SPST, 4 Func, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 正常位置 | NO/NC |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 100 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 15,-3 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 表面贴装 | NO |
| 最长接通时间 | 70 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-9155201MEA | DG541DN-E3 | DG541DN | 5962-9076401MEX | DG542DN | 5962-9155201MEX | |
|---|---|---|---|---|---|---|
| 描述 | SPST, 4 Func, CDIP16 | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PQCC20, PLASTIC, LCC-20, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PQCC20, PLASTIC, LCC-20, Multiplexer or Switch | IC QUAD 4-CHANNEL, AUDIO/VIDEO SWITCH, CDIP16, CERAMIC, DIP-16, Multiplexer or Switch | IC DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PQCC20, PLASTIC, LCC-20, Multiplexer or Switch | Audio/Video Switch, 2 Func, 1 Channel, NMOS, CDIP16, CERAMIC, DIP-16 |
| 零件包装代码 | DIP | QLCC | QLCC | DIP | QLCC | DIP |
| 针数 | 16 | 20 | 20 | 16 | 20 | 16 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | AUDIO/VIDEO SWITCH | SPDT | AUDIO/VIDEO SWITCH |
| JESD-30 代码 | R-XDIP-T16 | S-PQCC-J20 | S-PQCC-J20 | R-GDIP-T16 | S-PQCC-J20 | R-CDIP-T16 |
| 功能数量 | 4 | 4 | 4 | 4 | 2 | 2 |
| 端子数量 | 16 | 20 | 20 | 16 | 20 | 16 |
| 最大通态电阻 (Ron) | 100 Ω | 60 Ω | 60 Ω | 60 Ω | 60 Ω | 60 Ω |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCJ | QCCJ | DIP | QCCJ | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | NO | YES | NO |
| 最长接通时间 | 70 ns | 70 ns | 70 ns | 70 ns | 100 ns | 70 ns |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | - | 不符合 | - |
| JESD-609代码 | e0 | e3 | e0 | e0 | e0 | - |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | MATTE TIN | TIN LEAD | TIN LEAD | TIN LEAD | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | - |
| 包装说明 | - | QCCJ, | QCCJ, | DIP, | QCCJ, | DIP, |
| 标称负供电电压 (Vsup) | - | -3 V | -3 V | -3 V | -3 V | -3 V |
| 信道数量 | - | 1 | 1 | 4 | 1 | 1 |
| 标称断态隔离度 | - | 60 dB | 60 dB | - | 75 dB | 75 dB |
| 通态电阻匹配规范 | - | 2 Ω | 2 Ω | 6 Ω | 2 Ω | - |
| 标称供电电压 (Vsup) | - | 15 V | 15 V | 15 V | 15 V | 15 V |
| 最长断开时间 | - | 50 ns | 50 ns | 50 ns | 60 ns | 50 ns |
| 技术 | - | NMOS | NMOS | - | NMOS | NMOS |
嵌入式系统
无线连接
单片机
测试/测量
微控制器 MCU
嵌入式系统
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