The properly and electrostatically measured taping materials are used for the components, but attention should be paid to the fact that there is some danger the parts absorb on the top
tapes to cause a failure in the mounting and the parts are destructed by static electricity (more than 1kV : 1J, 2A, 2B, 2E 0.5kV : 1E, Human Body Model 100pF 1.5kΩ) to change the
resistance in the conditions of an excessive dryness or after the parts are given vibration for a long time as they are packaged on the tapes. Similarly, care should be given not to apply the
excessive static electricity when mounting on the boards.
●
Ionic impurities such as flux etc. that are attached to these products or those mounted onto a PCB, negatively affect their moisture resistance, corrosion resistance, etc. The flux may
contain ionic substances like chlorine, acid, etc. while perspiration and saliva include ionic impurities like sodium (Na
＋
), chrorine (Cl
−
) etc. Therefore these kinds of ionic substances may
induce electrical corrosion when they invade into the products. Either thorough washing or using RMA solder and flux are necessary since lead free solder contains ionic substances.
Washing process is needed, before putting on moisture proof material in order to prevent electrical corrosion.
●
Please pay attention that the top of an iron does not direct touch to the components. There is a risk that may cause a change in resistance. Take care that another risk may happen that
the protecting coat is carbonized in an instant when touched directly by the top of the iron, also climatic-proof for electric corrosion or insulation of protecting coat may be dropped down.
Be sure not to give high temperature on the top of the iron as it will degrade the protecting coat.
●
Avoid storing components under direct sun rays, high temperature/humidity. Direct sun rays will cause quality change of taping and difficulty of keeping appropriate peeling strength. 5∼
35℃/35∼75%RH, there is no deterioration of solderability for 12 months, but take special care for storing, because condensation, dust, and toxic gas like hydrogen sulfide, sulfurous acid
gas, hydrogen chloride, etc. may drop solderability.
随着阅读器与标签价格的降低和全球市场的扩大，射频标识 RFID(以下简称RFID)的应用与日俱增。标签既可由阅读器供电(无源标签)，也可以由标签的板上电源供电(半有源标签和有源标签)。由于亚微型无源 CMOS 标签的成本降低，库存和其他应用迅速增加。一些评估表明，随着无源标签的价格持续下降，几乎每一个售出产品的内部都将有一个 RFID 标签。由于无源 RFID 标签的重要性及其独特的工程实现...[详细]
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