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4310K-101-68R0BB

产品描述Array/Network Resistor, Bussed, Thin Film, 0.15W, 68ohm, 50V, 0.1% +/-Tol, -50,50ppm/Cel, 9808,
文件大小198KB,共2页
制造商Bourns
官网地址http://www.bourns.com
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4310K-101-68R0BB概述

Array/Network Resistor, Bussed, Thin Film, 0.15W, 68ohm, 50V, 0.1% +/-Tol, -50,50ppm/Cel, 9808,

4310K-101-68R0BB规格参数

参数名称属性值
是否Rohs认证不符合
Objectid770405191
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL0
构造Molded
JESD-609代码e0
引线长度3.43 mm
引线间距2.54 mm
网络类型Bussed
端子数量10
最高工作温度125 °C
最低工作温度-55 °C
封装高度4.95 mm
封装长度24.99 mm
封装形式SIP
封装宽度2.16 mm
额定功率耗散 (P)0.15 W
电阻68 Ω
电阻器类型ARRAY/NETWORK RESISTOR
系列4300K
尺寸代码9808
技术THIN FILM
温度系数50 ppm/°C
端子面层Tin/Lead (Sn/Pb)
容差0.1%
工作电压50 V

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oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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