2000 h at + 70 °C
Case size dependant
- 55 °C to + 125 °C
+ 25 °C
CONDITIONS
* Pb containing terminations are not RoHS compliant, exemptions may apply
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For technical questions, contact:
thin-film@vishay.com
Document Number: 60093
Revision: 03-Aug-09
FC
High Frequency (up to 20 GHz) Surface Mount
Chip Resistors
DIMENSIONS
in inches [millimeters]
D
T
E
L
D
T
Vishay Thin Film
CASE
SIZE
0402
0505
0603
LENGTH
0.040 ± 0.003
[1.016 ± 0.076]
0.050 ± 0.005
[1.270 ± 0.127]
0.064 ± 0.006
[1.626 ± 0.153]
0.080 ± 0.006
[2.032 ± 0.153]
0.100 ± 0.008
[2.540 ± 0.204]
0.126 ± 0.008
[3.201 ± 0.204]
WIDTH
THICKNESS
W (± 0.005) MIN./MAX.
0.020
[0.508]
0.050
[1.270]
0.032
[0.813]
0.050
[1.270]
0.053
[1.347]
0.063
[1.601]
0.015
[0.381]
0.015
[0.381]
0.015
[0.381]
0.015
[0.381]
0.025
[0.635]
0.025
[0.635]
TOP PAD
D (± 0.005)
0.012
[0.305]
0.012
[0.305]
0.012
[0.305]
0.016 ± 0.008
[0.407 ± 10.53]
BOTTOM PAD
E (± 0.005)
0.015
[0.381]
0.015
[0.381]
0.015
[0.381]
0.015
[0.381]
SURFACE MOUNT
CHIPS
W
0805
1005
0.020 + 0.005/- 0.010
[0.508 + 0.127/- 0.254]
0.020 + 0.005/- 0.010
[0.508 + 0.127/- 0.254]
L
1206
MECHANICAL SPECIFICATIONS
Resistive Element
Substrate Material
Terminations
Lead (Pb)-free Option
Lead (Pb)-free Finish
Passivated nichrome
Alumina (99.6 %)
Gold or SN 60 solder over nickel barrier
96.5 % Sn, 3.0 % Ag, 0.5 % Cu
Hot solder dip
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: FC1206E1001BBTS (preferred part number format)
F
F
GLOBAL
MODEL
FC
C
C
1
1
CASE
SIZE
0402
0505
0603
0805
1005
1206
2
2
0
0
6
6
E
K
1
1
0
0
0
0
1
0
B
B
T
B
B
S
T
T
S
S
TCR
CHARACTERISTIC
*E
= 25 ppm/°C
H
= 50 ppm/°C
K
= 100 ppm/°C
* > 50
Ω
only
RESISTANCE
The first 3 digits
are significant
figures and the
last digit
specifies the
number of zeros
to follow. “R”
designates the
decimal point.
Example:
10R0 = 10
Ω
1000 = 100
Ω
1001 = 1 kΩ
TOLERANCE
B
= 0.1 %
D
= 0.5 %
F
=1%
G
=2%
J
=5%
TERMINATION
(1, 2 or 3 digits)
T
= Top sided Au (gold) term
Au over Ni
epoxy bondable
RoHS compliant - e4
B
= Wraparound Sn/Pb solder
63 % Sn/37 % Pb
w/ nickel barrier
G
= Wraparound Au over Ni
(gold) termination
epoxy bondable
RoHS compliant - e4
TB
= Top sided Sn/Pb solder
63 % Sn/37 % Pb
w/ nickel barrier
TBS
= Top sided lead
(Pb)-free solder
w/ nickel barrier
RoHS compliant - e1
S
= Wraparound lead
(Pb)-free solder
96.5 % Sn/3.0 % Ag/
0.5 % Cu
RoHS compliant - e1
PACKAGING
BS
= BULK
100 Min 1 Mult
WS
= WAFFLE
100 Min 1 Mult
TAPE AND REEL
T0
= 100 Min 100 Mult
T1
= 1000 Min 1000 Mult
T3
= 300 Min 300 Mult
T5
= 500 Min 500 Mult
TF
= Full Reel
TS
= 100 Min 1 Mult
Historical Part Number example: FC1206E1001BBT (will continue to be accepted)
FC
SERIES
1206
CASE SIZE
E
TCR
CHARACTERISTIC
1001
RESISTANCE
B
TOLERANCE
B
TERMINATION
T
PACKAGING
Document Number: 60093
Revision: 03-Aug-09
For technical questions, contact:
thin-film@vishay.com
www.vishay.com
63
FC
Vishay Thin Film
High Frequency (up to 20 GHz) Surface Mount
Chip Resistors
TYPICAL HIGH FREQUENCY PERFORMANCE ELECTRICAL MODEL AND TESTING
C
Lc
R
L
Lc
C:
Internal shunt capacitance
L:
Internal inductance
R:
Resistance
Lc:
External connection inductance
Cg:
External capacitance to ground
SURFACE MOUNT
CHIPS
Cg
Cg
Lumped Equivalent Circuit
reference plane is at the resistor-bonding pad interface.
The lumped circuit above was used to model the data at the bonding pad-resistor reference plane. High frequency testing was
performed by Modelithics, Inc. on parts mounted to quartz test boards. Quartz test boards were chosen to minimize the
contribution of the board effects at high frequencies. Future testing will be performed on various industry standard board types.
Vishay in partnership with Modelithics, Inc. will develop substrate scalable models for the FC series resistors. These models will
be available for industry standard design software packages and will allow the designer to accurately model their wireless and
microwave printed boards.
INTERNAL IMPEDANCE FOR 0402 FLIP CHIP
1.8
1.6
1.4
1.2
C = 0.0262 pF
L = 0.00189 nH
50
Ω
INTERNAL IMPEDANCE FOR 0603 FLIP CHIP
1.8
1.6
1.4
C = 0.0403 pF
L = 0.0267 nH
50
Ω
|Zin|/R
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
1000
Ω
10
250
Ω
500
Ω
Frequency (GHz)
100
Ω
|Zin|/R
75
Ω
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
1000
Ω
250
Ω
500
Ω
100
Ω
10 Frequency (GHz)
INTERNAL IMPEDANCE FOR 0402 WRAP AROUND
1.8
1.6
1.4
1.2
C = 0.0392 pF
L = 0.1209 nH
50
Ω
75
Ω
|Zin|/R
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1
1000
Ω
10
500
Ω
Frequency (GHz)
100
Ω
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64
For technical questions, contact:
thin-film@vishay.com
Document Number: 60093
Revision: 03-Aug-09
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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