LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PDSO8, GREEN, PLASTIC, SSOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | SOIC |
| 包装说明 | LSSOP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 2.95 mm |
| 逻辑集成电路类型 | BUFFER |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 7.9 ns |
| 座面最大高度 | 1.3 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 2.8 mm |
| Base Number Matches | 1 |
| SN74LVC3G34DCTR | SN74LVC3G34DCUT | SN74LVC3G34DCUR | SN74LVC3G34YEPR | SN74LVC3G34YZPR | SN74LVC3G34YEAR | SN74LVC3G34DCTRE4 | |
|---|---|---|---|---|---|---|---|
| 描述 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PDSO8, GREEN, PLASTIC, SSOP-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PDSO8, GREEN, PLASTIC, VSSOP-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PDSO8, GREEN, PLASTIC, VSSOP-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, BGA8, DSBGA-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PBGA8, GREEN, DSBGA-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, BGA8, MO-211EB, DSBGA-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT NON-INVERT GATE, PDSO8, GREEN, PLASTIC, SSOP-8 |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | SOIC | SOIC | SOIC | BGA | BGA | DSBGA | SOIC |
| 包装说明 | LSSOP, | GREEN, PLASTIC, VSSOP-8 | VSSOP, | DSBGA-8 | GREEN, DSBGA-8 | MO-211EB, DSBGA-8 | LSSOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-XBGA-B8 | R-PBGA-B8 | R-XBGA-B8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e0 | e0 | e1 | e0 | e4 |
| 长度 | 2.95 mm | 2.3 mm | 2.3 mm | 1.9 mm | 1.9 mm | 1.9 mm | 2.95 mm |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | LSSOP | VSSOP | VSSOP | VFBGA | VFBGA | VFBGA | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 7.9 ns | 7.9 ns | 7.9 ns | 7.9 ns | 7.9 ns | 7.9 ns | 7.9 ns |
| 座面最大高度 | 1.3 mm | 0.9 mm | 0.9 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.3 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 1.8 V | 3.3 V | 1.8 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | TIN LEAD | TIN LEAD | TIN SILVER COPPER | TIN LEAD | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 2.8 mm | 2 mm | 2 mm | 0.9 mm | 0.9 mm | 0.9 mm | 2.8 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 符合 | 符合 | - | 不符合 | 符合 | 不符合 | 符合 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
