Best Quality and
Delivery since 1968
Thick Film Division
MINI-SYSTEMS
Precision Components & Services
History of Mini-Systems, Inc. (MSI)
Mini-Systems, Inc. is a leading manufacturer
of precision thick and thin film chip resistors,
capacitors, metal/glass sidewall packages,
custom thick film hybrid circuits, and multi-chip
modules. Since 1968, our commitment to total
quality and responsive customer service has
helped us maintain this leadership status.
MSI is consistently called upon when high
reliability and high performance are required in
a broad range of applications including satellite,
medical, spacecraft, and military. Our parts have
been supplied for programs such as:
❖
❖
❖
❖
❖
❖
❖
❖
F-18
MX
Trident
Patriot
Space Shuttle
Voyager
Mariner
Heart Pacers
Quality
❖
Uncompromising Product Specifications
❖
Process Integrated Quality Assurance
❖
Advanced Testing Equipment and Facilities
Reliability
❖
Established Reliability of QPL Products
to MIL-PRF-55342
❖
Innovative Design Criteria for Maximum
Product Performance
❖
SPC Process Control and Monitoring
Delivery
❖
Consistently the Shortest Available Lead Times
❖
Expedited Delivery Available for Your Critical Needs
❖
Many Standard Products Maintained in Stock
Service
❖
Knowledgeable Sales and Engineering Support
❖
Rapid Response to All Your Questions and Inquiries
❖
Committed to Total Customer Satisfaction
Since our inception, we have known that
understanding customer service and fast
response is the key to building long-lasting
customer relationships. We look forward to giving
you a personal introduction to our company in
the near future.
Expertise
❖
Highly Trained, Dedicated Staff
❖
Extensive Microelectronics Background in
Materials, Assembly, Design, and Testing
❖
Customized Solutions to Your Hybrid
Microelectronics Requirements
Thick Film
ISO 9001
Certified
❖
The WORLD’S FIRST Supplier of QPL/1 & 13, 0502 & 0302 Style Resistors
∑
❖
High Reliability, Precision, Thick Film Chip Resistors and Networks
∑
❖
QPL Approved to MIL-PRF-55342,”T” Space Level Qualified
∑
❖
Surface Mount, Wire Bondable, and Flip Chip Configurations
∑
❖
T and Pi, Low Loss, Chip Attenuators
∑
❖
Standard and Custom, Gold on Ceramic, Jumpers and Standoffs
Wraparound Resistor
Chip
Attenuator
Wire
Bondable Resistor
Mounting Pad
Resistor
Network
MADE IN AMERICA
8022 Rev D 0604
2
What’s ahead...
Ordering MSI Thick Film Parts
Part Numbering System, Case Sizes, Power Ratings, Voltage Ratings,
TCR’s & Electrical Performace Characteristics
4-5
Mini WA / WA Series Resistors
MWA & WA Mechanical Data -Style/Type, Case Size, Length, Width,
Thickness & Pad Width
6-7
Mini HW / HW Series Resistors
MHW & HW Mechanical Data -Style/Type, Case Size, Length, Width,
Thickness & Pad Width
8-9
Mini MSR / MSR Series Resistors
MSR Mechanical Data -Style/Type, Case Size, Length, Width,
Thickness & Pad Width
10-11
QPL Precision Resistors
Top Contact (MSR) & Wrap Around (WA) Descriptions, Part Numbering
System, Electrical & Mechanical Data
12-17
Thick Film Chip Attenuators
Description, Mechanical & Electrical Data & Part Numbering System
18-19
Thick Film Jumpers
Description, Mechanical & Electrical Data & Part Numbering System
20
Mounting Pads And Kits
Thick Film Gold Mounting Pads, Part Numbering System, Jumper &
Mounting Pad Kits
21
Surface Mount Resistor Networks
Description, Mechanical & Electrical Data, Electrical Performance
Characteristics & Part Numbering System
22-23
MSIRP Reliability Program
Samples Being Selected, Applicable Military Standards, Tests
Being Performed & Data From Test Results
24-25
Thick Film Process Capabilities
Products, Applications, Metallizations, Substrates, Testing & Equipment
26-27
Construction of MSI Precision Chip Resistors
Illustration Of The Unique 5 Sided Wrap Around Resistor, Design &
Fabrications Used To Maximize Performance
28
MADE IN AMERICA
8032 Rev A 0604
3
Ordering MSI Thick Film Parts
WA
(Wrap Around)
W
MWA
(Mini Wrap Around)
W
HW
(Half-Wrap)
MSR
(Top Contact)
W
W
T
T
T
T
L
L
L
L
PART NUMBER DESIGNATION
EXAMPLE:
WA81PG-1001F-NS62TR
Style:
WA
Wrap Around, 0502 case size, Platinum Gold base metal, 1KΩ 1% tol.,
Nickel Barrier, Sn62 Solder, Tape & Reel, Std TCR
Style
MWA
MHW
MSR
Type
96
84
66
98
91
10
____________________________________________
WA = Wrap Around
MWA = Mini Wrap Around
HW = Half Wrap
MHW = Mini Half Wrap
MSR = Top Contact
____________________________________________
Case
Size
0201
0202
0203
0302
0303
0404
Case
Size
0402
0502
0503
0504
0505
0603
0604
0805
1002
1005
1010
1206
1210
1218
1505
2010
2307
2512
3939
5024
6632
6645
Power
(Watts)
Voltage
(Volts DC)
0.015
0.020
0.040
0.040
0.040
0.050
Power
(Watts)
20
25
30
30
40
45
Voltage
(Volts DC)
Type:
81
See Table to right
____________________________________________
Termination:
PG
Material:
Base Metal
:
G = Gold
for wire bonding
(MSR only)
PG = Platinum Gold
PS = Palladium Silver
SM = Surface Mount
Style
WA
HW
MSR
Type
20
81
56
19
82
93
61
86
5
83
90
87
94
97
80
88
85
89
68
30
28
26
Base metal determined by value
and TCR (Nickel Barrier required)
____________________________________________
Resistance Value
Four digits (xxxx) with provisions for
five digits (xxxxx) if necessary. The first
three digits represent significant figures.
