5525 , RoHS-Compliant Commencing With 8/1/2005 Production
Note: all colors and put-ups
This document certifies that the Alpha part number cited above is manufactured in accordance with Directive 2011/65/EU of the European
Parliament, better known as the RoHS Directive (commonly known as RoHS 2), with regards to restrictions of the use of certain hazardous
substances used in the manufacture of electrical and electronic equipment. This certification extends to amending Directive 2015/863/EU which
expanded the list of restricted substances to 10 items (commonly known as RoHS 3) The reader is referred to these Directives for the specific
definitions and extents of the Directives. No Exemptions are required for RoHS Compliance on this item. Additionally, Alpha certifies that the listed
part number is in compliance with China RoHS “Marking for Control of Pollution by Electronic Information Products” standard SJ/T 11364-2014.
Substance
Lead
Mercury
Cadmium
Hexavalent Chromium
Polybrominated Biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE) ,
Including Deca-BDE
Bis(2-ethylhexyl) phthalate (DEHP)
Butyl benzyl phthalate (BBP)
Dibutyl phthalate (DBP)
Diisobutyl phthalate (DIBP)
0.1% by weight (1000 ppm)
0.1% by weight (1000 ppm)
0.1% by weight (1000 ppm)
0.1% by weight (1000 ppm)
0.1% by weight (1000 ppm)
Maximum Control Value
0.1% by weight (1000 ppm)
0.1% by weight (1000 ppm)
0.01% by weight (100 ppm)
0.1% by weight (1000 ppm )
0.1% by weight (1000 ppm)
The information provided in this document and disclosure is correct to the best of Alpha Wire's knowledge, information and belief at the date of its
release. The information provided is designed only as a general guide for the safe handling, storage, and any other operation of the product itself or
the one that it will become part of. The intent of this document is not to be considered a warranty or quality specification. Regulatory information is
for guidance purposes only. Product users are responsible for determining the applicability of legislation and regulations based on their individual
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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