Delivering 13.0A and 600V per circuit, the KK
®
396 Reflow
Process Compatible (RPC) Connector System suports a
lead-free solder process and is ideal for low- to mid-power
wire-to-board and board-to-board applications
The KK
®
Reflow Process Compatible (RPC) connector system is designed to
support RoHS lead-free initiatives. Designed with a nylon housing, the wire-to-
board system can withstand temperatures up to +260°C.
KK
®
396
Reflow Process
Compatible (RPC)
Connector System
171813
Vertical Header
171814
Right-Angle Header
Features and Benefits
High-temperature nylon housing
Withstands lead-free high-
temperature solder processing up
to +260°C. Does not require the
drying needs of normal nylon
Support up to 13.0A per circuit.
Ideal for higher power and high-
vibration applications
Prevents mismating
Allows for drop-in replacement on
existing header applications. Mates
with standard KK receptacles
Inhibits tin whiskering
Ensures secure mating between
headers and receptacles
KK
®
396 RPC Vertical
and Right-Angle
Headers with Friction
Lock
Optional MarKK terminal with four
points of contact
Polarized friction-lock header
Standard KK header footprint
design
Matte-tin over nickel plating
PCB receptacles are available in
standard KK
®
connectors
Applications
Consumer
– Home appliances
– Washer/dryer
– Dishwashers
– Fire/smoke detectors
– HVAC
– Gaming
– Coin changers, ATM
– Gaming consoles
– Vending
– Voting machines
Data/Computing and
Telecommunications/Networking
– Scanners/multi-function machines
– Printers
– Workstations
– Mainframes
Medical
– Respirators
– Blood warming bags
Automotive
– Control modules
– Stereos
Medical Equipment
Office Scanner
Home Appliances
Ordering Information
Standard PCB Receptacles
Series No.
41815
2145
Pitch
3.96mm
Application
Board-to-Board
Material
UL 94V-0
UL 94V-2
KK
®
396
Reflow Process
Compatible (RPC)
Connector System
Configurations
Top Entry, Through Hole,
Right-Angle
Standard Crimp Terminals
Series No.
2478
2578
8818
6838
45570
3.96mm
Power
Pitch
Application
Base Material
Phosphor Bronze
Brass
Phosphor Bronze
Copper Alloy
Standard Crimp Housings
Series No.
2139
3069
6442
41695
3.96mm
Wire-to-Board, Power
Pitch
Application
Base Material
Yes
No
Yes
Specifications
Reference Information
Packaging:
Bag; T&R packaging to be released
UL File No.: TBD
CSA File No.: TBD
Mates With:
any KK
®
3.96mm housing or PCB
receptacle
Designed In: Millimeters
RoHS: Yes
Low Halogen: Yes
Glow Wire Compliant: Yes
Electrical
Voltage (max.): 600V
Current (max.): 13.0A
Contact Resistance (max.): 10mΩ
Dielectric Withstanding Voltage:
500V AC (RMS)
Insulation Resistance (min.):
1000MΩ
Mechanical
Contact Insertion Force: 17.8N
Contact Retention to Housing: 36.8N
Mating Force: 10.7N per circuit
Unmating Force: 3.4N per circuit
Durability (min.): 25 cycles
Physical
Housing: High-temperature Nylon
Contact: Brass
Plating:
Contact Area — Matte Tin (Sn) or
Select Gold (Au)
Solder Tail Area — Matte Tin (Sn)
Underplating — Nickel (Ni)
PCB Thickness: 0.062mm
Operating Temperature:
Brass: -40 to +80°C
Phosphor Bronze: -40 to +105°C
www.molex.com/link/kk396.html
Order No. 987650-9461
Printed in USA/KC/2013.08
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