The last digit represents the number of
zeros to follow. When fractional values of
an ohm are required, the letter "R" is
used as a decimal point.
____________________________________________
Value:
1001
B =
0.10%
H =
3%
P =
25%
C =
0.25%
J =
5%
N =
30%
E =
0.50%
K =
10%
Y =
Max
F =
1%
L =
15%
Z =
Special
G =
2%
M =
20%
____________________________________________
Tolerance:
F
0.040
0.100
0.125
0.100
0.125
0.090
0.125
0.200
0.100
0.250
0.500
0.250
0.550
1.500
0.300
0.800
0.500
2.000
5.000
4.000
8.000
8.000
40
50
80
70
80
90
65
125
175
180
160
190
230
185
300
350
380
475
750
1000
1400
1400
MADE IN AMERICA
Metal Options:
N
B = Back Metal (MSR only)
N = Nickel Barrier
Blank = No Metal Options
____________________________________________
S60 = Sn60
Lead Free Options
S62 = Sn62 S96 = Sn96
S63 = Sn63 CA = CASTIN
U = Untinned
No Solder
NU = Nickel, Gold Plate
____________________________________________
Termination:
S62
Finish:
Option:
TR
TR = Tape and Reel
(Heat seal std)
Pressure seal & Paper tape available
Packaged in chip trays if not specified
TL = Trimless
P =
Optimum TCR otherwise std.
X =
Special Requirements Code
____________________________________________
4
E-mail: msithick@mini-systemsinc.com Web site: http://www.Mini-SystemsInc.com
8031 Rev B 0604
TCR’s for MSI Resistors
TEMPERATURE COEFFICIENT OF RESISTANCE
RESISTANCE RANGE IN OHMS
Type
96
84
66
98
91
10
20
81
56
19
82
93
61
86
5
83
90
87
94
97
80
88
85
89
68
30
28
26
0.1
to < 1
400
300
300
300
100
100
300
100
100
100
100
100
100
100
500
100
100
100
100
200
500
100
500
100
100
200
200
200
1
to < 5
300
100
100
100
100
100
100
100
100
100
100
100
100
100
200
100
100
100
100
100
300
100
300
100
100
100
100
100
5
to < 10
200
100
100
100
100
100
100
100
100
100
100
100
100
100
200
100
100
100
100
100
100
100
100
100
100
100
100
100
10
to < 1 M
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
1M
to < 10M
200
200
200
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
10M
100M
250M
500M
to < 100M to < 250M to < 500M to < 750M
200
300
300
400
200
300
300
400
200
300
300
400
200
300
300
400
100
150
200
300
200
200
200
300
100
300
300
400
100
200
200
300
100
200
200
300
100
150
200
300
100
150
200
300
100
150
200
300
100
150
200
300
100
300
200
300
200
200
200
200
100
150
200
300
100
200
300
400
100
150
200
300
100
200
300
400
200
200
300
400
100
100
100
200
100
150
200
300
100
100
100
200
100
150
200
300
100
200
300
400
100
150
200
300
100
150
200
300
100
150
200
300
750M
to < 1G
400
400
400
400
300
300
400
300
300
300
300
300
300
300
200
300
400
300
400
400
200
300
200
300
400
300
300
300
1. Table list optimal TCR’s, add 200 for standard TCR’s. 2. Optimal TCR’s valid for SM termination, may not be available for all other terminations.
___________________________________________________________
PERCENT OF RATED POWER
Electrical Performance Characteristics
___________________________________________________________
MIL-PRF-55342 Test
MIL-PRF-55342 Requirement MSI Typical
______________________________________________________________
Short Term Overload
±0.25%
±0.03%
High Temperature Exposure
±0.50%
±0.05%
Thermal Shock
±0.50%
±0.07%
Low Temperature Operation
±0.25%
±0.05%
Resistance to Bonding Exposure / Soldering Heat
±0.25%
±0.09%
Moisture Resistance
±0.50%
±0.06%
Stability (Life 70°C 2,000Hrs)
±0.50%
±0.04%
Stability (Life 70°C 10,000Hrs)
±2.00%
±0.07%
______________________________________________________________
Operating temperature range from -55°C to +150°C
POWER DERATING CURVE
110
100
90
80
70
60
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
TEMPERATURE (˚C)
Power rating at 70°C derated linearly to 0% power at 150°C.
(P=E
2
/R)
MADE IN AMERICA
8031 Rev B 0604
5
综合技术交流
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
