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IDT72V51346L7.5BB

产品描述FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
产品类别存储    存储   
文件大小539KB,共57页
制造商IDT (Integrated Device Technology)
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IDT72V51346L7.5BB概述

FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256

IDT72V51346L7.5BB规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码BGA
包装说明17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
针数256
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间4 ns
周期时间7.5 ns
JESD-30 代码S-PBGA-B256
JESD-609代码e0
长度17 mm
内存密度1179648 bit
内存宽度36
湿度敏感等级3
功能数量1
端子数量256
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度3.5 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度17 mm
Base Number Matches1

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3.3V MULTI-QUEUE FLOW-CONTROL DEVICES
(8 QUEUES) 36 BIT WIDE CONFIGURATION
589,824 bits
1,179,648 bits
2,359,296 bits
IDT72V51336
IDT72V51346
IDT72V51356
FEATURES:
Choose from among the following memory density options:
IDT72V51336
Total Available Memory = 589,824 bits
IDT72V51346
Total Available Memory = 1,179,648 bits
IDT72V51356
Total Available Memory = 2,359,296 bits
Configurable from 1 to 8 Queues
Queues may be configured at master reset from the pool of
Total Available Memory in blocks of 256 x 36
Independent Read and Write access per queue
User programmable via serial port
Default multi-queue device configurations
-IDT72V51336: 2,048 x 36 x 8Q
-IDT72V51346: 4,096 x 36 x 8Q
-IDT72V51356: 8,192 x 36 x 8Q
100% Bus Utilization, Read and Write on every clock cycle
166 MHz High speed operation (6ns cycle time)
3.7ns access time
Individual, Active queue flags (OV,
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Provides continuous
PAE
and
PAF
status of up to 8 Queues
Global Bus Matching - (All Queues have same Input Bus Width
and Output Bus Width)
User Selectable Bus Matching Options:
- x36in to x36out
- x18in to x36out
- x9in to x36out
- x36in to x18out
- x36in to x9out
FWFT mode of operation on read port
Packet mode operation
Partial Reset, clears data in single Queue
Expansion of up to 8 multi-queue devices in parallel is available
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
READ CONTROL
WADEN
FSTR
WRADD
WEN
WCLK
6
WRITE CONTROL
RADEN
ESTR
7
Q
0
RDADD
REN
RCLK
OE
x9, x18, x36
DATA IN
Din
Qout
x9, x18, x36
DATA OUT
WRITE FLAGS
READ FLAGS
OV
PR
PAE
8
FF
PAF
PAFn
8
Q
7
PAEn/PRn
5936 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
JUNE 2003
DSC-5936/9

IDT72V51346L7.5BB相似产品对比

IDT72V51346L7.5BB IDT72V51336L7.5BBI IDT72V51336L7.5BB IDT72V51346L7.5BBI IDT72V51346L6BBG IDT72V51356L7.5BBI IDT72V51356L7.5BB IDT72V51356L6BBG IDT72V51336L6BBG
描述 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 16KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 16KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 4ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 16KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
是否Rohs认证 不符合 不符合 不符合 不符合 符合 不符合 不符合 符合 符合
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 BGA, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 BGA, BGA, BGA, BGA, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
针数 256 256 256 256 256 256 256 256 256
Reach Compliance Code compliant compli compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 4 ns 4 ns 4 ns 4 ns 3.7 ns 4 ns 4 ns 3.7 ns 3.7 ns
周期时间 7.5 ns 7.5 ns 7.5 ns 7.5 ns 6 ns 7.5 ns 7.5 ns 6 ns 6 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609代码 e0 e0 e0 e0 e1 e0 e0 e1 e1
长度 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
内存密度 1179648 bit 589824 bi 589824 bit 1179648 bit 1179648 bit 2359296 bit 2359296 bit 2359296 bit 589824 bit
内存宽度 36 36 36 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
端子数量 256 256 256 256 256 256 256 256 256
字数 32768 words 16384 words 16384 words 32768 words 32768 words 65536 words 65536 words 65536 words 16384 words
字数代码 32000 16000 16000 32000 32000 64000 64000 64000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
组织 32KX36 16KX36 16KX36 32KX36 32KX36 64KX36 64KX36 64KX36 16KX36
可输出 YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 225 260 225 225 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 20 20 20 30 20 20 30 30
宽度 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
Base Number Matches 1 1 1 1 1 1 1 1 1
厂商名称 - - - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

 
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